Analog Imaging Logic cat. Datasheet by Toshiba Semiconductor and Storage

Leading lnnovat ))))))

http://www.semicon.toshiba.co.jp/eng

SEMICONDUCTOR & STORAGE PRODUCTS

Semiconductor Catalog 2012-2

Analog & Imaging IC

Logic LSI

TOSHIBA Leading Innovation 3)

Analog & Imaging IC / Logic LSI

Sensing Input I Omput Comvol

Digital

Processing

Image Sensor

(Camera)

Audio

Input / Output

Power

Management Wireless

Connect

ISP Audio

Processing

Wired

Connect

Interface &

Bridges

Memory/

Storage

Interface

Image & Video

Processing

Sensing

Input / Output

Control

Connectivity

Wireless :

Near Field / Proximity

Wired :

High Speed

Serial Link

Smart Power

Sensing &

Control

LED

Driver

Motor Control

LED Drive

Power Management

Smart Interface

CMOS Image Sensor

Wireless

MCU

LED Driver

ASIC

Digital TV

Motor Control Driver

Audio

Automotive

Text to Speech

Power Management

Digital Processing

Mobile Peripheral Device

• TransferJet is a trademark of SONY Corporation.

• "FeliCa" is a trademark of SONY Corporation.

• Bluetooth is a trademark owned by Bluetooth SIG, Inc. and is used by Toshiba Corporation under license.

• MIPI is a licensed trademark of MIPI, Inc. in the U.S. and other jurisdictions.

• HDMI is a trademark of HDMI Licensing, LLC.

• ARM, ARM Cortex, ARM7, ARM9, ARM7TDMI, ARM7TDMI-S, SC100, ARM926EJ-S, ARM946E-S, ARM968E-S, ARM1026EJ-S,

ARM1136EJ-S, ARM1156T2F-S, ARM1176JZF-S, ARM11 MPCore, NEON and Thumb are trademarks or registered trademarks of ARM

Limited in the EU and other countries.

• NANO FLASH is a trademark of Toshiba Corporation.

• Blu-ray is a trademark of the Blu-ray Disc Association.

• WiMAX is a trademark of the WiMAX Forum.

• Wi-Fi is a registered trademark of Wi-Fi Alliance®.

• ToSpeak is a trademark of Toshiba Corporation.

• Dolby is registered trademarks of Dolby Laboratories.

• DTS and dts are trademarks or registered trademarks of DTS, Inc.

• PCI Express is a registered trademark of PCI-SIG.

• iPod, iPhone are trademarks of Apple Inc., registered in the U.S. and other countries.

• MediaLB is a registered trademark of Standard Microsystems Corporation.

• APIX is a trademark or registered trademark of Inova Semiconductors Inc.

Contents

1. CMOS Image Sensor 1 7. LED Driver 13

2. Mobile Peripheral Device 3 8. Power Management 14

3. Wireless 5 9. Audio 15

4. MCU 7 10. Automotive 17

5. ASIC 9 11. Motor Control Driver 21

6. Digital TV 11 12. Text To Speech Middleware 24

FSI BSI

FSI : Front Side Illumination

BSI : Back Side Illumination

Photo

Diode

Photo

Diode

-1 -

CMOS Image Sensor

Business Field

Pixel Performance Summary

BSI Technology

Mobile

Phones

PC Cameras

Smart

Phones

Surveillance

Cameras

Automotive

Cameras

DVC

DSC

Example of Image Sensor Applications

Extensive Line up: VGA - 14M pixel ,

3M - 12M pixel, Bright 1.75m

One Stop Solution ( Die/ CSP/ Camera Module )

Designed for various application like Mobile Phone,

DSC, PC, Automotive Camera and Surveillance

Camera

CSP : Chip Scale Package

Bright technology : process technology with next generation

pixel size’s technology

For high image quality , Toshiba has been developing

BSI advanced technology (optimized process and design).

And we have realized 1.12 m pixel CMOS image sensor

using this BSI technology and 65nm process.

Pixel technology SNR10 Sensitivity Well capacity Dynamic range

Bright 1.75m 65 lx 737 mV/lx-sec 5810 e 60 dB

1.4m 99 lx 590 mV/lx-sec 5300 e 59 dB

1.4m BSI 70 lx 590 mV/lx-sec 5300 e 60 dB

Bright 1.4m BSI (60 lx) (590 mV/lx-sec) (5700 e) (60 dB)

1.12m BSI (<100 lx) (500 mV/lx-sec) (4000 e) (60 dB)

( ): Target performance

SNR10: 3200K, ES 15fps&1V suitability

Sensitivity: 540nm monochromatic light, AGx1

Well capacity: 5100K

Dynamic range: 0lx, AGx1

Improved image quality in low light condition by BSI technology

Fine pixel size (1.12m)

65nm process

BSI advanced technology

High image quality

• High sensitivity

• Low noise

High resolution

High frame rate

Low Z height of camera module

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Lineup

Module

Die ～5M Die/Package 8M～

T8EL6 T8EX2 T8EV3 T8ET5 T8EV5

MP MP MP MP

Under

Development

1/10" 1/5" 1/3.2" 1/4" 1/4"

VGA 2M 5M 5M 5M

2.2 1.75 1.75 1.4 1.4

SOC SOC CIS CIS SOC

FSI FSI FSI FSI FSI

640(H)

×480(V)

1600(H)

×1200(V)

2592(H)

×1944(V)

2608(H)

×1960(V)

2592(H)

×1944(V)

1080P - - 15fps - 13fps(YUV),

30fps(Jpeg )

720P - - 30fps - 30fps(YUV),

60fps(Jpeg )

VGA - 30fps 60fps 60fps 100fps

Parallel 10bit 10bit (possible

10bit) 10bit 8bit

Serial - - CSI-2, 2lane CSI-2/2lane CSI-2, 1lane

VDIG 1.7 to 1.9V 1.7 to 1.9V 1.7 to 1.9V 1.7 to 1.9V 1.7 to 1.9V

VANA 2.6 to 3.0V 2.6 to 3.0V 2.6 to 3.0V 2.6 to 3.0V 2.6 to 3.0V

1.7 to 1.9V

2.6 to 3.0V

1.7 to 3.0V 1.7 to 3.0V

I/F

Power

supply

IO 1.7 to 3.0V 1.7 to 3.0V

Products

7.5fps(YUV),

20fps(Jpeg )

FSI/BSI

Type

Status

Optical size

Resolution

Pixel size[µm]

SOC/CIS

Pixel number

Frame

rate

Full 30fps 15fps 15fps15fps

T8ER4 T8EV4 T8ES7 T4K04 T4K05 TCM5101CL

1/2.5" 1/3.2" 1/2" 1/3.2" 1/4" 1/2.3"

8M 8M 12M 8M 8M 14M

1.75 1.4 1.75 1.4 1.1 1.4

CIS CIS CIS CIS CIS CIS

FSI FSI FSI BSI BSI BSI

3280(H)

×2464(V)

3280(H)

×2464(V)

4016(H)

×3016(V)

3280(H)

×2464(V)

3280(H)

×2464(V)

4400(H)

×3316(V)

Full 7.5fps 15fps 5fps 30fps 30fps 15fps

1080P 10fps 30fps(crop) 30fps 60fps(crop) 60fps(crop) 60fps

720P 30fps 60fps 50fps 60fps 60fps 60fps

VGA 60fps 120pfs(crop) 70fps 120fps 180fps 140fps

Parallel 10bit 10bit 10bit N/A N/A N/A

Serial CSI-2,2lane

CCP2

CSI-2,2lane

CCP2

CSI-2,2lane

CCP2 CSI-2, 4lane CSI-2, 4lane

CSI-2, 4lane

Sub-LVDS,

8ch

VDIG 1.7 to 1.9V 1.7 to 1.9V 1.7 to 1.9V 1.7 to 1.9V 1.7 to 1.9V 1.1 to 1.3V

2.8 to 3.0V

2.6 to 3.0V

1.7 to 1.9V 2.6 to 3.0V

Or Or

2.6 to 3.0V 1.65 to 1.95V

2.6 to 3.0V 2.6 to 3.0V

IO 1.7 to 1.9V 1.7 to 3.0V 1.7 to 1.9V 1.7 to 1.9V

2.3 to 2.9V 2.6 to 3.0V 2.3 to 2.9V

Pixel number

Products

Type

Status MP MP

Frame

rate

I/F

Power

supply

Resolution

Pixel size[µm]

SOC/CIS

FSI/BSI

VANA

Under

Development

Under

Development

Under

Development

Optical size

TCM9001MD TCM8500MD TCM9313MD

MP MP MP

1/10" 1/10" 1/4"

VGA VGA 3.2M

2.2 2.2 1.75

SOC CIS CIS

FSI FSI FSI

640(H)

×480(V)

640(H)

×480(V)

2056(H)

×1544(V)

Full 30fps 30fps 15fps

1080P - - -

720P - - -

VGA---

Parallel 8bit - -

Serial - CCP2 RAW8 CCP2

VDIG 1.7 to 1.9V 1.7 to 1.9V 1.7 to 1.9V

VANA 2.6 to 3.0V 2.4 to 2.9V 2.4 to 2.9V

Products

Type

Status

Optical size

Pixel size[µm]

Power

supply

Resolution

1.7 to 3.0V -

SOC/CIS

FSI/BSI

Pixel number

Frame

rate

I/F

-2 -

1.75 µm 1.1 µm

1st Gen. 1st Gen. 2nd Gen. 3rd Gen.

2nd Gen. (90 nm) (65 nm) (BSI) (BSI)

(Bright)

12 MP+

8 MP

5 MP

3 MP

2 MP

2.2 µm

1.4 µm

VGA

Available Under

Development

Pixels

Resolution

Mobile Peripheral Device

Toshiba MPD (Mobile Peripheral Device) is designed for extending interfaces of a host processor to connect various

peripherals and external devices. Interface bridges, Display buffers, IOExpanders and memory interface devices are the

lineup of MPDs. MPD enable users to use the latest peripheral on a system.

