AA3021SESK/J3-TR Datasheet by Kingbright

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© 2019 Kingbright. All Rights Reserved. Spec No: DSAN2926 / 1201008713 Rev No: V.3A Date: 05/13/2019
DESCRIPTIONS
The Hyper Red device is based on light emitting diode
chip made from AlGaInP
Electrostatic discharge and power surge could
damage the LEDs
It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs
All devices, equipments and machineries must be
electrically grounded
FEATURES
3.0 mm x 2.0 mm, 1.3 mm high, only minimum
space required
Suitable for compact optoelectronic applications
Low power consumption
Package: 2000 pcs / reel
Moisture sensitivity level: 3
RoHS compliant
APPLICATIONS
Backlight
Status indicator
Home and smart appliances
Wearable and portable devices
Healthcare applications
ATTENTION
Observe precautions for handling
electrostatic discharge sensitive devices
PACKAGE DIMENSIONS
AA3021SESK/J3-TR
3.0 x 2.0 mm Surface Mount LED Lamp
RECOMMENDED SOLDERING PATTERN
(units : mm; tolerance : ± 0.1)
Part Number Emitting Color
(Material) Lens Type
Iv (mcd) @ 20mA [2] Viewing Angle [1]
Min. Typ. 2θ1/2
AA3021SESK/J3-TR Hyper Red (AlGaInP) Water Clear
1000 1500
*300 *450
120°
SELECTION GUIDE
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
* Luminous intensity value is traceable to CIE127-2007 standards.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to
change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
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© 2019 Kingbright. All Rights Reserved. Spec No: DSAN2926 / 1201008713 Rev No: V.3A Date: 05/13/2019
ABSOLUTE MAXIMUM RATINGS at TA=25°C
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
AA3021SESK/J3-TR
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
Parameter Symbol Emitting Color
Value
Unit
Typ. Max.
Wavelength at Peak Emission IF = 20mA λpeak Hyper Red 640 - nm
Dominant Wavelength IF = 20mA λdom [1] Hyper Red 625 - nm
Spectral Bandwidth at 50% Φ REL MAX
IF = 20mA Δλ Hyper Red 20 - nm
Capacitance C Hyper Red 27 - pF
Forward Voltage IF = 20mA VF [2] Hyper Red 2.2 2.8 V
Reverse Current (VR = 5V) IR Hyper Red - 10 µA
Parameter Symbol Value Unit
Power Dissipation PD 84 mW
Reverse Voltage VR 5 V
Junction Temperature Tj 115 °C
Operating Temperature Top -40 to +85 °C
Storage Temperature Tstg -40 to +85 °C
DC Forward Current IF 30 mA
Peak Forward Current IFM [1] 150 mA
Electrostatic Discharge Threshold (HBM) - 3000 V
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© 2019 Kingbright. All Rights Reserved. Spec No: DSAN2926 / 1201008713 Rev No: V.3A Date: 05/13/2019
0
10
20
30
40
50
1.5 1.7 1.9 2.1 2.3 2.5
T
a
= 25 °C
Forward voltage (V)
Forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
0 1020304050
T
a
= 25 °C
Forward current (mA)
Luminous intensity normalised at
20 mA
0
10
20
30
40
50
-40-20 0 20406080100
Ambient temperature (°C)
Permissible forward current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
-40-200 20406080100
Ambient temperature (°C)
Luminous intensity normalised at
T
a
= 25 °C
0.5 0.50.0
-90°
-75°
-60°
-45°
-30°
-15°
75°
60°
45°
30°
15°
90°
1.0 1.0
T
a
= 25 °C
TECHNICAL DATA
0%
20%
40%
60%
80%
100%
350 400 450 500 550 600 650 700 750 800
T
a
= 25 °C
Red
Wavelength (nm)
Relative Intensity (a. u.)
RELATIVE INTENSITY vs. WAVELENGTH
HYPER RED
TAPE SPECIFICATIONS (units : mm)
REEL DIMENSION (units : mm)
REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS
SPATIAL DISTRIBUTION
AA3021SESK/J3-TR
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve Luminous Intensity vs.
Ambient Temperature
Notes:
1. Don't cause stress to the LEDs while it is exposed to high temperature.
2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might
cause damage to the product.
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© 2019 Kingbright. All Rights Reserved. Spec No: DSAN2926 / 1201008713 Rev No: V.3A Date: 05/13/2019
PACKING & LABEL SPECIFICATIONS
AA3021SESK/J3-TR
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes
HANDLING PRECAUTIONS
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is
more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone
encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.
2. Do not directly touch or handle the silicone lens
surface. It may damage the internal circuitry.
1. Handle the component along the
side surfaces by using forceps or
appropriate tools.
4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure
precise pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver
plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such
substances.
3. Do not stack together assembled
PCBs containing exposed LEDs.
Impact may scratch the silicone lens
or damage the internal circuitry.

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