dualFLOW™ and quadFLOW™ Ultra-Cool High-Performance Active Coolers

Advanced Thermal Solutions' dualFLOW and quadFLOW active coolers are designed for dense systems using high-powered processors, including CPUs, FPGAs, or GPUs. Both products include a straight-fin heat sink base with a high-performance blower, which pulls air across the device to maximize cooling. dualFLOW pulls air from two directions while quadFLOW pulls air from four directions to maximize thermal performance even in dense systems where airflow is limited and conventional cooling solutions are ineffective.

dualFLOW and quadFLOW provide at least 20% improvement in thermal performance when compared to other CPU coolers on the market. Both products fit standard Intel™ LGA2011 square or LGA2066 sockets (also known as Socket R). Customers can choose between aluminum or copper fins or a version with a vapor chamber base, depending on the required thermal performance or weight restrictions.

Features

• Ideal for 1U and 2U applications where space and airflow are restricted
• Designed for CPUs that fit the Intel LGA2011 square and LGA2066 sockets (Socket R)
• Mechanical attachment is PEM, screws and spring; for other types of attachments contact ATS
• Provided with Chomerics T670 thermal grease
• Hardware provides 9.2 PSI (63 kPa) when installed
• PWM enabled blower: 10.8 V_DC to 13.2 V_DC operating voltage
• Provides at least 20% improvement over comparable products on the market
• To apply this heat sink to other high-power devices and processors contact ATS
• Patent pending