IRLML2402PbF Datasheet by Infineon Technologies

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International IEER Rectitier Standard Pack -7 “G 2014 tnlernationat Rectifier
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
A customized leadframe has been incorporated into the
standard SOT-23 package to produce a HEXFET Power
MOSFET with the industry's smallest footprint. This
package, dubbed the Micro3, is ideal for applications
where printed circuit board space is at a premium. The low
profile (<1.1mm) of the Micro3 allows it to fit easily into
extremely thin application environments such as portable
electronics and PCMCIA cards.
VDSS = 20V
RDS(on) = 0.25Ω
HEXFET® Power MOSFET
Description
lGeneration V Technology
lUltra Low On-Resistance
lN-Channel MOSFET
lSOT-23 Footprint
lLow Profile (<1.1mm)
lAvailable in Tape and Reel
lFast Switching
lLead-Free
lRoHS Compliant, Halogen-Free
Parameter Max. Units
ID @ TA = 25°C Continuous Drain Current, VGS @ 4.5V 1.2
ID @ TA = 70°C Continuous Drain Current, VGS @ 4.5V 0.95 A
IDM Pulsed Drain Current 7.4
PD
@TA = 25°C Power Dissipation 540 mW
Linear Derating Factor 4.3 mW/°C
VGS Gate-to-Source Voltage ± 12 V
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ, TSTG Junction and Storage Temperature Range -55 to + 150 °C
Absolute Maximum Ratings
Parameter Typ. Max. Units
RθJA Maximum Junction-to-Ambient  230
Thermal Resistance
°C/W
D
S
G
3
1
2
Micro3
IRLML2402PbF
Form Quantity
IRLML2402TRPbF Micro3
(SOT-23) Tape and Reel 3000 IRLML2402TRPbF
Package Type
Standard Pack
Orderable Part NumberBase Part Number
1 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 24, 2014
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2 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 24, 2014
IRLML2402PbF
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 20   V VGS = 0V, ID = 250µA
ΔV(BR)DSS/ΔT
JBreakdown Voltage Temp. Coefficient  0.024  VC Reference to 25°C, ID = 1mA
  0.25 VGS = 4.5V, ID = 0.93A
  0.35 VGS = 2.7V, ID = 0.47A
VGS(th) Gate Threshold Voltage 0.70   V VDS = VGS, ID = 250µA
gfs Forward Transconductance 1.3   S VDS = 10V, ID = 0.47A
  1.0 VDS = 16V, VGS = 0V
  25 VDS = 16V, VGS = 0V, TJ = 125°C
Gate-to-Source Forward Leakage   -100 VGS = -12V
Gate-to-Source Reverse Leakage   100 VGS = 12V
QgTotal Gate Charge  2.6 3.9 ID = 0.93A
Qgs Gate-to-Source Charge  0.41 0.62 nC VDS = 16V
Qgd Gate-to-Drain ("Miller") Charge  1.1 1.7 VGS = 4.5V, See Fig. 6 and 9
td(on) Turn-On Delay Time  2.5  VDD = 10V
trRise Time  9.5  ID = 0.93A
td(off) Turn-Off Delay Time  9.7  RG = 6.2Ω
tfFall Time  4.8  RD = 11Ω, See Fig. 10
Ciss Input Capacitance  110  VGS = 0V
Coss Output Capacitance  51  pF VDS = 15V
Crss Reverse Transfer Capacitance  25  = 1.0MHz, See Fig. 5
Ω
µA
nA
ns
IGSS
IDSS Drain-to-Source Leakage Current
RDS(on) Static Drain-to-Source On-Resistance
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
ISContinuous Source Current MOSFET symbol
(Body Diode) showing the
ISM Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
VSD Diode Forward Voltage   1.2 V TJ = 25°C, IS = 0.93A, VGS = 0V
trr Reverse Recovery Time  25 38 ns TJ = 25°C, IF = 0.93A
Qrr Reverse RecoveryCharge  16 24 nC di/dt = 100A/µs
Source-Drain Ratings and Characteristics
A
  7.4
  0.54
S
D
G
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
ISD 0.93A, di/dt 90A/µs, VDD V
(BR)DSS,
TJ 150°C
Notes:
Pulse width 300µs; duty cycle 2%.
Surface mounted on FR-4 board, t 5sec.