BluetoothTM

Wi-Fi

GPS

System component

Application

Processor

Memory

Baseband

Power

management

USB

Sensors

Display

Buffer/Bridge

Camera

Bridge

Key/Port Cntl.

Video Input

Memory

Controller

LED

HDMITM

CSI2

SDXC / UHS-I

Parallel/CSI2

DSI/DP/LVDS

I2C

Toshiba Interface bridge MPD supports various interface combination to connect different interfaces between a host

processor and peripherals. MIPI-DSI, MIPI-CSI, MDDI, DisplayPort, LVDS, HDMI and several parallel interfaces

shown in the table are supported. In addition to Interface bridge, Toshiba Display buffer MPD supports various display

interface standardizations with a buffer memory.

OVERVIEW

INTERFACE BRIDGE

ES Available MPUnder Development

OUT

MDDI DSI DPI

(RGB)

DBI‐B

(MPU) CSI Parallel

Cam‐I/F LVDS Display

Port

MDDI TC358761

TC358760 TC358721/23(RAM)

DSI TC358762 TC358764

TC358765

TC358767

TC358770

TC358766

DPI(RGB)

TC358761

TC358763

TC358768

DBI‐B

(MPU)

TC358761

TC358763

CSI TC358740

Parallel

8bit

TC358740

Parallel

Cam‐I/F TC358746

HDMI TC358743

-3 -

UHS-l "j <:>. UHS-I <3:> Roadma Ian

A high-capacity memory device is being required for

supporting a high speed network and huge amount of

information. And a new standard is necessary to support

them. Toshiba SDXC host controller enables users to use

the latest memory standard on a system.

Memory

Sub System

20122011 2013

UHS-II SDXC

CPRM/CPXM

UHS-II SDXC

USB3.0

SATA/PCI-Ex

UHS-I SDXC

SATA/PCI-Ex UHS-II SDXC

SATA/PCI-Ex

UHS-I SDXC

USB2.0

CPRM/CPXM

For PC

For Mobile Phone

UHS-I SDXC

USB3.0

CPRM/CPXM

UHS-II/UFS SDXC

USB3.0

CPRM/CPXM

Roadmap (plan)

TC358780XBG

TOSHIBA

SDXC

Host Controller

SDIO UHS-I

TC35893XBG TC35894XBG TC35894FG TC35895WBG

GPIO Max 20 ports Max24ports Max24ports Max20ports

Keymatrix Max96keys Max 96keys Max 96keys Max96 keys

PWM Max3ch. Max 3ch. Max3ch. Max3ch.

Packagetype BGA25 BGA36 QFP44 WLCSP25

Packagesize 3.0mmx3.0mm 3.5mmx3.5mm 10mmx10mm 2.05mm x2.05mm

Pinpitch 0.5mm 0.5mm 0.8mm 0.4mm

IO Expander supports general purpose I/Os, a key detection and PWMs function. A host processor controls these

functions via an I2C interface so a host processor can reduce its workload to get a key code from a keyboard and to

control PWM. Application fields of IO Expander are various such as digital camera, tablet PC, cam coder, facsimile,

electronic dictionary, game and etc.

Host

Processor

I2C 2-wire

8x12=96 keys max

3ch max.

Key Detection control

20/24 port max

LED

Sensors/

Switches

PWM

GPIO

Key Matrix

Reduce workload

of host processor Additional port

control Standalone PWM control

TC358780XBG

Function

SDXC up to 2TByte

High speed read/write (UHS-I)

CPRM support

Package

5.0mm x 5.0mm

0.5mm pitch

64pin BGA

ES: Available

MP: Available

Availability

Host

Processor

SDXC host controller with CPRM function

IO Expander

Feature

2 x UHS-I channels

UHS-I

TC358780XBG

UHS-I SDXC

CPRM

-4 -

Wireless

Product Development Concept

Feedback customer voices and latest wireless standard to new product development by engineers of skill in various

wireless technologies such as Bluetooth, Wi-Fi, Digital Terrestrial Broadcasting Demodulator, RKE, and “FeliCa” IC

Technology

Wireless design capability

System design technology for maximizing RF and Baseband total performance

High interoperability quality including recovery design for abnormal protocol sequence

RFCMOS design capability

Very high receiving sensitivity for wide temperature range

Layout design knowhow for reducing spurious noise

Low power consumption design technology for

mobile application

Security technology and on-chip NVM

process technology

Design technology for Automotive quality

Production

RFCMOS process and manufacturing

technology by own fab.

Low power consumption

Tamper resistant

Communication quality improvement

Contribution on standardizations

ISDB-T Demodulator (TC90527) DTMB Demodulator (TC90508)

Digital Terrestrial Broadcasting Demodulator

ISDB-T Demodulation

•Fully compliant with ARIB-B31

High Integration

•Built-in A/D converter

•Built-in memory for de-interleaver

•Built-in PLL circuit for clock generator

Excellent Receiving Performance

•Excellent receiving performance under multipath

condition with original algorithm

•Low required C/N (realizing high sensitivity)

•Support diversity reception (2 ICs needed)

Interface

•Support Low IF and IQ input

•Parallel and serial TS output

•I2C

Low Power Consumption

•94mW (typ.) MP

Available

DTMB Demodulation

•Fully compliant with GB20600-2006

High Integration

•Built-in A/D converter

•Built-in memory for de-interleaver

•Built-in PLL circuit for clock generator

Excellent Receiving Performance

•Excellent receiving performance under multipath

condition with original algorithm

•Low required C/N (realizing high sensitivity)

Interface

•Support 36MHz IF, Low IF, and IQ input

•Parallel and serial TS output

•I2C

Low Power Consumption

•260mW (typ.)

ADC OFDM demod.

Memory

Diversity function

I2C

FEC

PLL

ES: Available

MP: Apr. 2012

3G/LTE

Cloud

Wi-Fi

TransferJetTM

NFC

Wireless

Power

Personal Connectivity

GPS

RKE

Body Area Network

Bluetooth Low Energy

802.15.4 / 6

GPS

ETC

Automotive

Wi-Fi

Broadcasting

Digital Demodulator

ADC DTMB demod.

Memory I2C

FEC

PLL

-5 -

; ,,,,,,,,,,,,,,,,,,, , --E E UART 5 -E II“? a: %_= ______ l—l ___________ —-— Q L 'EEII ----.- II- I .I-

Bluetooth V4.0 EDR + LE

Remote Keyless EntryTransferJetTM

Mobile “FeliCa”

Bluetooth Core Spec.

•Support V4.0, EDR+LE (Dual Mode)

RF Block

•Support Class2

•Very high RX sensitivity (-95dBm)

•On chip Balun, ANT SW, LNA

Baseband Block

•High performance by ARM7TDMI®

•On chip Mask ROM, Patch RAM

Interface

•High Speed UART, SPI, USB2.0 (FS), I2C, I2S/PCM

•Wi-Fi Coexistence 2/3/4 wire

•Support Wake-Up Signal from/to Host CPU

Low Power Consumption

•Dynamic (DH5, UART=2Mbps)：30mA (typ.)

•Sleep：20A (typ.)

ES: Available

MP: Apr. 2012

Demodulator：FSK, OOK (ASK)

Data Rate：600bps-10kbps

Multiband：315MHz/434MHz/868MHz/915MHz

Multi Channel

•Fractional PLL

•Frequency step 5KHz

Selectable IF Filter Band Width

•2band selectable BW=260/320KHz, IF=280/230KHz

Very Short Latency

•Built-in high speed digital comparator

High RX Sensitivity

•-116dBm@IFBW=320KHz, -117dBm@IFBW=260KHz

Low Power Consumption

•RX 9.7mA (FSK), TX 12mA@+10dBm output power

•BS：0A (typ.)

Control Interface：SPI (4wire) , EEPROM ES: Available

MP: Mar. 2012

System Function

• Card emulation, Reader/Writer function support

• Compliant with Mobile “FeliCa”

• Data rate：212kbps/424kbps

• Mobile “FeliCa” / Japan Railways Group (JR) certified

Contactless Frontend

• Built-in analog and Modulation/demodulation circuit compliant

with “FeliCa”

• Built-in Null point deletion system

• Phase recovery circuit

• Modulation and Switch circuit (SW1, SW2)

• Control ports of external circuit for adjusting resonance

frequency

• HOST interface：UART

Secure Element

•CPU：ARM SC100TM (Secure Core)

• “FeliCa” OS support

•NV：EEPROM with Error Correction Circuit

•CC：EAL4+ approved

UART

Analog

RX/TX “FeliCa”

modem

I/F

Contactless Frontend Secure Element

AFE

I/F

CPU

MaskROM

E2PROM

SRAM

Available

T6ND5

USB2.0(FS)

Mask ROM

UART/SPI

PCM/I2S

I2C

JTAG

Wi-Fi Coex

SRAM GPIO

ARM7TDMI®

CLK Gen.

EDR/LE

modem

Flash ROM IF

RF Block

TC35661

LNA RF

ADC

DAC

PHY CNL SDIO

Device

(UHS-I)

SPI VCO PLL Power

Management

TC35420

LNA MIXER IF

FILTER demod. Data

comparator

Divider Fractional

PLL

SPI

VCO

TC32306FTG

ADC

ES: Available

MP: May. 2012

Single Chip Solution

•RF and digital baseband are implemented into monolithic

Built-in RF Components

•RF switch, matching circuit, LNA

Very High Speed HOST I/F

•SDIO interface supporting UHS-I (104MByte/s)

Very High RX Sensitivity

•-78dBm (Rate65)

Small Package

•4.0 x 4.0 x 0.5mm LGA (Ball pitch 0.4mm)

-6 -

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MCU (32-Bit Microcontrollers)

Toshiba has been expanding its portfolio of application-specific standard products (ASSPs) that combine an ARM

CortexTM-M3 core, which features high performance, high code density and low power consumption, with a Toshiba-

original NANO FLASHTM memory, which features high-speed programming and low power consumption. With Toshiba’s

wide range of low-cost ARM CortexTM-M3 core-based ASSP offerings covering 8-bit to 32-bit, you can find the optimum

solutions for your applications. Our product portfolio includes ASSPs specifically designed for digital TV, digital audio and

motor applications, kitchen and home appliances, as well as industrial, office and automotive applications.

