Max Clip™ System

Boyd’s Max Clip system is a high performance, low-cost thermal solution for discrete power semiconductors. This thermal system combines Boyd’s Max Clips with specialized extruded Max Clip heat sinks for optimized thermal contact. The system eliminates the need for mounting holes, screws, or rivets while optimizing contact and thermal efficiency of the heat sink. Max Clips are quick, robust attachments that save on labor and hardware costs while increasing design flexibility.

Boyd offers more than 50 standard Max Clip extrusion profiles that feature specialized geometries and groove patterns optimized for use with over 20 different Max Clips to suit a wide range of applications. The Max Clip system is designed to accommodate a variety of semiconductor packages including TO-220, TO-218, TO-247, TO-3P, and packages without mounting holes like TO-262, TO-273, TO-274, and TO-251. As compared to conventional nuts, bolts, and rivets where mounting force is set at the time of assembly and can lessen over the product’s service life, Max Clips enable enhanced long-term reliability.