©2014‘memanona‘Recnfier
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IRLML2402PbF
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.01
0.1
1
10
100
0.1 1 10
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
20μs PULSE WIDTH
T = 25°C
A
VGS
TOP 7.5V
5.0V
4.0V
3.5V
3.0V
2.5V
2.0V
BOTTOM 1.5V
1.5V
J
0.01
0.1
1
10
100
0.1 1 10
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
VGS
TOP 7.5V
5.0V
4.0V
3.5V
3.0V
2.5V
2.0V
BOTTOM 1.5V
1.5V
20μs PULSE WIDTH
T = 150°C
J
0.01
0.1
1
10
1.5 2.0 2.5 3.0 3.5 4.0
T = 25°C
T = 150°C
J
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
A
V = 10V
20μs PULSE WIDTH
DS
0.0
0.5
1.0
1.5
2.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
A
V = 4.5V
GS
I = 0.93A
D
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IRLML2402PbF
Fig 7. Typical Source-Drain Diode
Forward Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 8. Maximum Safe Operating Area
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
0
40
80
120
160
200
1 10 100
C, Capacitance (pF)
DS
V , Drain-to-Source Voltage (V)
A
V = 0V, f = 1MHz
C = C + C , C SHORTED
C = C
C = C + C
GS
iss gs gd ds
rss gd
oss ds gd
C
iss
C
oss
C
rss
0
2
4
6
8
10
0.0 1.0 2.0 3.0 4.0
G
GS
Q , Total Gate Charge (nC)
FOR TEST CIRCUIT
SEE FIGURE 9
V , Gate-to-Source Voltage (V)
I = 0.93A
V = 16V
D
DS
0.01
0.1
1
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4
T = 25°C
T = 150°C
J
J
V = 0V
GS
V , Source-to-Drain Voltage (V)
I , Reverse Drain Current (A)
SD
SD
A
0.1
1
10
100
1 10 100
V , Drain-to-Source Voltage (V)
DS
I , Drain Current (A)
OPERATION IN THIS AREA LIMITED
BY R
D
DS(on)
T = 25°C
T = 150°C
Single Pulse
100μs
1ms
10ms
A
A
J
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IRLML2402PbF
V
DS
90%
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig 10a. Switching Time Test Circuit
Fig 10b. Switching Time Waveforms
VDS
4.5V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
RD
VGS
VDD
RG
D.U.T.
+
-
Fig 9a. Basic Gate Charge Waveform
D.U.T. V
DS
I
D
I
G
3mA
V
GS
.3μF
50KΩ
.2μF
12V
Current Regulator
Same Type as D.U.T.
Current Sampling Resistors
+
-
Q
G
Q
GS
Q
GD
V
G
Charge
4.5V
Fig 9b. Gate Charge Test Circuit
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
0.1
1
10
100
1000
0.00001 0.0001 0.001 0.01 0.1 1 10 100
Notes:
1. Duty factor D = t / t
2. Peak T = P x Z + T
1 2
JDM thJA A
P
t
t
DM
1
2
t , Rectangular Pulse Duration (sec)
Thermal Response (Z )
1
thJA
0.01
0.02
0.05
0.10
0.20
D = 0.50
SINGLE PULSE
(THERMAL RESPONSE)
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6 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 24, 2014
IRLML2402PbF
Fig 12. For N-Channel HEXFETS
P.W. Period
di/dt
Diode Recovery
dv/dt
Ripple 5%
Body Diode Forward Drop
Re-Applied
Voltage
Reverse
Recovery
Current
Body Diode Forward
Current
VGS=10V
VDD
ISD
Driver Gate Drive
D.U.T. ISD Waveform
D.U.T. VDS Waveform
Inductor Curent
D = P. W .
Period
+
-
+
+
+
-
-
-
* VGS = 5V for Logic Level Devices
Peak Diode Recovery dv/dt Test Circuit
RG
VDD
dv/dt controlled by RG
Driver same type as D.U.T.
ISD controlled by Duty Factor "D"
D.U.T. - Device Under Test
D.U.T Circuit Layout Considerations
Low Stray Inductance
Ground Plane
Low Leakage Inductance
Current Transformer
*
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IRLML2402PbF
Micro3 (SOT-23 / TO-236AB) Part Marking Information
Micro3 (SOT-23) (Lead-Free) Package Outline
Dimensions are shown in millimeters (inches)
0.08
0.88
0.01
0.89
0.95 B SC
MI L L IME T E R S
MIN
e
E
E1
D
L
A
A1
A2
c
M
O
B
S
Y
MI NMAX MAX
.036
.0375 B SC
DIME NS IONS
INCHES
b0.30
bbb
0.15
.008
ccc .006
0.25 BS CL1
L 0.40 0.60
.0118 B SC
aaa
0.20
.004
0° 8°
2.80
1.20
0
E1
E
D5
6
3
12 ccc C B A
B5
6
e
e1
A2
A
A1
bbb C A B
3X b aaa C
3 S URF 0
3X L
L1
H4
7
2.10
e1 1.90 B SC .075 B SC
.0119
.0032
.111
.083
.048 .055
.119
.103
.0196
.0078
.0039
.044
.0004
.035 .040
.0236.0158
1.02
0.20
0.50
2.64
3.04
1.40
1.12
0.10
0.10
1.90
[.075]
0.95
[.0375]
0.972
[.038]
2.742
[.1079]
0.802
[.031]
