Webinar – Stick To Fit: Selecting the Right Bonding Solution for Your Electronics Design

Designing tomorrow’s devices today is no small feat. Navigate device design challenges with the right bonding solution that guards against impact or drop events and improves water resistance or bonding to low surface energy substrates. 3M material science helps make your bonded designs a reality, including complex form factors and curved designs of any size and shape with confidence.

Whether it’s a wearable, smart home, or cover glass bonding in smartphones, 3M’s Dennis Ngo, Sr. Application Development Specialist, and Peter Roman, Applications Engineering Specialist, will host this webinar covering the full bonding continuum from ultra-thin pressure-sensitive adhesives (PSA’s) to structural strength adhesives and everything in between. Modeling and simulation capability with deep-rooted material science to push the boundaries of design to assemble the next generation of innovative devices is covered.

The one-hour online webinar takes place on Wednesday, March 20, 2024, at 8 AM CST for APAC participants and again at 10 AM CDT for Amer/EMEA. Even if you are unable to attend the live session, please be sure to register so we can send you a link to the recording when it is complete.

Register here: https://event.on24.com/wcc/r/4505799/11CB7294B0DB15C78B9A868118AF3E6A/5291363?partnerref=blog