ams Datasheet Page 1
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TCS3772
Color Light‐to‐Digital Converter with
Proximity Sensing
The TCS3772 device family provides red, green, blue, and clear
(RGBC) light sensing and, when coupled with an external IR LED,
proximity detection. These devices detect light intensity under
a variety of lighting conditions and through a variety of
attenuation materials, including dark glass. The proximity
detection feature allows a large dynamic range of operation for
accurate short distance detection, such as in a cell phone, for
detecting when the user positions the phone close to their ear.
An internal state machine provides the ability to put the device
into a low power state in between proximity and RGBC
measurements providing very low average power
consumption.
The color sensing feature is useful in applications such as LED
RGB backlight control, solid state lighting, reflected LED color
sampler, or fluorescent light color temperature detection. With
the addition of an IR blocking filter, the device is an excellent
ambient light sensor, color temperature monitor, and general
purpose color sensor.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of this device are listed below:
Figure 1:
Added Value of Using TCS3772
Benefits Features
Single Device Reduces Board Space Integrated RGB and Clear Color Sensing and Proximity
Detection
Enables Flexible Operation for Wide
Range of Applications Programmable Color Sensing and Proximity Detection
Enables Accurate Color and Ambient
Light Sensing Under Varying Lighting
Conditions
Integrated IR Blocking Filter
Enables Operation within Wide Range of
Lighting Conditions 3.8M:1 Dynamic Range
General Description
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TCS3772 − General Description
Color Light Sensing with IR-Blocking Filter
Programmable Analog Gain and Integration Time
3 800 000:1 Dynamic Range
Very High Sensitivity – Ideally Suited for Operation
Behind Dark Glass
Proximity Detection
Ambient Light Rejection
Programmable Integration Time
Current Sink Driver for External IR LED
Maskable Light and Proximity Interrupt
Programmable Upper and Lower Thresholds with
Persistence Filter
Power Management
Low Power – 2.5-μA Sleep State
•65-μA Wait State with Programmable Wait State Time
from 2.4 ms to > 7 Seconds
I2C Fast Mode Compatible Interface
Data Rates up to 400 kbit/s
Input Voltage Levels Compatible with VDD or 1.8 V Bus
Register Set and Pin Compatible with the TCS3x71 Series
Small 2 mm × 2.4 mm Dual Flat No-Lead (FN) Package
Applications
The applications of TCS3772 include:
RGB LED Backlight Control
Ambient Light Color Temperature Sensing
Cell Phone Touch Screen Disable
Mechanical Switch Replacement
Industrial Process Control
Medical Diagnostics
End Products and Market Segments
HDTVs, Mobile Handsets, Tablets, and Portable Media
Payers
Medical and Commercial Instrumentation
Toys
Solid State and General Lighting
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ams Datasheet Page 3
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TCS3772 − General Description
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
Functional Block Diagram of TCS3772
SCL 2 GND 3 6 SDA 5 INT 4 LDR
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TCS3772 − Pin Assignment
The TCS3772 pin assignments are described below.
Figure 3:
Pin Diagram
Figure 4:
Pin Description
Package FN Dual Flat No-Lead
(Top View):
Package drawing is not to scale.
Pin Number Pin Name Pin Type Description
1VDD Supply voltage
2 SCL Input I²C serial clock input terminal – clock signal for I²C serial data.
3 GND Power supply ground. All voltages are referenced to GND.
4 LDR Output LED driver for proximity emitter – open drain.
5 INT Output Interrupt – open drain (active low).
6 SDA Input/Output I²C serial data I/O terminal — serial data I/O for I²C.
Pin Assignment
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TCS3772 − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Parameter Min Max Units Comments
Supply voltage, VDD 3.8 V All voltages are with respect to GND
Input terminal voltage −0.5 3.8 V
Output terminal voltage (except LDR) −0.5 3.8 V
Output terminal voltage (LDR) −0.5 3.8 V
Output terminal current (except LDR) −1 20 mA
Storage temperature range, TSTRG −40 85 ºC
ESD tolerance, human body model ±2000 V
Absolute Maximum Ratings
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TCS3772 − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Figure 6:
Recommended Operating Conditions
Figure 7:
Operating Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units
VDD Supply voltage
TCS37725 (I²C VBUS = VDD)2.7 3 3.6
V
TCS37727 (I²C VBUS = 1.8 V) 2.7 3 3.3
TAOperating free-air
temperature -30 70 ºC
Symbol Parameter Conditions Min Typ Max Units
IDD Supply current
Active – LDR pulses off 235 330
μAWait state 65
Sleep state - no I²C activity 2.5 10
VOL INT SDA output low voltage
3 mA sink current 0 0.4
V
6 mA sink current 0 0.6
ILEAK
Leakage current, SDA, SCL,
INT pins -5 5
μA
Leakage current, LDR pin -5 5
VIH SCL SDA input high voltage
TCS37725 0.7 VDD V
TCS37727 1.25
VIL SCL SDA input low voltage
TCS37725 0.3 VDD V
TCS37727 0.54
Electrical Characteristics
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TCS3772 − Electrical Characteristics
Figure 8:
Optical Characteristics, VDD = 3 V, TA = 25°C, AGAIN = 16×, ATIME = 0xF6 (unless otherwise noted)(1)
Note(s):
1. The percentage shown represents the ratio of the respective red, green, or blue channel value to the clear channel value.
2. The 465 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength
λD=465nm, spectral halfwidth Δλ½ = 22 nm.
3. The 525 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength
λD=525nm, spectral halfwidth Δλ½ = 35 nm.