The TX03 microcontroller series embeds an ARM CortexTM-M3 core, which provides high code density and fast interrupt response

times required for real-time applications. The TX03 Series also incorporates a Toshiba-proprietary NANO FLASHTM memory featuring

high capacity and low power consumption.

TX03 Series

M370 Group M380 Group

Features

Toshiba-original vector engine (VE)

Single 5-V supply operation with high market demands

System solutions that combine an MCU with motor drivers

Small package (7 x 7 mm LQFP48)

Application examples

Washing machines, air conditioners, refrigerators, heat pumps,

inverter-motor-controlled equipment

On-chip vector engine

Features

Multi-purpose timers for motor and IGBT control

Single 5-V supply operation with high market demands

System solutions that combine an MCU with various peripheral

ICs

Application examples

Air conditioners, refrigerators, electric oven-grills, rice cookers,

induction cooktops

Multi-purpose timer for IGBT control

Product Groups with a 5-V Supply

M370 M380

PLL/CG

RTC

16bit Timer

Debug

WDT

OFD

12bit A/D

GPIO

RMC

FLASH

I2C/SIO

SIO/UART

SSP

PMD/Encoder

AMP/CMP

RAM DMA

MPT

ARM

CortexTM-M3

PLL/CG

RTC

16bit Timer

ARM

CortexTM-M3

FLASH

RAM

12bit A/D 1

GPIO

SIO/UART

Debug

WDT

Vector Engine

Encoder

AMP/CMP

OFD

PMD2

PMD1

12bit A/D 2

-7 -

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Features

Dedicated controller compliant with HDMITM 1.3a (CEC)

Remote control signal preprocessor essential for digital

consumer electronics

Application examples

Digital TVs, projectors, Blu-rayTM recorders, AV systems, printers,

home appliances, factory equipment, office equipment

Product Groups with a 3-V Supply

M330 Group Power-Saving modes CEC Controller

Features

High-accuracy analog control interface

Small package (6 x 6 mm TFBGA113)

High-resolution PPG ideal for motor control

Application examples

DVCs, DSLR cameras, camera lens controllers

Features

Large-capacity Flash memory

Multiple serial interfaces (exp. CAN/USB/EtherMAC)

Multi-purpose timer for Motor and IGBT control

Application examples

Printers, AV systems, digital appliances, PC peripherals,

industrial equipment, network equipment, office equipment

M340 Group

M360 Group

High-resolution PPG

Multiple serial interfaces

Features

Power-saving modes for 1.8-V operation

High-speed on-chip oscillator

Small package (6 x 6 mm TFBGA120)

Application examples

Power supply monitors, battery-operated devices, remote-controlled

equipment, game consoles, AV systems

M390 Group 1.8-V operation

Features

USB host controller

System solutions that combine an MCU and an audio DSP

Application examples

Car and home audio systems

M320 Group USB-Host

M369

M330

PLL/CG

RTC

16bit Timer

FLASH

RAM

10bit A/D

GPIO

I2C/SIO

SIO/UART

CEC

RMC

Debug

WDT

ARM

CortexTM-M3

PLL/CG

RTC

16bit Timer

FLASH

12bit A/D

GPIO

I2C/SIO

SIO/UART

Debug

WDT

CAN

USB

EtherMAC

10bit D/A

RMC

MPT/PMD

SSP

RAM DMA

ARM

CortexTM-M3

PLL/CG

RTC

16bit Timer

FLASH

12bit A/D

I2C/SIO

SIO/UART

SSP

GPIO

Debug

WDT

10bit D/A

2-Phase

Pulse Counter

RAM DMA

ARM

CortexTM-M3

PLL/CG

RTC

16bit Timer

FLASH

RAM

10bit A/D

GPIO

I2C/SIO

SIO/UART

CEC

RMC

Debug

WDT SSP

OFD

ARM

CortexTM-M3

PLL/CG

16bit Timer

10bit A/D

GPIO

I2C/SIO

SIO/UART

Debug

WDT

RAM

eDRAM

SSP

USB Host

SD Host

Ext BUS

ARM

CortexTM-M3

Note 1 : There are microcontrollers that do not contain some of the peripherals shown.

For details, see appropriate datasheet.

Note 2 : Contains either analog circuitry for motor control or a 12-bit AD converter.

Note 3 : Contains a Consumer Electronics Control (CEC) unit, a remote control signal

preprocessor or an I2S interface.

Note 4 : Ultrasonic motor controller

Note 5 : 9 x 9 mm or smaller packages

Functions

CortexTM-M3 core

High-speed writing by NANO-FlashTM technology

On-chip debug function

ETM (embedded trace macro cell)

Except some microcontrollers in the M370 Group

Watchdog timer

Common Functions

Added Functions(Note 1)

-8 -

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ASICs

To ensure competitiveness in the marketplace, one needs to produce more sophisticated, more technology-intensive and

higher value-added products, using a process of technological innovation and systematic marketing. Toshiba’s

application-specific integrated circuits (ASICs) will give you an edge beyond your expectations. You can select from gate

arrays that feature short turnaround times; cell-based ICs that are suitable for increased system integration and

aggressive performance goals; and embedded arrays and universal arrays that combine high-performance functions of

cell-based ICs with the gate array advantage of quick turnaround.

Benefits

High-level Design Approaches

Comprehensive ASIC Capabilities from

Design to Manufacture Various Design Interface Levels from ASIC

to COT-based Design

Toshiba provides a number of customer interface levels.

You can select your level of design participation to push

your design to optimal performance and make the best

use of your in-house capabilities. You can involve with us

as early or as late as you choose, at a variety of levels in

the sequence of ASIC development, such as initial

specification development; RTL design and verification;

gate-level design; place-and-route; and prototyping.

CortexTM-A9CortexTM-A9 CortexTM-A15CortexTM-A15 ARM CortexTM-A9 Processor

Toshiba has a lot of experiences of the high speed design like as the Cell processor. Toshiba realizes the design of

GHz or more by using an original cell development technology and the unique design methodologies.

ARM®POP

-9 -

owes... .m... m. . mum... lrom mm... under . New» mm... mm ARM In! ARM comx'" zone , 0.34!!! Wu Mum 0.1% mm mm 65ml! 40ml! Run 1600 Cell-Based ICE ‘2” ' “mu. . . . .. . . Appllcalmn Processors ..._ @@%®®®®@® 750 , , , , , ~ 77’9”“! pm?) »»v.av.s.uney name ARM" «nae. deve‘ﬂvmem Anmmsd 5" "WW” .. con-I'M" Gale Arrays g m ARMwﬁEJ-S". ( ‘AmnsarzF-s" .“MW‘F E Amnzsm- “- / O , . ARMQwE-S" Amwzs‘" @® Embedded Arrays Embeddsd Prom-or: znn UnlversalArrays “FWDMW Mlcroconlrollm Comm mum. . / Ina , , , ,, , High Pm Count and High Speed PEG! . 3D High Densdy LOFP TOW F-BGA Sylhm In M19: . v . PIFBGA E%! Q 4 Q QT... Mvmamvizalmn (Small and mm am wcsp "(Gm \' N... v SCSlEnE

Lineup

Toshiba’sASICoffersgatearraysthatfeatureshort

turnaroundtimes;cell‐basedICsthataresuitablefor

increasedsystemintegrationandaggressiveperformance

goals;andembeddedarraysanduniversalarraysthat

combinehigh‐performancefunctionsofcell‐basedICswith

thegatearrayadvantageofquickturnaround.Youcan

chooseanASICtechnologythatbestsuitsyourscheduleand

designobjective.

Product Lineup

Packaging

Packagerequirementsvarywitheachapplicationsystemin

whichASICsareincorporated.Tosatisfyallapplication

needs,Toshibaoffersabroadrangeofpackagingoptions,

basedonsmall‐form‐factorandlightweight,low‐profile,

high‐pin‐count,high‐speedandthermaldissipation

technologies.

IP Lineup

WhileASICdesignsarebecomingincreasinglymore

complex,itisrequiredtoshortentheirtime‐to‐market.To

addresssuchsituations,Toshibaoffersvariouspreverified

IP,suchasprocessors,digitalandanalogIP fortheinterface.

