Product Index > Connectors, Interconnects > Sockets for ICs, Transistors

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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Dielectric Material Operating Temperature
   
115-93-328-41-001000 Datasheet 115-93-328-41-001000 - Mill-Max Manufacturing Corp. ED58283-ND CONN IC DIP SOCKET 28POS GOLD 1,579 - Immediate Available: 1,579 HK$23.18000 1 Minimum: 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-640-41-001000 Datasheet 110-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90044-ND CONN IC DIP SOCKET 40POS GOLD 2,670 - Immediate Available: 2,670 HK$26.00000 1 Minimum: 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-001000 Datasheet 110-93-640-41-001000 - Mill-Max Manufacturing Corp. ED3640-ND CONN IC DIP SOCKET 40POS GOLD 1,829 - Immediate Available: 1,829 HK$26.17000 1 Minimum: 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-10 Datasheet 40-6518-10 - Aries Electronics A411-ND CONN IC DIP SOCKET 40POS GOLD 1,359 - Immediate Available: 1,359 HK$26.25000 1 Minimum: 1 Bulk? 518 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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828-AG11D-ESL-LF Datasheet 828-AG11D-ESL-LF - TE Connectivity AMP Connectors A121608-ND CONN IC DIP SOCKET 28POS GOLD 1,312 - Immediate Available: 1,312 HK$30.00000 1 Minimum: 1 Tube? 800 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
25-0513-10 Datasheet 25-0513-10 - Aries Electronics A208-ND CONN SOCKET SIP 25POS GOLD 1,915 - Immediate Available: 1,915 HK$30.52000 1 Minimum: 1 Bulk? 0513 Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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40-0518-10 Datasheet 40-0518-10 - Aries Electronics A460-ND CONN SOCKET SIP 40POS GOLD 1,605 - Immediate Available: 1,605 HK$31.11000 1 Minimum: 1 Bulk? 518 Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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299-43-314-10-001000 Datasheet 299-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90137-ND CONN IC DIP SOCKET 14POS GOLD 2,902 - Immediate Available: 2,902 HK$45.26000 1 Minimum: 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8058-1G23 Datasheet 8058-1G23 - TE Connectivity AMP Connectors 1437508-7-ND CONN TRANSIST TO-5 3POS GOLD 2,405 - Immediate Available: 2,405 HK$63.93000 1 Minimum: 1 Bulk? 8058 Active Transistor, TO-5 3 (Round)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold
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Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
12-823-90C Datasheet 12-823-90C - Aries Electronics A805AR-ND CONN IC DIP SOCKET 12POS GOLD 1,348 - Immediate Available: 1,348 HK$65.63000 1 Minimum: 1 Bulk? Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-810-90R Datasheet 14-810-90R - Aries Electronics A116-ND CONN IC DIP SOCKET 14POS TIN 4,018 - Immediate Available: 4,018 HK$70.58000 1 Minimum: 1 Bulk? Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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14-810-90 Datasheet 14-810-90 - Aries Electronics A118-ND CONN IC DIP SOCKET 14POS GOLD 1,899 - Immediate Available: 1,899 HK$71.00000 1 Minimum: 1 Bulk? Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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8060-1G11 Datasheet 8060-1G11 - TE Connectivity AMP Connectors 1437504-4-ND CONN TRANSIST TO-5 3POS GOLD 1,831 - Immediate Available: 1,831 HK$95.98000 1 Minimum: 1 Bulk? 8060 Active Transistor, TO-5 3 (Round)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold
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Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
TDU03DTON Datasheet TDU03DTON - Sullins Connector Solutions S9634-ND CONN SOCKET TRANSIST 3POS GOLD 480 - Immediate Available: 480 HK$116.44000 1 Minimum: 1 Tray?
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Active Transistor 3 (Rectangular)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
24-6554-11 Datasheet 24-6554-11 - Aries Electronics A301AE-ND CONN IC DIP SOCKET ZIF 24POS GLD 230 - Immediate Available: 230 HK$148.91000 1 Minimum: 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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214-3339-00-0602J Datasheet 214-3339-00-0602J - 3M 3M1402-ND CONN IC DIP SOCKET ZIF 14POS GLD 1,107 - Immediate Available: 1,107 HK$159.40000 1 Minimum: 1 Tray? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
28-6554-11 Datasheet 28-6554-11 - Aries Electronics A303-ND CONN IC DIP SOCKET ZIF 28POS GLD 1,158 - Immediate Available: 1,158 HK$161.44000 1 Minimum: 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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220-3342-00-0602J Datasheet 220-3342-00-0602J - 3M 3M2002-ND CONN IC DIP SOCKET ZIF 20POS GLD 783 - Immediate Available: 783 HK$169.54000 1 Minimum: 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND CONN IC DIP SOCKET ZIF 24POS GLD 415 - Immediate Available: 415 HK$171.24000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND CONN IC DIP SOCKET ZIF 16POS GLD 2,038 - Immediate Available: 2,038 HK$171.84000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND CONN IC DIP SOCKET ZIF 40POS GLD 145 - Immediate Available: 145 HK$194.43000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-5248-00-0602J Datasheet 224-5248-00-0602J - 3M 3M5000-ND CONN IC DIP SOCKET ZIF 24POS GLD 132 - Immediate Available: 132 HK$205.51000 1 Minimum: 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
48-6554-11 Datasheet 48-6554-11 - Aries Electronics A309-ND CONN IC DIP SOCKET ZIF 48POS GLD 1,440 - Immediate Available: 1,440 HK$220.17000 1 Minimum: 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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208-7391-55-1902 Datasheet 208-7391-55-1902 - 3M 3M5054-ND CONN SOCKET SOIC 8POS GOLD 351 - Immediate Available: 351 HK$225.54000 1 Minimum: 1 Bulk? Textool™ Active SOIC 8 (2 x 4)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
248-1282-00-0602J Datasheet 248-1282-00-0602J - 3M 3M5004-ND CONN IC DIP SOCKET ZIF 48POS GLD 275 - Immediate Available: 275 HK$244.63000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
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02:24:58 8/18/2019