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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
Unit Price
HKD
Minimum Quantity Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
110-43-640-41-001000 Datasheet 110-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90044-ND 110-43-640-41-001000 CONN IC DIP SOCKET 40POS GOLD 1,554 - Immediate Available: 1,554 HK$26.03000 1 Minimum: 1 Tube 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-001000 Datasheet 110-93-640-41-001000 - Mill-Max Manufacturing Corp. ED3640-ND 110-93-640-41-001000 CONN IC DIP SOCKET 40POS GOLD 1,247 - Immediate Available: 1,247 HK$26.20000 1 Minimum: 1 Tube 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-10 Datasheet 40-6518-10 - Aries Electronics A411-ND 40-6518-10 CONN IC DIP SOCKET 40POS GOLD 1,926 - Immediate Available: 1,926 HK$26.29000 1 Minimum: 1 Bulk 518 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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25-0513-10 Datasheet 25-0513-10 - Aries Electronics A208-ND 25-0513-10 CONN SOCKET SIP 25POS GOLD 657 - Immediate Available: 657 HK$30.55000 1 Minimum: 1 Bulk 0513 Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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40-0518-10 Datasheet 40-0518-10 - Aries Electronics A460-ND 40-0518-10 CONN SOCKET SIP 40POS GOLD 319 - Immediate Available: 319 HK$31.15000 1 Minimum: 1 Bulk 518 Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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508-AG10D Datasheet 508-AG10D - TE Connectivity AMP Connectors A139197-ND 508-AG10D CONN IC DIP SOCKET 8POS GOLD 3,596 - Immediate Available: 3,596 HK$35.33000 1 Minimum: 1 Tube 500 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy
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-55°C ~ 125°C
299-43-314-10-001000 Datasheet 299-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90137-ND 299-43-314-10-001000 CONN IC DIP SOCKET 14POS GOLD 274 - Immediate Available: 274 HK$45.32000 1 Minimum: 1 Tube 299 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8058-1G23 Datasheet 8058-1G23 - TE Connectivity AMP Connectors 1437508-7-ND 8058-1G23 CONN TRANSIST TO-5 3POS GOLD 2,023 - Immediate Available: 2,023 HK$64.01000 1 Minimum: 1 Bulk 8058 Active Transistor, TO-5 3 (Round)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold
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Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
14-810-90R Datasheet 14-810-90R - Aries Electronics A116-ND 14-810-90R CONN IC DIP SOCKET 14POS TIN 3,757 - Immediate Available: 3,757 HK$64.52000 1 Minimum: 1 Bulk Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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12-823-90C Datasheet 12-823-90C - Aries Electronics A805AR-ND 12-823-90C CONN IC DIP SOCKET 12POS GOLD 1,348 - Immediate Available: 1,348 HK$65.72000 1 Minimum: 1 Bulk Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-C182-10 Datasheet 40-C182-10 - Aries Electronics A540-ND 40-C182-10 CONN IC DIP SOCKET 40POS GOLD 118 - Immediate Available: 118 HK$69.90000 1 Minimum: 1 Bulk EJECT-A-DIP™ Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-810-90 Datasheet 14-810-90 - Aries Electronics A118-ND 14-810-90 CONN IC DIP SOCKET 14POS GOLD 1,120 - Immediate Available: 1,120 HK$71.09000 1 Minimum: 1 Bulk Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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8060-1G11 Datasheet 8060-1G11 - TE Connectivity AMP Connectors 1437504-4-ND 8060-1G11 CONN TRANSIST TO-5 3POS GOLD 1,544 - Immediate Available: 1,544 HK$96.10000 1 Minimum: 1 Bulk 8060 Active Transistor, TO-5 3 (Round)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold
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Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
24-6554-11 Datasheet 24-6554-11 - Aries Electronics A301AE-ND 24-6554-11 CONN IC DIP SOCKET ZIF 24POS GLD 170 - Immediate Available: 170 HK$149.10000 1 Minimum: 1 Bulk 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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48-6554-10 Datasheet 48-6554-10 - Aries Electronics A308-ND 48-6554-10 CONN IC DIP SOCKET ZIF 48POS TIN 177 - Immediate Available: 177 HK$153.45000 1 Minimum: 1 Bulk 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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214-3339-00-0602J Datasheet 214-3339-00-0602J - 3M 3M1402-ND 214-3339-00-0602J CONN IC DIP SOCKET ZIF 14POS GLD 714 - Immediate Available: 714 HK$159.60000 1 Minimum: 1 Tray Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
220-3342-00-0602J Datasheet 220-3342-00-0602J - 3M 3M2002-ND 220-3342-00-0602J CONN IC DIP SOCKET ZIF 20POS GLD 683 - Immediate Available: 683 HK$169.76000 1 Minimum: 1 Bulk Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND 224-1275-00-0602J CONN IC DIP SOCKET ZIF 24POS GLD 562 - Immediate Available: 562 HK$171.46000 1 Minimum: 1 Tube Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND 240-1280-00-0602J CONN IC DIP SOCKET ZIF 40POS GLD 161 - Immediate Available: 161 HK$194.68000 1 Minimum: 1 Tube Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
2201838-1 Datasheet 2201838-1 - TE Connectivity AMP Connectors A120591-ND 2201838-1 CONN SOCKET LGA 2011POS GOLD 266 - Immediate Available: 266 HK$218.92000 1 Minimum: 1 Bulk
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Active LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
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208-7391-55-1902 Datasheet 208-7391-55-1902 - 3M 3M5054-ND 208-7391-55-1902 CONN SOCKET SOIC 8POS GOLD 186 - Immediate Available: 186 HK$225.83000 1 Minimum: 1 Bulk Textool™ Active SOIC 8 (2 x 4)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
248-1282-00-0602J Datasheet 248-1282-00-0602J - 3M 3M5004-ND 248-1282-00-0602J CONN IC DIP SOCKET ZIF 48POS GLD 175 - Immediate Available: 175 HK$244.95000 1 Minimum: 1 Tube Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
MS03 Datasheet MS03 - Apex Microtechnology 598-1384-ND MS03 CONN TRANSIST TO-3 8POS GOLD 409 - Immediate Available: 409 HK$248.36000 1 Minimum: 1 Bulk Apex Precision Power® Active Transistor, TO-3 8 (Oval)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200.0µin (5.08µm) Brass Polyester, Glass Filled
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216-7224-55-1902 Datasheet 216-7224-55-1902 - 3M 3M5077-ND 216-7224-55-1902 CONN SOCKET SOIC 16POS GOLD 309 - Immediate Available: 309 HK$251.35000 1 Minimum: 1 Bulk Textool™ Active SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
2-2129710-5 Datasheet 2-2129710-5 - TE Connectivity AMP Connectors A124406-ND 2-2129710-5 CONN SOCKET LGA 3647POS GOLD 237 - Immediate Available: 237 HK$258.77000 1 Minimum: 1 Tray
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Active LGA 3647
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Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder
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-
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Copper Alloy Thermoplastic
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Results per Page
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00:06:25 12/9/2019