Link

(Controller) 90nm 65nm 40nm

Serial ATA (1.5/3.0Gbps)

Serial ATA (6.0Gbps)

HDMI

Source (1.485Gbps)

HDMI

Source (2.97Gbps)

HDMI

Sink (2.2275Gbps)

HDMI

Sink (2.97Gbps)

DDR2 (~667Mbps)

DDR2 (~800Mbps)

LPDDR21 (~667Mbps)

LPDDR2 (~800Mbps)

DDR32 (800~1333Mbps)

DDR32 (1066~1600Mbps)

MIPI

D-PHY

MIPI

M-PHY

SD/SDIO Ver.2 HOST

SD/SDIO Ver.3 HOST (UHS-I)

UHS-II

PHY

USB2.0 Host/Device (480Mbps)

USB3.0 Host/Device (5Gbps)

PCI Express

RC/EP (2.5Gbps)

PCI Express

RC/EP (8.0Gbps)

PCI Express

RC/EP (5.0Gbps)

Host : Available

OTG :

Available

Device :

Available

Available Available Available

Available

AvailableAvailableAvailable

Host :

Available

Device :

Available

Root :

Available

Endpoint :

Available

Root : ~1Q/2012

Endpoint : ~1Q/2012 ~1Q/2012

Root : ~1Q/2012

Endpoint : ~1Q/2012 ~1Q/2012

Host : Available Available Available Available

Host : ~1Q/2012 ~1Q/2012

Rev.1.4 : Available

Available Available Available

~1Q/2012

Available Available

Available Available Available

Customization

Available

~2Q/2012

Available Available

~1Q/2012

Available Available Available

~1Q/2012

Customization

- 10 -

ba offers total sululions [or a wide range cf applications from lradiliunal anal Systalll Cpnlrul Secllnn LCD Panel /, urglul Dlgllal Video/Audio processors 0r BackllQhE Tuner Demo. PDP ﬂ urgiral nrgmal 'RISC 0"“ Panel I/F Tuner Demo. -Demux -Overd!ive LED , . -Tcnl| . Am" Video Decade .LED BIL Dnvals -Eackend Proc. Comm! Analog 'Aﬂdh new"? "luminance Power Tune' IPeriphelals 5mm Devices nglmellnmon Englne Pinure-Gualiiy HDMIAD HDMI-IIF V‘d .n‘pﬁfﬁ' (SWCEQ mcu Memory FRC usa '"‘e'"e‘* SWi‘C" . lnlsmsl Audiu ' WP Usa—> ”a mmlmerlanes culpul N Expander i Power Supply Secllon Inﬁrared visible Transmmer LED LED Is Power Power Managemem Supply

Digital TV

The evolution of television services knows no bounds. High-definition TV broadcasting provides outstanding picture and

sound quality. Standard-definition broadcasting offers multichannel program and various data services, as well as

television services for cell phones and moving vehicles such as automobiles. Additionally, we have Internet Protocol

television (IPTV) services that provide a mixture of TV and Internet content, LED-backlit televisions, 3D televisions and

so on. They are now used to enjoy pictures and videos from digital cameras, to record hours of TV programs and to

send information bidirectionally via the Internet connection. Televisions are increasingly becoming more like “multimedia

home stations.” Toshiba offers total solutions for a wide range of applications from traditional analog TVs to state-of-the-

art digital TVs.

Digital TV SoC Roadmap

HEM

MID

LEM

2010 2011 2012 2013

TC90432MBG

TC90455XBG

•ISDB-T/S

•HDMI 3ch

•HDMI 1.4

•3D FE

•ISDB-T/S

•HDMI 3ch

•Low Power Dispassion

5th Generation

for IPTV / 3D-TV

4th Generation

for FHD LCD-TV

•ARM x3

•3D GPU

•H.264, Divx HD

•HDMI 1.4

•10Bit Video processing

•Double window

•HDMI1.3 Deep-color

•H.264/VC1

•Low Power Dispassion

TC90417AXBG TC90417BXBG

TC904xx

6th Generation

for SmartTV

APP

Planning

- 11 -

SIPDIF mm / HD Elh'm“ 4—» Mservel Nam. (awn-Puma.- 4—. LAN Full compliance with GB 20600-2006 mulilpafh nieceptlon'performance

DTMB

Demodulator

TC90508

ADC

AGC FEC

I2C

PLL

Memory

TUNER

Low IF

AGC Control

Tuner Control I2CControl I2C

TS Data

Xtal

TC90708FNG/FLG HDMI 1.4 Adapter

LED Driver

The HDMI 1.4 adapter IC can be used as an add-on to existing HDMI 1.3 systems to provide HDMI 1.4 compliance.

• Can be used as an add-on to existing HDMI 1.3 systems to

provide HDMI 1.4 compliance.

• Supports HEC(HDMI Ethernet Channel) and ARC(Audio

Return Channel).

Key Features and General Specifications

• Conversion between Ethernet and HEC

• S/PDIF support

• HDMI sink and source capabilities

Demodulation and Error Correction ICs

Part Number Function Input Voltage Data Rate Output Ratings Package

Output ratings: 17 V/ 90 mA × 16 ch

8-bit (256-step) output current calibration

16/14/12/10-bit PWM control

TC62D722CFG / CFNG 16-ch, 16-bit PWM 3.0 to 5.5 V 30 MHz (max) MFP /

HTSSOP

Toshiba leads the market for

ISDB-T (digital terrestrial

broadcast) and ISDB-S

(digital satellite broadcast)

demodulation ICs designed

for digital TV (DTV), set-top

box (STB), cellular phone, PC,

automotive TV and other

applications.

Part Number Feature / Function TV Standard Output Format Applications

TC90527

Single ISDB-T ISDB-T MPEG-2 TS Digital Home Appliances

TC90532

Double Demodulator ISDB-T ISDB-S MPEG-2 TS Digital Home Appliances

TC90522

Quad Demodulator ISDB-T ISDB-S MPEG-2 TS Digital Home Appliances

Automotive Equipment

Portable Equipment

TC90508

DTMB Demodulator DTMB MPEG-2 TS Digital Home Appliances

TC90514

4-Branch Diversity +

1Segment ISDB-T MPEG-2 TS

TC90508 : for China Digital Terrestrial Multimedia Broadcasting GB 20600-2006 (DTMB)

- 12 -

LED Driver

16 outputs 8 outputs

9 outputs

3ch LED Driver

White LED Driver 3ch LED Driver

Panel Lineup

LCD Backlighting Lineup

LED drivers are used in an increasingly wide variety of applications.

Toshiba offers a broad array of LED drivers featuring constant-current drivers with excellent LED current

accuracy. Included in Toshiba's LED driver portfolio are not only standard LED drivers but also those with PWM

dimming control, current gain control and various error detection functions. Toshiba's product lineups also

include LED drivers with a DC-DC converter that are ideal for mobile equipment applications.

For portable type LCD For middle size LCD For large size LCD

Mobile Phone

DSC

Portable

Game

Car Navigation

Note PC

LCD TV

1-4 inch 4-15 inch More than15 inch

LED2-10pcs

IF=10-30mA LED 8-75pcs

IF=20-150mA LED More than 75pcs

IF= More than 100mA

TB62752AFUG/755FPG TB62771FTG

(Under development)

TB62758FTG

TB62763FMG

PC Monitor

Digital Audio

Player

Product MP

Status Gain

Control Error

Detect PWM

Control

Output

Current

(mA)

Output

Voltage

(V) Package

TB62747AFG 45 26 SSOP24

TB62747AFNG 45 26 VSOP24

TC62D748CFG 90 17 SSOP24

TC62D748CFNAG 90 17 QSOP24

TC62D749CFG 90 17 SSOP24

TC62D749CFNAG 1Q/2012 90 17 QSOP24

TC62D776CFG 1Q/2012  90 17 SSOP24

TC62D776CFNAG 1Q/2012  90 17 QSOP24

TC62D776CFNG 1Q/2012  90 17 HTSSOP24

TC62D722CFG 1Q/2012  90 17 SSOP24

TC62D722CFNAG 1Q/2012  90 17 QSOP24

TC62D722CFNG  90 17 HTSSOP24

TC62D723FG 1Q/2012  90 17 SSOP24

TC62D723FNAG 1Q/2012  90 17 QSOP24

TC62D723FTAG/FTBG 1Q/2012  90 17 QFN24

TC62D723FNG 1Q/2012  90 17 HTSSOP24

TB62720FG  90 26 HQFP64

Product MP

Status Gain

Control Error

Detect PWM

Control

Output

Current

(mA)

Output

Voltage

(V) Package

TB62777FNG 50 25 VSOP16

TB62777FG 50 25 MFP16

TB62783FNG 50 25 VSOP16

TB62596FNG 50 38 VSOP16

Product MP

Status Gain

Control Error

Detect PWM

Control

Output

Current

(mA)

Output

Voltage

(V) Package

TB62779FNG 

50 28 VSOP20

TB62781FNG 

50 28 VSOP20

Product Function Vin(V) Output Current Number of

LED Package

TCA62723FMG 3ch Driver 2.8 to 5.5 150mA(max)/ch 3 parallel SON10

TCA62724FMG 3ch

(I2C Interface) 2.8 to 5.5 150mA(max)/ch 3 parallel SON10

Product Function Vin(V) Output Current Number of

LED Package

TB62752AFUG Switching type

DC-DC Converter 2.8 to 5.5 20mA(typ.) 2-8 series SOT23-6

TB62755FPG Switching type

DC-DC Converter 2.8 to 5.5 20mA(typ.) 2-8 series PLP-6

TB62763FMG Switching type

DC-DC Converter 5 80mA 2-6 series SON8

TB62758FTG Switching type

DC-DC Converter 6.8 to 22 25mA(max) 6chx10series VQON24

Product Function Vin(V) Output Current Number of

LED Package

TCA62723FMG 3ch Driver 2.8 to 5.5 150mA(max)/ch 3 parallel SON10

TCA62724FMG 3ch

(I2C Interface) 2.8 to 5.5 150mA(max)/ch 3 parallel SON10

DVD Player

- 13 -

S stem re ulators Di iial DC/Dc Converters & Wireless Power Charger

Power Management

Lineup

Digital DC/DC Converters

Dynamic voltage selection & Diagnostic functions

• Bus communication function

• Sequencer (Rise/ Fall time setting)

• Dynamic voltage selection

• Diagnostic for output voltage, current & temperature

• Log function of trouble records (External E2PROM)

Low current consumption and die size reduction by hard logic structure

PFCs

• CCM for high power applications

• CRM for mid to low power applications

(CCM : Continuous Conduction Mode)

(CRM : Critical Conduction Mode)

System regulators

Business Field

Features & Technologies

For various kind of applications

• Digital TV (DDR2/DDR3 memory)

•WiMAX

• Mobile phone

• Digital still camera (DSC)

• Digital single-lens reflex camera (DSLR)

