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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
Unit Price
HKD
Minimum Quantity Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
1050281001 Datasheet 1050281001 - Molex WM6827TR-ND 1050281001 CONN CAM SOCKET 32POS GOLD 46,274 - Immediate Available: 46,274 HK$7.72736 800 Minimum: 800 Tape & Reel (TR)
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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1050281001 Datasheet 1050281001 - Molex WM6827CT-ND 1050281001 CONN CAM SOCKET 32POS GOLD 46,274 - Immediate Available: 46,274 HK$13.50000 1 Minimum: 1 Cut Tape (CT)
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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1050281001 Datasheet 1050281001 - Molex WM6827DKR-ND 1050281001 CONN CAM SOCKET 32POS GOLD 46,274 - Immediate Available: 46,274 Digi-Reel® 1 Minimum: 1 Digi-Reel®
Alternate Packaging
105028 Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
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216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND 216-3340-00-0602J CONN IC DIP SOCKET ZIF 16POS GLD 1,270 - Immediate Available: 1,270 HK$172.28000 1 Minimum: 1 Tube Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
48-6554-11 Datasheet 48-6554-11 - Aries Electronics A309-ND 48-6554-11 CONN IC DIP SOCKET ZIF 48POS GLD 1,444 - Immediate Available: 1,444 HK$220.73000 1 Minimum: 1 Bulk 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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A 08-LC-TT Datasheet A 08-LC-TT - Assmann WSW Components AE9986-ND A 08-LC-TT CONN IC DIP SOCKET 8POS TIN 30,296 - Immediate Available: 30,296 HK$1.54000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
A 14-LC-TT Datasheet A 14-LC-TT - Assmann WSW Components AE9989-ND A 14-LC-TT CONN IC DIP SOCKET 14POS TIN 55,158 - Immediate Available: 55,158 HK$1.88000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
A 18-LC-TT Datasheet A 18-LC-TT - Assmann WSW Components AE9995-ND A 18-LC-TT CONN IC DIP SOCKET 18POS TIN 18,037 - Immediate Available: 18,037 HK$2.31000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
ED281DT Datasheet ED281DT - On Shore Technology Inc. ED3050-5-ND ED281DT CONN IC DIP SOCKET 28POS TIN 10,698 - Immediate Available: 10,698 HK$2.82000 1 Minimum: 1 Tube ED Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
AR 08 HZL-TT Datasheet AR 08 HZL-TT - Assmann WSW Components AE10011-ND AR 08 HZL-TT CONN IC DIP SOCKET 8POS TIN 20,774 - Immediate Available: 20,774 HK$4.27000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
4814-3004-CP Datasheet 4814-3004-CP - 3M 3M5474-ND 4814-3004-CP CONN IC DIP SOCKET 14POS TIN 8,672 - Immediate Available: 8,672 HK$4.36000 1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4808-3004-CP Datasheet 4808-3004-CP - 3M 3M5473-ND 4808-3004-CP CONN IC DIP SOCKET 8POS TIN 7,933 - Immediate Available: 7,933 HK$4.36000 1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4816-3000-CP Datasheet 4816-3000-CP - 3M 3M5463-ND 4816-3000-CP CONN IC DIP SOCKET 16POS TIN 6,921 - Immediate Available: 6,921 HK$4.36000 1 Minimum: 1 Tube 4800 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
SA163000 Datasheet SA163000 - On Shore Technology Inc. ED3016-ND SA163000 CONN IC DIP SOCKET 16POS GOLD 3,439 - Immediate Available: 3,439 HK$6.41000 1 Minimum: 1 Tube SA Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
110-43-308-41-001000 Datasheet 110-43-308-41-001000 - Mill-Max Manufacturing Corp. ED90032-ND 110-43-308-41-001000 CONN IC DIP SOCKET 8POS GOLD 8,309 - Immediate Available: 8,309 HK$6.58000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-308-41-001000 Datasheet 110-93-308-41-001000 - Mill-Max Manufacturing Corp. ED3308-ND 110-93-308-41-001000 CONN IC DIP SOCKET 8POS GOLD 4,516 - Immediate Available: 4,516 HK$6.58000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
08-3518-10 Datasheet 08-3518-10 - Aries Electronics A400-ND 08-3518-10 CONN IC DIP SOCKET 8POS GOLD 3,888 - Immediate Available: 3,888 HK$6.58000 1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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AR 14 HZL-TT Datasheet AR 14 HZL-TT - Assmann WSW Components AE10012-ND AR 14 HZL-TT CONN IC DIP SOCKET 14POS TIN 4,883 - Immediate Available: 4,883 HK$6.75000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS 044-Z-SM Datasheet A-CCS 044-Z-SM - Assmann WSW Components AE11107-ND A-CCS 044-Z-SM IC SOCKET PLCC 44POS TIN SMD 18,937 - Immediate Available: 18,937 HK$7.01000 1 Minimum: 1 Tube
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
AR 16 HZL-TT Datasheet AR 16 HZL-TT - Assmann WSW Components AE10013-ND AR 16 HZL-TT CONN IC DIP SOCKET 16POS TIN 9,009 - Immediate Available: 9,009 HK$7.69000 1 Minimum: 1 Tube
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Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS 032-Z-SM Datasheet A-CCS 032-Z-SM - Assmann WSW Components AE11105-ND A-CCS 032-Z-SM IC PLCC SOCKET 32POS TIN SMD 8,853 - Immediate Available: 8,853 HK$7.69000 1 Minimum: 1 Tube
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Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
08-0518-10 Datasheet 08-0518-10 - Aries Electronics A774AR-ND 08-0518-10 CONN SOCKET SIP 8POS GOLD 1,600 - Immediate Available: 1,600 HK$8.46000 1 Minimum: 1 Bulk 518 Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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A-CCS 044-Z-T Datasheet A-CCS 044-Z-T - Assmann WSW Components 123-A-CCS044-Z-T-ND A-CCS 044-Z-T CONN SOCKET PLCC 44POS TIN 8,877 - Immediate Available: 8,877 HK$8.72000 1 Minimum: 1 Tube
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
110-13-308-41-001000 Datasheet 110-13-308-41-001000 - Mill-Max Manufacturing Corp. ED56083-ND 110-13-308-41-001000 CONN IC DIP SOCKET 8POS GOLD 2,697 - Immediate Available: 2,697 HK$10.08000 1 Minimum: 1 Tube 110 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
08-3518-00 Datasheet 08-3518-00 - Aries Electronics A777AR-ND 08-3518-00 CONN IC DIP SOCKET 8POS GOLD 5,163 - Immediate Available: 5,163 HK$10.43000 1 Minimum: 1 Bulk 518 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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09:51:54 11/19/2019