LTST-C193KRKT-5A Datasheet by Lite-On Inc.

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LITEIO] l I“ D oProELEcTHoNIcs
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
Product Data Sheet
LTST-C193KRKT-5A
Spec No. :DS22-2005-077
Effective Date: 04/21/2017
Revision: B
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Features
* Meet ROHS.
* Extra thin (0.35H mm) Chip LED.
* Ultra Bright AlInGaP Chip LED.
* Package In 8mm Tape On 7" Diameter Reels.
* EIA STD package.
* I.C. compatible.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared Reflow Solder Process.
Package Dimensions
Part No. Lens Source Color
LTST-C193KRKT-5A Water Clear AlInGaP Red
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.
Part No. : LTST-C193KRKT-5A Page : 1 of 12
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Absolute Maximum Ratings At Ta=25
Parameter LTST-C193KRKT-5A
Unit
Power Dissipation 50 mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width) 40 mA
DC Forward Current 20 mA
Reverse Voltage 5 V
Operating Temperature Range -30°C to + 85°C
Storage Temperature Range -40°C to + 85°C
Infrared Soldering Condition 260°C For 10 Seconds
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LITE[0] l |® 10 SEC. MAX. 255 - 260 0C a 3 °CISEC. MAX.\ * """""""""""" ‘\ 6 °CISEC. MAX. TEMPERATURE N O O r? 3 °CISEC. MAX. 60 - 120 SEC.A 60 SEC. MAX. > TIME
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Suggestion Profile:
Suggestion IR Reflow Profile For Pb Free Process
Part No. : LTST-C193KRKT-5A Page : 3 of 12
BNS-OD-C131/A4
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Electrical Optical Characteristics At Ta=25
Parameter Symbol
Part No.
LTST-
Min. Typ. Max. Unit Test Condition
Luminous Intensity IV
C193KRKT-5A
7.1 - 45.0 mcd IF = 5mA
Note 1
Viewing Angle 2θ1/2
C193KRKT-5A
130 deg Note 2 (Fig.5)
Peak Emission Wavelength
λP
C193KRKT-5A
639 nm Measurement
@Peak (Fig.1)
Dominant Wavelength λd
C193KRKT-5A
631 nm IF = 5mA
Note 3
Spectral Line Half-Width Δλ
C193KRKT-5A
20 nm
Forward Voltage VF
C193KRKT-5A
1.70 - 2.30 V IF = 5mA
Reverse Current IR
C193KRKT-5A
10 μA VR = 5V
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.
4. Caution in ESD:
Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic
glove when handling the LED. All devices, equipment and machinery must be properly grounded.
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Bin Code List
Part No. :
LTST-C193KRKT-5A Page : 5 of 12
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Forward Voltage Unit: V @5mA
Bin Code Min. Max.
E2 1.70 1.90
E3 1.90 2.10
E4 2.10 2.30
Tolerance on each Forward Voltage bin is +/-0.1 volt
Luminous Intensity Unit : mcd @5mA
Bin Code Min. Max.
K 7.1 11.2
L 11.2 18.0
M 18.0 28.0
N 28.0 45.0
Tolerance on each Intensity bin is +/-15%
LITE[O] i |® Relalive lnlensiiy Rolallvo Luminous IMamlfy Normnlhld al ZOmA '. Forward Voltage Vr (V) Fig.2 forward Curreni vs. Forward Voliago b 'o P an P o 9 - I .° N ‘/ a D 5 10 IS 20 25 30 Forward Cunani (mA) Fig.4 Raloiive Luminous Iniensiiy vs. Forward Currenl Rod 1.0 0.5 4 400 450 sou 550 500 550 no War-long"! A (rim) Fig.1 Relolive Inlensiiy vs. Wavelength w . so A .' 3 25 r 3. so : 20 ' : a) g E a 15 5 so E .0 E 20 E i \\ .2 5 .2 10 \NP 1.; 1.5 1.7 1.9 2,1 2,3 2.5 2,7 on 20 40 so so 100 Ambleni Tempero‘iure T ('C) fig.3 Forward Curran! A Dorailng Cum Fig.5 Spuilal Dislribuflon
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Typical Electrical / Optical Characteristics Curves
(25 °C Ambient Temperature Unless Otherwise Noted)
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Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for
less one minute.
Suggest Soldering Pad Dimensions
Notes:
1. Suggest stencil thickness is maximum 0.10mm.
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
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Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-5000 pieces per reel.
3. Minimum packing quantity is 500 pcs for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481 specifications.
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Part No. : LTST-C193KRKT-5A Page : 9 of 12
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The package is sealed:
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within
one year, while the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within 672hrs
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than 672hrs should be baked at about 60 deg C for
at least 20 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering Soldering iron
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Soldering notes:
Because different board designs use different number and types of
devices, solder pastes, reflow ovens, and circuit
boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper
guidelines and
PCB-specific characterization.
LITE-ON Runs both component-level verification using in-house
KYRAMX98
reflow chambers and
board-level assembly.
The results of this testing are verified through post-reflow reliability testing.
Profiles used at LITE-
ON are based on JEDEC standards to ensure that all packages can be successfully and
reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards.
You can use this example as a generic target to set up your reflow process.
You should adhere to the JEDEC profile limits as well as specifications and recommendat
ions from the solder
paste manufacturer to avoid damaging the device and create a reliable solder joint.
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Part No. : LTST-C193KRKT-5A Page : 10 of 12
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5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low
forward voltage, orno lightup ” at low currents.
To verify for ESD damage, check forlightupand Vf of the suspect LEDs at low currents.
The Vf of “ goodLEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP
product.
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7. Reliability Test
Classification
Test Item
Test Condition Reference Standard
Endurance
Test
Operation Life Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5,RH= 9095%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B
JIS C 7021:B-11
High Temperature
Storage
Ta= 105±5
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008
JIS C 7021:B-10
Low Temperature
Storage
Ta= -55±5
*Test Time=1000HRS (-24HRS,+72H RS)
JIS C 7021:B-12
Environmental
Test
Temperature
Cycling
105 25 -55 25
30mins 5mins 30mins 5mins
10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4
Thermal
Shock
IR-Reflow In-Board, 2 Times
85 ± 5 -40 ± 5
10
in
10mins 10 Cycles
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011
Solder
Resistance
T.sol= 260 ± 5
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A
MIL-STD-750D:2031
JIS C 7021:A-1
IR-Reflow
Pb Free Process
Ramp-up rate(217 to Peak) +3 / se cond max
Temp. maintain at 175(±25) 180 seconds max
Temp. maintain above 217 60-150 seconds
Peak temperature range 260 +0/-5
Time within 5°C of actual Peak Temperature (tp)
10~30 seconds
Ramp-down rate +6 /second max
MIL-STD-750D:2031.2
J-STD-020D
Solderability
T.sol= 235 ± 5
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage 95% of the dipped surface
MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
JIS C 7021:A-2
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
Part No. : LTST-C193KRKT-5A Page : 11 of 12
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9. Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel
strap or conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
Part No. : LTST-C193KRKT-5A Page : 12 of 12
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