• Car audio head unit

Sub-regulator：TC7732FTG

for DDR Memory

for Graphic Chip

TV, AV

Communication/

Server

DSC/DSLR

Network

Digital Regulator(DC-DC)：TC7750/51FTG

PFC：TB6818/19FTG

USB DC/DC Quick Charge：TC7710WBG

Wireless Charger：TB6860WBG/TB6865FG

Mobile

DSLR：TC7733FTG

: TC7731FTG

AC-DC

LED Lighting/Adopter

Digital

Regulator

System

Regulator

PFC

Category Parts Number ES CS

System Regulator

TC7731FTG (for DDR2/3) Available 2Q/2012

TC7732FTG (for Mobile) Jan/2012 2Q/2012

TC7733FTG (for 2-cell) 2Q/2012 3Q/2012

TC7710WBG (for 1Cell Charger) Feb/2012 3Q/2012

TB6860WBG (Wireless Charger RX) Feb/2012 2Q/2012

TB6865FG (Wireless Charger TX) Feb/2012 2Q/2012

Digital

DC/DC Converter

TC7750FTG (3A) Available 2Q/2012

TC7751FTG (Controller-IC) Available 2Q/2012

PFC TB6818FG (CCM) Available Available

TB6819FG (CRM) Available Available

Wireless Power Charger

WPC compliance (Qi)

Inductive coupling method

Free positioning charger system

- 14 -

Fm Mum: Pym : Fm w m 2 Fur Panama Mm mug ner yum Fur Hume audm & rv *[4 —> JETC9451Z l\‘ m I— DIgHa‘ MuzAmp 4— v’ 11294521 WBG 1 S -> SpeakerAmp —>!! Audio code: A Audio Codec , Headphone Amp and Speaker Amp RoadMap

Audio

‐15‐

Various types of digital audio systems have

been brought to the market along with the

advancement in digital technology.

Particularly, the popularity of portable digital audio

players has been soaring today. Those players

use a memory card or HDD as recording

media to store music data with such high-level

compression formats as MP3, WMA, or AAC.

Digital audio systems are spreading into the

world of not only portable audio players but also

car audio equipment.

Toshiba provides dedicated ICs to support those

systems, and also an extensive lineup of

peripheral devices.

Mobile Audio

For Car audio

For Home audio & TV

•Surround system (Dolby®/dtsTM)

•Virtual sound

•D-class Amplifier

•MP3/WMA/AAC/SBC

•DRM

•CD/SD/USB system

•MP3/WMA/AAC

•NAND Flash Controller

•AD/DA Converter

•Headphone Amplifier

High quality

sound

•MP3/WMA/AAC/SBC

•DRM

•CD/SD/USB System

•4ch Power Amplifier

•Digital Tuning System

For Mobile Phone

•Headphone Amp

•Speaker Amp

•Microphone Amplifier

•Noise/Echo Cancellation

For Portable audio

Base Band

Processor

Application

Processor Digital Mic. Amp

Speaker Amp

JBTC94B12

TC94B23WBG

Amplifier for

•Headphone(Class‐G)

•Speaker (Class‐G,Class‐D)

•Microphone(withADC)

Audiocodec

•1MicNoise&Echocancellation

•ForMobilephone/portableaudio

•I2SI/F

•AD/DAconverter

Toshiba is developing Echo and Noise Cancel Audio Codec ICs

for Mobile and Smart Phone .

Audio Codec , Headphone Amp and Speaker Amp RoadMap

Digital

Microphone

Amp

Headphone

Amp

Speaker

Amp

CODEC

2010 2011 2012

JBTC94B12-AS

TC94B06WBG

TC94B24WBG

TC94B23WBG

JBTC94Bxx-AS

TC94ByyWBG

TC94BzzWBG

G-Class Stereo Amp

Electric Volume

2‐ADC(Mic‐in),2‐DAC(Lineout)

MonoSPAmp,

StereoHPAmp

DSPwithEcho&Noisecancel

1st Gene: Low Noise

PDM Output

1.7W D-Class Mono Amp

DC-DC Conv.

G-Class Stereo Amp DAC

Electric Volume

2nd Gene: Low Ultra Noise

PDM Output

2W D-Class Stereo Amp

DC-DC Conv.

1ADC(Mic-in)

2-DAC(Line out)

SP Amp, HP Amp

ES: 1Q/2012

MP: 2Q/2012

ES: 1Q/2012

MP: 4Q/2012

S/N

Improvement

+DAC

Stereo

Cut

Down

Under

Development

Planning

Product Development Concept

TC94B15WBG

ES: 3Q/2012

MP: 4Q/2012

Audio CODEC (Under Development)

Audio

Codec

AD/DA

Audio DSP

(Echo canceller/

Noise Canceller,

Equalizer, etc)

Speaker Amp

Headphone Amp

TC94B06WBG G-Class

TC94B15WBG DAC+G-Class

Disc Servo DVD/CD 4ch Power Am for Car audio RoadMa

- 16 -

Home and Car Audio

4ch Power Amp for Car audio RoadMap

CDMP3/CD less Car Audio system

High Power

Premium

Sound

Intelligent

Power

Class KB

Slim Power

2011 2012 2013 -

TB2931HQ

*49Wx4ch

2 load drive capability

25pin:offset,short, Rareshort det.

TB2941HQ

*49Wx4ch

2 load drive capability

25pin:HSW,offset

Class-D

Class-KB

I2S, Self Diag

TB2975HQ

*49W×4ch

Class KB + I2C

TB2959HQ

*47W×4ch, 25pin:AUX-IN

TB2938HQ

*49Wx4ch

25pin:offset,short, Rareshort det.

Speaker current limiting

*49Wx4ch

*100Wx4ch

TB2959KG

ES: Available

MP: 2Q/2012

ES: Available

MP: 1Q/2013

ES: 1Q/2013

MP: 3Q/2013

ES: 3Q/2013

MP: 1Q/2014

*Maximum Output Power @ Vcc=15.2V, RL=4

BiCD 0.13 Process

TC94A92,A93,B18

TMPM321,322

USB2.0 Full Speed

1M Flash

•Display

•key

ARM core

USB MCU

CDMP3 LSI

49W class-AB amp

TB2941HQ

4ch Power Amp

E-vol/

Selector

TC35655

ARM9：Application

ARM7：BT profile

RF Block

Bluetooth module

PCM Decoder Flash

AM/FM

64k RAM

System compatible

with USB/CD system

ESP/ROM Dec.

2ch DAC

CD-servo RF-amp

16M DRAM

Decoder

•SD card

•USB Memory

•iPod / iPhone

Toshiba is No1 Audio semiconductor solution provider by CD, MP3, Power Amp, MCU, USB Audio, BT Audio,

SW, Volume Technology for Home Audio and Car Audio. Toshiba can provide whole Audio solution.

Bluetooth V2.1 EDR

Bluetooth V4.0 DR+LE

Bluetooth

Disc Servo

DVD/CD

4ch Power Amp

TMPM321 series

MCU

USB-Host

Function SW

Volume Cont.

Audio DSP

MP3/WMA/AAC

Enc / Dec

TB2925HQ

*49W×4ch

Class KB ES: 2Q/2012

MP: 4Q/2012

TB2952HQ

*49W×4ch

Class AB + I2C

ES: 2Q/2012

MP: 3Q/2012

ES: Available

MP: 2Q/2012

Under

Development

Planning

AM/FM

Tuner

TC94A99

TC94A92, A93, B18

> Chassis and Safety Systems - Anti»lock brake system (ABS) > Powertrain - Electronic stability control (ESC) - Combustion engine control system - Electronic power steering system (EPS) - Automatic transmission ~ Airbags - Hybrid car motor - Collision avoidance: Millimeter-wave radar - Brushless DC motor for mileage management - Collision avoidance: Ultrasonic sonar - Brushless DC motor for fuel pumps - Four-wheel-drive (4WD) control - Oxygen sensor for air»luel ratio > Body - Battery and energy management - Brushless DC motor for oil pumps - Body control unit - Adaptive Front-lighting System (AFS) - Air-conditioner flap motor - Door mirrors - Air-conditioner blower motor (orushless/brushed) - Power windows - Brushless DC motor for water pumps - LED headlights BiCD combines Bipolar CMOS and DMOS Toshiba developed the BiCD process to improve current drive efficiency and reduce power consumption. High Power & Bipolar: Analog Circuit H'ghaﬁggow" CMOS: Large-Scale Integration DMOS: High Voltage & High Current Drive Bipolar

Automotive

To meet the needs of many automotive electronic systems, Toshiba offers hybrid ICs that integrate analog, digital

and power devices all on the same chip.

In recent years, market demands are growing for mixed digital/analog devices and on-chip integration of a power

output circuit. To meet these demands, Toshiba employs a BiCD process, which integrates bipolar transistors,

CMOS logic and a high-voltage and huge-current power MOSFET. The integration of low on-resistance power

MOSFET helps reduce power consumption. This simplifies thermal design, making it possible to use smaller

packages.

BiCD combines Bipolar, CMOS and DMOS

Toshiba offers high-quality and high-performance devices that integrate various interfaces, power drivers and complex logic

blocks on a single chip. Toshiba supports custom development of various automotive ICs and SoCs. In recent years, Toshiba

has offered custom development services for ICs and SoCs targeted for next-generation eco-friendly cars such as hybrid

electric vehicles (HEVs), plug-in hybrid vehicles (PHVs) and electric vehicles (EVs).

Business Field

Mixed-signal Devices

- 17 -

Motor Driver ICs System Power Sugply le

Motor Driver ICs

Toshiba offers a wide spectrum of three-phase BLDC and brushed DC motor driver ICs. Toshiba is expanding its

product portfolio with motor drivers featuring an output stage as well as those which integrate an MCU in a system-in-

package (SiP).

