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SRV05 Series Datasheet

Littelfuse Inc.

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Datasheet

© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SRV05 Series
Description
Applications
The SRV05 integrates low capacitance rail-to-rail diodes with
an additional zener diode to protect each I/O pin against
ESD and high surge events. This robust device can safely
absorb surge current per IEC61000-4-5 (tP=8/20µs) without
performance degradation and a minimum ±20kV ESD
per IEC61000-4-2. Their very low loading capacitance also
makes them ideal for protecting high speed signal pins.
Features
ESD, IEC61000-4-2,
±20kV contact, ±30kV air
• EFT, IEC61000-4-4, 40A
(5/50ns)
Lightning, IEC61000-4-5,
10A (8/20μs)
Low capacitance of 2pF
(TYP) per I/O
• Low leakage current of
0.5μA (MAX) at 5V
Small SOT23-6 (JEDEC
MO-178) packaging
• LCD/PDP TVs
• Monitors
• Notebooks
• 10/100/1000 Ethernet
• Firewire
• Set Top Boxes
• Flat Panel Displays
• Portable Medical
Pinout
I/O 1
GND
I/O 2
I/O 4
V
CC
I/O 3
Functional Block Diagram
123
654
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
Application Examples
VBUS
VBUS
VBUS
VBUS
D +
D +
D -
D -
GND
GND
CT
RT
RT
RT
RT
CT
CTCT
USB
Port
USB
Port
USB
Controller
VBUS
SRV05-4HTG
USB Dual Port Protection
VCC
10/100
Ethernet
PHY
TX +
TX -
RX +
RX -
VCC
GND
SRV05-4HTG
TX +
TX -
RX +
RX -
Unused
Unused
Unused
RJ45
Unused
To Twisted-Pair Network
75 75 75 75
1
2
3
6
5
4
10/100 Ethernet Differential Protection
VCC
10/100/1000
Ethernet
PHY
TX +
TX -
RX +
RX -
VCC
GND
TX +
TX -
RX +
RX -
Unused
Unused
Unused
RJ45
Unused
To Twisted-Pair Network
75 75 75 75
10/100/1000 Ethernet Protection
SRV05-4HTG
1
2
3
6
5
4
SRV05 Series 6V 10A Diode Array
Additional Information
Datasheet Samples
Resources
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SRV05 Series
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
1Non-repetitive pulse per waveform on page 3
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs)110 A
PPK Peak Pulse Power (tp=8/20μs) 150 W
TOP Operating Temperature –40 to 125 °C
TSTOR Storage Temperature –55 to 150 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
260 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR ≤ 1µA 6.0 V
Reverse Voltage Drop VRIR = 1mA 8.0 V
Reverse Leakage Current ILEAK VR=5V 0.1 0.5 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, I/O to GND28.8 10.0 V
IPP=5A, tp=8/20µs, I/O to GND211. 5 13.0 V
IPP=8A, tp=8/20µs, I/O to GND213.2 15.0 V
Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) 0.7 Ω
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±20 kV
IEC61000-4-2 (Air) ±30 kV
Diode Capacitance1CI/O-GND
Reverse Bias=0V 2.4 3.0 pF
Reverse Bias=1.65V 2.0 pF
Diode Capacitance1CI/O-I/O Reverse Bias=0V 1. 2 pF
Notes: 1 Parameter is guaranteed by design and/or device characterization.
2 Repetitive pulse per waveform on page 3.
Clamping Voltage vs. IPP
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
20.0
1 2 3 4 5 6 7 8 9 10
Peak Pulse Current-IPP (A)
Clamp Voltage (VC )
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SRV05 Series
Pulse WaveformCapacitance vs. Reverse Bias
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DC Bias (V)
Capacitance (pF)
V
CC
=Float
V
CC
=5V
V
CC
=3.3V
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Ordering Information
Part Number Package Marking Min. Order Qty.
SRV05-4HTG SOT23-6 L*4 3000
Part Numbering System Part Marking System
SRV05 4H T G
Series
Number of
Channels
Package
H: SOT23-6
T= Tape & Reel
G= Green
L*4
L * 4
Product Series
L = SRV05Number of Channels
Assembly Site
(Varies)
L = S
(Varies)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SRV05 Series
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
2.0mm
4.0mm
C
L
1.75mm
1.5mm
DIA. HOLE
8mm
4.0mm
8.4mm
180mm
14.4mm
13mm
60mm
ACCESS HOLE
COVER TAPE
USER DIRECTION OF FEED PIN 1
SOT-23 (8mm POCKET PITCH)
Package Dimensions — SOT23-6
Package SOT23-6
Pins 6
JEDEC MO-178
Millimeters Inches Notes
Min Max Min Max
A0.900 1.450 0.035 0.057 -
A1 0.000 0.150 0.000 0.006 -
A2 0.900 1.300 0.035 0.051 -
b0.350 0.500 0.0138 0.0196 -
C0.080 0.220 0.0031 0.009 -
D2.800 3.000 0.11 0.118 3
E2.600 3.000 0.102 0.118 -
E1 1.500 1.750 0.06 0.069 3
e0.95 Ref 0.0374 ref -
e1 1.9 Ref 0.0748 Ref -
L0.100 0.600 0.004 0.023 4,5
N6 6 6
a10º 10º -
M2.590 0.102 -
O0.690 .027 TYP -
P0.990 .039 TYP -
R0.950 0.038 -
O
P
R
M
Recommended Solder Pad Layout
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.

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