superGRIP™ Heat Sink Attachment System for Densely Populated PCBs

Heat sink attachment technology was revolutionized when maxiGRIP™, the widely used heat sink attachment system, was introduced in the electronics cooling market. Following the success of maxiGRIP, ATS designed superGRIP in order to better accommodate densely populated PCBs. superGRIP features a plastic frame clip, that fastens securely around the perimeter of a component, and a metal spring clip, which slips through the heat sink’s fin field and locks securely to both ends to the plastic frame. Similar to maxiGRIP, superGRIP is a two component attachment system which quickly and securely mounts heat sinks to a wide range of components, without needing to drill holes in the PCB. The superGRIP assembly applies steady, even pressure to the component throughout the product lifecycle, improving thermal performance and long-term reliability. superGRIP is available with ATS’ maxiFLOW™ heat sinks and straight fin heat sinks in 16 component base sizes, from 17 mm x 17 mm to 45 mm x 45 mm.