Brushed DC Motor Driver IC Lineup

Part Number Input Output Current Output Power Supply Features & Functions Package Status

TB9056FNG LIN ±0.3 A Direct BATT

(On-chip 5-V reg.) H bridge (1 ch)

LIN 1.3 (slave) SSOP24-P-300-0.65A MP available

TB9100FNG SPI ±0.5A Direct BATT H-bridge (3 ch)

SPI interface SSOP24-P-300-0.65A Under development

TB9110FNG PWM ±0.02A Predrivers

N-ch BATT

(On-chip 5-V reg.)

1-channel brushed DC motor predriver

On-chip charge pump (An external N-

channel FET required) SSOP24-P-300-0.65A Under development

TB9101FNG Direct ±0.5A Direct BATT H-bridge (2 ch)

DMOS power transistor version of the

TA8083FG SSOP24-P-300-0.65A Planning

Part Number Input Commutation Output Power Supply Features & Functions Package Status

TB9060FNG PWM 120°5V CMOS 5 V Simple logic IC consisting of only a 3-phase sensorless

controller SSOP24-P-300-

0.65A MP available

TB9061FNG PWM,

DC voltage 120°Predrivers

P-ch/N-ch BATT

(On-chip 5-V reg.)

Simple application circuit with only a few external parts

Support for slow PWM inputs; overcurrent detection;

sensorless control

SSOP24-P-300-

0.65A MP available

TB9065FG UVW phase

signals External control Predrivers

N-ch/N-ch BATT

(On-chip 5-V reg.)

All-in-one charge-pump predriver used in tandem with an MCU;

LIN 1.2 transceiver; 5-V regulator;

watchdog timer; comparators for sensors

QFP64-P-1212-

0.65A MP available

TB9067FNG PWM,

DC voltage 120°Predrivers

P-ch/N-ch BATT

(On-chip 5-V reg.) Only a few external parts required; support for both PWM and

DC inputs; 120° six-step commutation; comparators for sensors SSOP24-P-300-

0.65A MP available

TB9068FG PWM,

phase signals 120°

External control Direct BATT

(On-chip 5-V reg.) Allows direct drive of a motor with on-chip 0.3-A drivers.

LIN 1.3 transceiver; 5-V regulator LQFP48-P-

0707-0.50 MP available

TB9080FG PWM Sine wave Predrivers

N-ch/N-ch BATT

(On-chip 5-V reg.) Quiet motor operation due to the use of sine-wave current

High drive efficiency thanks to auto lead angle control QFP64-P-1010-

0.50C Under

development

TB9063 PWM,

DC voltage Pseudo-sine wave Predrivers

N-ch/N-ch BATT

(On-chip 5-V reg.) Sensorless drive and quiet motor operation

Auto lead angle control and pseudo-sine-wave drive Under review Planning

Brush-less DC Motor Driver IC Lineup

System Power Supply ICs

System Regulator IC Lineup

As an increasing number of electronic devices find their way into automobiles, it is becoming an urgent requirement to

reduce their operating current. To address this need, Toshiba offers the TB900x low-standby-current system power

supply IC series featuring industry-leading operating current.

Part Number Package Functions

Characteristics

Remarks Supply

Voltage

(V)

Output

Voltage

Typ. (V)

Output

Current

(mA)

Input Voltage

Max (V)

Power

Dissipation

Max (W)

TB9000FG SSOP16-

P-225-

1.00A

CPU voltage regulator,

Watchdog timer 5.0 10

(Max) 45

(1 sec.) 0.6

•Low current consumption: 120 µA (typ.)

•Watchdog timer enable/disable

•Reset detection: 4.7 V

•External transistor required

6 to 16

TB9000AFG SSOP16-

P-225-

1.00A

CPU voltage regulator,

Watchdog timer 5.0 10

(Max) 45

(1 sec.) 0.6

•Low current consumption: 120 µA (typ.)

•Watchdog timer enable/disable

•Reset detection: 4.2 V

•External transistor required

6 to 16

TB9000CFNG SSOP20-

P-225-

0.65A

CPU voltage regulator,

Watchdog timer 5.0 10

(Max) 45

(1 sec.) 0.6

•Low current consumption: 120 µA (typ.)

•Watchdog timer enable/disable

•Reset detection: 4.7 V

•External transistor required

6 to 16

TB9001FNG SSOP20-

P-225-

0.65A

CPU voltage regulator,

Watchdog timer 5.0 5

(Max) 45

(1 sec.) 0.6 •Low current consumption: 95 µA (typ.)

•Internal 32-kHz clock

•External transistor required 6 to 16

TB9004FNG SSOP24-

P-300-

0.65A

CPU voltage regulator,

Watchdog timer 3.4/2.5/1.5

5.0

(Min)

(1 sec.) 0.85

•Low current consumption: 0 µA (VCC1/2: off) (typ.)

•3.4/2.5/1.5 V selectable

•Two reset pins

•External transistor required

6 to 16

TB9005FNG * SSOP20-

P-225-

0.65A

CPU voltage regulator,

Watchdog timer 5.0 10

(Min) 45

(1 sec.) 0.6

•Low current consumption: 90 µA (typ.)

•Watchdog timer enable/disable

•Reset detection: 4.7 V or 4.2 V (selectable)

•External transistor required

6 to 18

TB9006FG HSOP36-

P-225-

0.65A

CPU voltage regulator,

Watchdog timer 5.0

5.0

250

(Max)

(1 sec.) 2.0

•Low current consumption: 0 µA (Regulator function: OFF)

•On-chip output transistor 5V regulator

•5V tracking regulator

•VTH : Selectable from 4.2 V and 4.7 V

7 to 18

*: Under Development

Mixed-signal ASSPs

Part Number Package Functions

Characteristics

Remarks Supply

Voltage

(V)

Output

Voltage

Typ. (V)

Output

Current

(mA)

Input Voltage

Max (V)

Power

Dissipation

Max (W)

TB9040FTG * QFN36-P-

0606-0.50

Low output voltage two regulators,

Switching power supply and series

regulator

2.8

1.5

130

(Max)

(1 sec.) 4.5 •Low voltage output and high efficiency two regulators

•On-chip output transistor

•Voltage monitor function 6 to 18

TB9041FTG * QFN36-P-

0606-0.50

CPU voltage regulator,

Switching power supply and series

regulator,

On-chip watchdog timer

3.3/1.5/1.2

5.0

200

400

100

(Max)

(1 sec.) 4.5

•Low current consumption: 0 µA (Regulator function : OFF)

•Selectable from 3.3 V, 1.5 V and 1.2 V.

•Two reset pins

•On-chip output driver (External transistor is supported.)

7 to 18

Switching Regulator IC Lineup *: Under Development

- 18 -

ARM Core-Based Microcomroller (CortexW-Ma, Cortex‘KMF) - Wurldwlde de - “lug/:3?" Fumona. safety supervisor assembl code eneration, y 9 cores ideal tor embedded SIM/‘53 Ideal tor real-time control Fast v' appli‘ims - Time-consuming instructions are interrupt interruptible. . Pushing onto a stack is automatically done by hardware. On-chlp digital HDC - A digital RDC alluws the data conversion process to be monitored. »Easrer to detect and analyze errors. ‘ A digital RDC allows internal data correction to be automated. Adjustment ol commutan‘on signal delays: sineJoosine amplitudes; noise filtering, etc. response Superior One-shot motor d 44 pulse control W control . 7" 05"”"9 p One-shot pulse generator d' “I ’ ~ Easy to achieve a motor “DC . speed at >15.ooo RPM. ammo vector engine Vector control by hardware - Reduces the CPU workload by over 50% in terms at the number of clock cycles. -Al|ows new enhanced leatures to be added. >Allows the CPU speed to be tuned to lrnpmve overall system efﬁciency. M350 M354

Automotive

Toshiba has been moving host processors to RISC architecture. After acquiring a license for the ARM Cortex™

series, Toshiba has further sped up the migration to RISC.

Toshiba is expanding its portfolio of automotive microcontrollers, ranging from its original 8-bit MCUs to the ARM

Cortex™-based ones.

Lineup

Microcontrollers

M350 Group

Features

Programmable Motor Driver (PMD),

CAN controllers, timers, 12-bit AD converter,

crossbar switches, functional safety capabilities

and 5-V I/Os

Application examples

Electric power steering (EPS) systems

and other automotive applications

Features

Advanced PMD (A-PMD), VE, CAN controllers,

timers, 12-bit AD converters, resolver-to-digital

converter, crossbar switches, functional safety

capabilities and 5-V I/O

Application examples

HEV, EV and other automotive applications

M350

M354

Flash

Memory Frequency

Application

EPS HEV/EV

1Motor HEV/EV

2Motor VSC/ABS

1MB

160MHz

up to

100MHz

512KB

up to

64MHz

256KB

128KB up to

20MHz

PMD

100pin

PMD

RDC

64pin

PMD

RDC

64pin

A-PMD

RDC

144pin

A-PMD

RDC

144pin

A-PMD

RDC

100pin

Flexray

144pin

100pin

A-PMDx2

RDCx2

176pin

TMPM350

TMPM354

TMPM45X

CortexTM-M3

CortexTM-R4 PMD : Programmable Motor Driver

A-PMD : Advanced PMD

RDC : Resolver to Digital Converter

fR : fault Robustness

- 19 -

gh End Instrument Panel Lo Endlo M' RangelnslrumemPanels L neug nnpuay conhuHu @ mom m: @ Von»- Mulllov cpu 5m --> cm am... sp. n _ Cam. Ens cm C Commﬂer ”CU CAN an; “a! menu!" 2W“) .Fowev m n O —s mm. @335; Mamae u mscr m mm“ mm. «n <- --="">|-> on. sunny Clmam KGB, Arm 0 _5 MISC! m was» Rsou R555 “m mm “GB _. _. ,g , Dlsm-v a} muss) new 5"“ cum-n uses Mun ‘ R53 mm M 29mm) Dvsvlny CammHev unlxcvu .mm . “mi-WW cw 5mm: Conlml an. Mcu conmum 9"" 3'" Fmv MadIILE' O m mm lnbeﬂl " 9 ' Fume Gnhbev Hun nvGA (1230x185)

The evolution of automobiles is spurring the need for an instrument panel capable of displaying new kind of

information such as the amount of regenerative energy generated by hybrid electric vehicles (HEVs) or presenting

driving information on a head-up display (HUD).