R E COMME NDE D F OOT PRINT
3X
3X
NOT E S
1. DIMENS IONING AND T OL E R ANCING PE R ASME Y14.5M-1994.
4 DATUM PLANE H IS LOCATED AT THE MOLD PARTING LINE.
5 DAT U M A AND B T O B E DE T E R MI N E D AT DAT U M PL AN E H.
6 DI ME NS I ON S D AND E 1 AR E ME AS U R E D AT DAT U M P L ANE H .
2. DIMENSIONS ARE SHOWN IN MILLIMETERS AND INCHES.
3. CONTROLL ING DIMENSION: MIL LIMETER.
7 DIMENS ION L IS THE LEAD LENGTH FOR SOLDERING T O A S UBSTRATE.
8. OUT LINE CONFORMS T O JEDE C OU T LI NE T O- 236AB.
F = IRLML6401
A2001 A27
Notes: This part marking information applies to devices produced after 02/26/2001
ASSEMBLY LOT CODE
LEAD-FREE
DATE CODE
E = IRLML6402
X = PART NUMBER CODE REFERENCE :
D = IRLML5103
C = IRLML6302
B = IRLML2803
A = IRLML2402
W = (1-26) IF PRECEDED BY LAST DIGIT OF CALENDAR YEAR
W = (27-52) IF PRECEDED BY A LETTER
Y
82008
32003
12001
YEAR
2002 2
52005
2004 4
2007
2006
7
6
2010 0
2009 9
YEAR Y
C03
WORK
WEEK
01
02
A
W
B
04 D
24
26
25
X
Z
Y
WORK
WEEK W
H = IRLML5203
G = IRLML2502
K
H
G
F
E
D
C
B
2006
2003
2002
2005
2004
2008
2007
2010
2009 J
Y51
29
28
30
C
B
D
50 X
I = IRLML0030
J = IRLML2030
L = IRLML0060
M = IRLML0040
K = IRLML0100
N = IRLML2060
P = IRLML9301
R = IRLML9303
Cu WIRE
HALOGEN FREE
PART NUMBER
52 Z
DATE CODE EXAMPLE:
YWW = 432 = DF
YWW = 503 = 5C
2018
2013
2011
2012
2015
2014
2017
2016
2020
2019
2018
2013
2011
2012
2015
2014
2017
2016
2020
2019
W = IRFML8244
V = IRLML6346
U = IRLML6344
T = IRLML6246
S = IRLML6244
Y = IRLML2246
X = IRLML2244
Z = IRFML9244
Note: For the most current drawing please refer to IR website at http://www.irf.com/package
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IRLML2402PbF
Micro3Tape & Reel Information
Dimensions are shown in millimeters (inches)
2.05 ( .080 )
1.95 ( .077 )
TR
FEED DIRECTION
4.1 ( .161 )
3.9 ( .154 )
1.6 ( .062 )
1.5 ( .060 ) 1.85 ( .072 )
1.65 ( .065 )
3.55 ( .139 )
3.45 ( .136 )
1.1 ( .043 )
0.9 ( .036 )
4.1 ( .161 )
3.9 ( .154 ) 0.35 ( .013 )
0.25 ( .010 )
8.3 ( .326 )
7.9 ( .312 )
1.32 ( .051 )
1.12 ( .045 )
9.90 ( .390 )
8.40 ( .331 )
178.00
( 7.008 )
MAX.
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package
IEZR Ouallflcaflon lMormallon Comm NSLt (De JEDECJVSTDVOZOD ) Roi-is compiam Yes International IEER Rectitier fr} 2014 tntemationat Rectifier
9 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback April 24, 2014
IRLML2402PbF
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
MS L 1
(per JEDEC
J-S T D-020D
††
)
RoHS compliant
Yes
Qualification information
Qualification level
Cons umer
(per JEDEC JESD47F
††
guidelines)
Moisture Sensitivity Level Micro3 (SOT-23)
† Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability
†† Applicable version of JEDEC standard at the time of product release
Revision History
Date Comment
Updated data sheet with new IR corporate template.
Updated package outline & part marking on page 7.
Added Qualification table -Qual level "Consumer" on page 9.
Added bullet point in the Benefits "RoHS Compliant, Halogen -Free" on page 1.
4/24/2014

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