Using a graphic display provides greater design flexibility since it can dynamically change the displayed

information according to situations.

High-End Instrument Panel

Low-End to Mid-Range Instrument Panels

Illustrated in figure is an instrument panel that consists of a

WQVGA to WVGA TFT LCD panel and mechanical meters. In

order to present various information, it is necessary to connect

the instrument panel to an in-vehicle LAN via a CAN bus. In

addition, video inputs are required to display images from

external video sources such as cameras and a car navigation

system. The TX4961XBG-240 and TX4964FG-120 provide not

only a 2D graphics accelerator and a display controller but also

all the functions needed to realize such an instrument panel,

including a CAN controller, an I2C interface and timers.

Lineup

PartNumber OperatingFrequency[MHz] EmbeddedRAM ExternalDRAM Graphics

Accelerator

Display

Output

Frame

Grabber Package

TX4961XBG‐240 240 ‐DDR‐I 2D 1ch 1ch PBGA456

TX4966XBG‐280 280 8MByte SDRAM 2D/3D 2ch 2ch PBGA456

TMPA970C20XBG 336 2Mbyte DDR‐2 2D/3D 2ch 2ch PBGA516

Display Controllers for High-End Instrument Panel

PartNumber OperatingFrequency[MHz] EmbeddedRAM ExternalDRAM Graphics

Accelerator

Display

Output

Frame

Grabber Package

TX4961XBG‐240 240 ‐DDR‐I 2D 1ch 1ch PBGA456

TX4964FG‐120 120 4MByte ‐2D 1ch 1ch LQFP176

Display Controllers for Low-End to Mid-Range Instrument Panels

PartNumber Package Features&Functions Operating

Temperature

Supply

Voltage

TC90105FG LQFP80

2‐channelcolordecoder; 2‐channelADconverter;newlydevelopedHVdynamicenhancer;color

management;dynamicYCgammacorrection;horizontalaberrationcorrection ;

2.5‐Vvoltageregulator

‐40to85℃1.4to1.6V

3.0to3.6V

TC90107FG LQFP64

1‐channelcolordecoder; 4‐channelvideo inputselector;

newlydevelopedHVdynamicenhancer;colormanagement;dynamicYCgammacorrection;

horizontalaberrationcorrection;2.5‐Vvoltageregulator

Video Decoders

Instrument Cluster & Head-up Display (HUD)

Illustrated in figure is a fully digital instrument panel that uses

computer graphics to present all information such as a

speedometer on a TFT LCD panel as large as DVGA. Use of

computer graphics helps realize a flexible instrument panel that

displays information only when necessary or uses different

colors during daytime and nighttime. High image rendering

performance is required to display the rotating meter needles

smoothly. In addition, it is necessary to make provision for using

an HUD and a standard instrument panel simultaneously. The

TX4966XBG-280 and the TMPA970C20XBG provide two

graphic display controllers (GDCs), thereby making it possible to

connect two TFT LCD panels. In addition to a 2D graphics

accelerator, the TX4966XBG-280 and the TMPA970C20XBG

contain a 3D graphics accelerator ideal for high-resolution digital

instrument panel applications.

- 20 -

FPCS I I V Vendmg , machmes 5‘0! machmes Stegging Molar Driver IC Lineug

Motor Control Driver

Toshiba offers a range of motor drivers for various types of motors that are designed to meet the large-current,

quick-control and high-precision needs of many kind of applications.

• Low Ron DMOS mixed process（BiCD)

• Micro-stepping for stepping motors

• Sine-wave PWM Drive for brush-less motors

• Automatic Lead Angle Control for brush-less motors

Stepping Motor Driver IC Lineup

TB6562ANG

/AFG TB62206FG TB62208FG

/FTG/FNG TB62218AFG

/AFTG/AFNG

TB62213AFNG

/AFTG/AFG

/AHQ* TB62210FNG TB6674PG/FG

/FAG

Process 40V 40V 40V 40V 40V 40V 24V

Motor Drive

Current 1.5A 1.8A 1.8A 2.0A 3.0A 1.0A 0.4A(PG/FG)

/ 0.2A（FAG)

RON

(H side

+ L side) 1.51.11.21.00.61.2

2.9

/ 7.9

(power save)

Drive Mode 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor

Excitation Mode W1-2

(1/4 Step) 1-2

(1/2 Step) 1-2

(1/2 Step) W1-2

(1/4 Step) W1-2

(1/4 Step) 2

(Full Step)

Interface Phase (3bit) Phase (2bit) Phase(2bit) Phase(3bit) Phase(3bit) Phase(3bit) Phase(1bit)

Mixed Decay -    -

Package SDIP24(1.78)

/SSOP30(1.0) HSOP20(1.0) HSOP28(0.8)

/QFN48(0.5)

/HTSSOP(0.5)

HSOP28(0.8)

/QFN48(0.5)

/HTSSOP(0.5)

HTSSOP(0.5)

/QFN48(0.5)

/HSOP28(0.8)

/HZIP25(1.27)*

HTSSOP24

(0/65)

DIP16(2.54)

/HSOP16(1.00)

/SSOP16(1.00)

Shutdown Circuit ･Over Current

･Thermal

･Over Current

･Thermal

･Over Current

･Thermal

･Over Current

･Thermal

･Over Current

･Thermal

･Over Current

･Thermal

･Over Current

･Thermal

2 Phase Stepping Motor Control Driver IC [Phase Input Type] * Mark: Under Development

Business Field

Advanced technologies

• Sensor-less driver with PWM operation

• Sensor-less drive with sine-wave current Vector Control

• Safety measures

• Various kind of Package lineup

For OA and Industrial Equipment

PPCs

Cashing

machines

Projectors

Sewing

machines

Slot

machines

Vending

machines

Audio

equipments

Printers

DSCs

Industrial

Equipment

Scanner

Consumer

Equipment &

Home Appliance

Air conditioners

Refrigerators

Video

recorders

Equipment

Play things Battery

Powered

Appliance

Washing machines

H-bridge Driver

Brush-less Motor Driver

Stepping Motor Driver

Motor Driver IC

Brushed DC Motor

Brush-less DC Motor

Stepping Motor

DC Motor

- 21 -

Brushed DC Motor Driver IC Lineup Sighase Brushriess DC Motor Driver IC Lineug 1

‐22‐

TB6608FNG TC78S600FNG*

/FTG* TB62209FG TB62214AFG

/AFTG/AFNG

TB62215AFNG

/AFTG/AFG

/AHQ* TB62210FNG TB6560AHQ

/AFG/AFTG TB6600G*

Process 15V 18V 40V 40V 40V 40V 40V 50V

Motor Drive

Current 0.8A 1.0A 1.8A 2.0A 3.0A 1.0A 3.5A/2.5A 5.0A

RON

(H side + L side) 1.51.21.01.00.61.20.6／0.70.4

Drive Mode 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor 1 Stepping Motor

Excitation Mode 2W1-2

(1/8 Step) 4W1-2

(1/16 Step) 4W1-2

(1/16 Step) W1-2

(1/4 Step) W1-2

(1/4 Step) 4W1-2

(1/16 Step) 4W1-2

(1/16 Step)

Package SSOP20（0.65）SSOP20（0.65）*

/QFN24(0.5)* HSOP36(0.65) HSOP28(0.8)

/QFN48(0.5)

/HTSSOP(0.5)

HTSSOP(0.5)

/QFN48(0.5)

/HSOP28(0.8)

/HZIP25(1.27)*

HTSSOP24

(0/65)

HZIP25 (1.27)

/THQFP64 (0.5)

/QFN48 (0.5) HZIP25 (1.0)*

Shutdown Circuit ･Thermal ･Over Current

･Thermal

･Over Current

･Thermal

･Over Current

･Thermal

･Over Current

･Thermal

･Over Current

･Thermal ･Thermal ･Over Current

･Thermal

2 Phase Stepping Motor Control Driver IC [Clock Input Type] * Mark: Under Development

TB62212FTAG/FNG

Process 40V

Motor Drive Current 1.5A(2 Stepping Motors)

2.0A(4 DC Motors)

RON (H side + L side) 2.2(typ.) / H-bridge

Drive Mode 4DC Motors or 2Stepping Motors

Excitation Mode 1-2

Interface Phase(2bit)

Package QFN48(0.5) / HTSSOP48(0.5)

Shutdown Circuit - Over Current - Thermal

2 Phase Stepping Motor Control Driver IC [4 in 1 type]

TA8428FG/K TB6549FG/PG/HQ

Process Bipolar BiCD0.8

VM 30V 30V

IO 2.4A / 3A 3.5A / 4.5A

Ch 1ch 1ch

PWM drive Impossible Direct PWM

I/F Phase input (2bit) Phase input (2bit)

ISD 

TSD 

Package HSOP20(1.0)/HSIP-7(2.54) HSOP20(1.0)/DIP16(2.54)/HZIP25(1.0)

RoHS (FG) (FG/PG)

Included only inside (K) Included only inside (HQ)

ISD: Over current detection TSD: Over heat detection

Brushed DC Motor Driver IC Lineup

* Mark: Under Development

TB6551FAGTB6584FNG/AFNG TB6631FNG TB6586FG/AFG/BFG TB6603FTG TB6604FTG TB6585FG/FTG

Function Controller Controller Controller Controller Controller Controller Driver

VM (VCC) 12V 12V 12V 18V 30V 30V 45V

IO 2mA 2mA 2mA 35mA 20mA 20mA 1.8A/1A

Output control signals H:5V

L:0V H:5V

L:0V

UH:VG

/L:0V

LH:8V

/L:0V

UH:VG

/L:0V

LH:8V

/L:0V

Sine-wave current (150-deg) 

Sensor- less - - - - - - -

Magnet

-detect Hall IC Hall ele.

/Hall IC Hall ele.

/Hall IC Hall ele. Hall ele. Hall ele.

Package SSOP24

(1.0) SSOP30

(0.65) SSOP30

(0.65) SSOP24

(1.0) QFN36(0.5) QFN48(0.5) HSOP36 (0.65)/QFN48

lead angle control External input Auto Auto External input External input Auto Auto

RoHS 

Sine Wave Drive Sine Wave Drive

3-phase Brush-less DC Motor Driver IC Lineup (1)

TB6561NG/FG TB6559FG TB6568KQ TB6643KQ TB6569FG TB6641FG TB6642FG TB6640FTG TB6617FNG TB6601HG* TB62212FTAG/F

Process BiCD0.6 BiCD0.6 BiCD0.6 BiCD0.6 BiCD0.6 BiCD0.6 BiCD0.6 BiCD0.13 BiCD0.6 BiCD0.13 BiCD0.6

VM 40V 50V 50V 50V 50V 50V 50V 40V 50V 50V 40V

IO 1.5A 2.5A 3.0A 4.0A/4.5A 4.0A/4.5A 4.0A/4.5A 4.0A/4.5A 3.0A 2.0A 5.0A 2.0A

ON resistance

(Upper+Lower) 1.51.30.550.550.550.550.551.01.40.42.2

Ch 2ch 1ch 1ch 1ch 1ch 1ch 1ch 1ch 1ch 4ch

PWM drive Direct PWM Direct PWM&

Constant

current PWM Direct PWM Direct PWM Direct PWM&

Constant

current PWM

Direct PWM&

Constant

current PWM Direct PWM Direct PWM&

Constant

current PWM Direct PWM Direct PWM&

Constant

current PWM

Direct PWM&

Constant current

PWM

I/F Phase input

(2bit/ch) Phase input

(2bit) Phase input

(2bit) Phase input (2bit)

ISD 

(Latch)



(Latch)



(Latch)



(Latch)



(Latch/Auto)



(Latch/Auto)



(Latch)



(Latch)



(Latch)

TSD 

(Latch)



(Latch)



(Latch)



(Latch)



(Latch/Auto)



(Latch/Auto)



(Latch)



(Latch)



(Latch)

Package SDIP24 (1.78)

/SSOP30 (0.65) HSOP16 (1.0) HSIP-7 (2.54) HSIP-7 (2.54) HSOP16 (1.0) HSOP16 (1.0) HSOP16 (1.0) QFN48(0.5) SSOP16 (0.65) HZIP25(1.0) QFN48 (0.5)

/HTSSOP48(0.5)

Sephase Brushrless DC Motor Driver IC Lineup 2 Sephase Brushrless DC Motor Driver IC Lineug Low Voltage Simgle Hebridge Driver IC Lineug 1chip Combination Driver IC Lineug

‐23‐

MotorControlDriver

Product PKG VM Io Ch Ron(H+L) Functions Schedule

ES CS

TB6593FNG SSOP20-P-225-0.65

15V

3.2A 1 0.35Direct PWM Function 

TB6552FNG SSOP16-P-225-0.65 1A 2 1.5Direct PWM Function, 2ch 

TB6552FTG WQFN16-3030-0.5-0.3 1A 2 1.5Direct PWM Function, 2ch 

TB6612FNG SSOP24-P-300-0.65 2.8A 2 0.5Direct PWM Function, 2ch 

TB6614FNG SSOP16-P-225-0.65 3.2A 1 0.3Direct PWM Function 

TB6590FTG VQON16-P-0303-0.50 6V 0.5A 2 2.52ch, Small package 3mm□

TB6608FNG SSOP20-P-225-0.65 15V 0.8A 2 1.5STM 3bit step control 

TC78S600FNG*/FTG* SSOP20-P-225-0.65/WQFN24-P-0404-0.50 18V 1.0A 2 1.1STM 4bit step control 1Q/2012 3Q/2012

TC78H600FNG*/FTG* SSOP20-P-225-0.65/WQFN24-P-0404-0.50 18V 1.0A 2 1.1Direct PWM Function, 2ch 2Q/2012 3Q/2012

Low Voltage Simple H-bridge Driver IC Lineup

Product Driver Vcc

(V)

Iout

(A) Function

Total H-bridge CC

TB6613FTG 8 3

*Direct PWM 52.7～62.2～60.8 ・Serial I/F

・µ-step STM Drive

1chip Combination Driver IC Lineup

TB6586FG/

AFG/BFG TB6575FNG TB6633FNG/AFNG TB6588FG

Function Controller Controller Driver Driver

VM 18V 5.5V 25V 50V

IO 2mA 20mA 1.0A 2.5A

Output

control signals H:5V

L:0V H:5V

L:0V --

Sinusoidal

current wave ----

Sensor-less - 

Magnet-detect Hall ele./ Hall IC - - -

Package SSOP24 SSOP24

(Pin pitch 0.65)

SSOP24

(Pin pitch 0.65)

HSOP36

(Pin pitch 0.65)

Square Wave Drive

3-phase Brush-less DC Motor Driver IC Lineup

Sine Wave Drive Sine Wave Drive

TB6551FAG TB6556FG TB6584FNG/AFNG TB6631FNG TB6585FG/FTG TC7600FNG

Function Controller Controller Controller Controller Driver Controller

VM 12V 12V 18V 18V 45V 5V

IO 2mA 2mA 2mA 2mA 1.8A/1.0A 2mA

Output

control signals H:5V

L:0V H:5V

L:0V -H:5V

L:0V

Sinusoidal

current wave 

Sensor-less - - - - - 

Magnet-detect Hall IC Hall IC Hall ele. / Hall IC Hall ele. / Hall IC Hall ele. -

Package SSOP24 SSOP30 SSOP30

(Pin pitch 0.65)

SSOP30

(Pin pitch 0.65)

HSOP36/QFN48

(Pin pitch 0.65)

SSOP30

(Pin pitch 0.65)

Lead free 

Sensor-less DriveSensor-less Drive

TB6575FNG TB6633FNG/AFNG TB6588FG TC7600FNG

Function Controller Driver Driver Controller

VM 5.5V 25V 50V 5.5V

IO 20mA 1.0A 2.5A 2mA

Output control signals H:5V

L:0V --

H:5V

L:0V

Sine-wave current - - - 

Sensor-less 

Package SSOP24 (0.65) SSOP24 (0.65) HSOP36 (0.65) SSOP30 (0.65)

lead angle control External input External input External input Auto

3-phase Brush-less DC Motor Driver IC Lineup (2)

For Battery Powered Applications

For Home Appliance

* Mark: Under Development

Sauna uuallly Achieves nlvh-qullny sauna Convenhuna‘ Speech 1 Symhes»; Technology \ {mc‘ corpus base) m IME 10MB 100MB IGE Ame-ml ul snack on. Cnmpansnns av 5mm Oua‘lly and Mammy Reuuwemem bexwesn me Convennona‘ and New Speech Synmesws Techno‘ogles Gm ToSEea k'” wm: n small amount at memory.

Text To Speech Middleware

What is Text To Speech (TTS)?

Text To Speech (TTS) is a media conversion technology from text to speech. TTS is suitable for many

information systems whose messages are difficult to be pre-recorded.

Telematics Service :Information Reader :

Voice Activated Dialing / Incoming Call Notification :

•To dial by combination with voice recognition technology

•To tell who calls now

Navigation :

•To inform a right

direction to the user

•To inform traffic jam condition,

weather forecast, news

•To tell schedule to the user

•To read e-mail

ToSpeakTM Feature

ToSpeakTM is the Toshiba TTS middleware for embedded systems. ToSpeakTM achieves high-quality sound

with small amount of memory. ToSpeak™ uses a new Toshiba-proprietary technology to reduce sound-

quality variations. This technology selects plural speech units and fuses them together to make the

synthesized voice sound more realistic and natural. ToSpeakTM is composed of Text Analyzer and Voice

Synthesizer. Text Analyzer analyzes plain text based on text analysis dictionary and user’s lexicon and

outputs phonetics with high accuracy. Voice synthesizer generates high-quality speech from phonetics with

various kind of speech by switching speech database.

Roadmap

Speech

Phonetics

Plain text

Voice Synthesizer

Text Analyzer

User’s lexicon

Text Analysis

dictionary

Speech database

Multi

speaking

style

TTS

Multi

language

TTS

~2010 2011 2012

ToSpeakTM G1

Japanese

ToSpeakTM G2 provides a custom-made

TTS with the voice of a specified person.

ES: 1Q/2012

MP: 2Q/2012

Memory footprint : around 5MB

MIPS : around 30MIPS

ToSpeakTM G1

Chinese Mandarin

Memory footprint : around 8MB

MIPS : around 30MIPS

ToSpeakTM G1

US English

Memory footprint : around 8.5MB

MIPS : around 80MIPS

ToSpeakTM G2

Japanese

Multi

language

Under

Development

- 24 -

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software and systems (collectively “Product”) without notice.

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for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could

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damages or losses occurring as a result of noncompliance with applicable laws and regulations.

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Tel: (011)2539-6681 Fax: (011)2539-6675

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s Düsseldorf Head Office

Tel: (0211)5296-0 Fax: (0211)5296-400

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Tel: (02)2508-9988 Fax: (02)2508-9999

(As of January 1, 2012)

Website: http://www.semicon.toshiba.co.jp/eng

Semiconductor & Storage Products Company

2012

OVERSEAS SUBSIDIARIES AND AFFILIATES 2012-2

K3/$1

ECE0020A

Analog & Imaging IC/Logic LSI

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