4. The 615 nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics: dominant wavelength
λD=615nm, spectral halfwidth Δλ½ = 15 nm.
Figure 9:
RGBC Characteristics, VDD = 3 V, TA = 25°C, AGAIN = 16×, AEN = 1 (unless otherwise noted)
Note(s):
1. Parameter ensured by design and is not tested.
Parameter Test
Conditions
Red
Channel
Green
Channel
Blue
Channel Clear Channel
Unit
Min Max Min Max Min Max Min Typ Max
Re
Irradiance
responsivity
λD= 465 nm(2) 0% 15% 10% 42% 65% 88% 11.0 13.8 16.6
counts
/μW
/cm
2
λD= 525 nm(3) 4% 25% 60% 85% 10% 45% 13.2 16.6 20.0
λD= 615 nm(4) 80% 110% 0% 14% 5% 24% 15.6 19.5 23.4
Parameter Conditions Min Typ Max Units
Dark ADC count value Ee = 0, AGAIN = 60×,
ATIME = 0xD6 (100 ms) 015counts
ADC integration time step size ATIME=0xFF 2.27 2.4 2.56 ms
ADC number of integration steps (1) 1256steps
ADC counts per step (1) 01024counts
ADC count value (1) ATIME=0xC0 (153.6 ms) 0 65535 counts
Gain scaling, relative to 1× gain
setting
3.8 4 4.2
×16× 15 16 16.8
60× 58 60 63
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TCS3772 − Electrical Characteristics
Figure 10:
Proximity Characteristics, VDD = 3 V, TA = 25ºC, PEN = 1 (unless otherwise noted)
Note(s):
1. Parameter is ensured by design or characterization and is not tested.
2. Proximity noise is defined as one standard deviation of 600 samples.
3. Proximity noise typically increases as PPULSE
4. Greater operating distances are achievable with appropriate optical system design considerations. See available ams application
notes for additional information.
5. Maximum operating distance is dependent upon emitter and the reflective properties of the object's surface.
6. Proximity noise test was done using the Figure 11, “Proximity Noise Test Circuit,” on page 9.
Parameter Conditions Min Typ Max Units
IDD
Supply current LDR pulse on 3 mA
ADC conversion time step size PTIME = 0xFF 2.27 2.4 2.56 ms
ADC number of integration
steps (1) 1256steps
ADC counts per step (1) PTIME = 0xFF 0 1023
counts
ADC count value λp = 850 nm, Ee = 770.1 μW/cm2,
PTIME = 0xFB, PPULSE= 1 (3) 1350 1900
counts
ADC output responsivity λp = 850 nm, PTIME = 0xFF,
PPULSE = 1 (3) 0.175 0.211 0.247
counts/
μ
W/
cm
2
Noise (1) (2) (3) Ee = 0, PTIME = 0xFF, PPULSE = 8 (6) 2
% FS
LED pulse count (1) 0 255 pulses
LED pulse period 14.0 μs
LED pulse width – LED on time 6.3 μs
LED drive current ISINK sink current @
1.6 V, LDR pin
PDRIVE = 0 80 106 132 mA
PDRIVE = 1 50
PDRIVE = 2 25
PDRIVE = 3 12.5
Maximum operating
distance (1) (4) (5)
PDRIVE = 0 (100 mA), PPULSE = 64
Emitter: λp = 850 nm, 20° half angle,
and 60 mW/sr
Object: 16 × 20-inch, 90% reflective
Kodak Gray Card (white surface)
Optics: Open view (no glass, no
optical attenuation)
30 inches
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ams Datasheet Page 9
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TCS3772 − Electrical Characteristics
Figure 11:
Proximity Noise Test Circuit
Figure 12:
Wait Characteristics, VDD = 3 V, TA = 25°C, WEN = 1 (unless otherwise noted)
Note(s):
1. Parameter ensured by design and is not tested.
Parameter Conditions Channel Min Typ Max Units
Wait step size WTIME = 0xFF 2.27 2.4 2.56 ms
Wait number of steps (1) 1256steps
‘4Lowa+—’ 1* Hm SCL SDA w—4 a; P 5 Stop scan Con-anion Condllion
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TCS3772 − Timing Characteristics
The timing characteristics of TCS3772 are given below.
Figure 13:
AC Electrical Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
Note(s):
1. Specified by design and characterization; not production tested.
Figure 14:
Parameter Measurement Information
Parameter (1) Description Min Max Units
f(SCL) Clock frequency (I2C only) 0400kHz
t(BUF) Bus free time between start and stop condition 1.3 μs
t(HDSTA) Hold time after (repeated) start condition. After this period,
the first clock is generated. 0.6 μs
t(SUSTA) Repeated start condition setup time 0.6 μs
t(SUSTO) Stop condition setup time 0.6 μs
t(HDDAT) Data hold time 0 μs
t(SUDAT) Data setup time 100 ns
t(LOW) SCL clock low period 1.3 μs
t(HIGH) SCL clock high period 0.6 μs
tFClock/data fall time 300 ns
tRClock/data rise time 300 ns
CiInput pin capacitance 10 pF
Timing Characteristics
Timing Diagrams
300 500 700 Normalized to Clear @ 605 nm 1A = 25%: 900 1100 300 500 700 900 1100
ams Datasheet Page 11
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TCS3772 − Typical Operating Characteristics
Figure 15:
Photodiode Spectral Responsivity RGBC
Figure 16:
Photodiode Spectral Responsivity Proximity
Typical Operating
Characteristics
λ - Wavelength - nm
Relative Responsivity
Relative Responsivity
λ - Wavelength - nm
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TCS3772 − Typical Operating Characteristics
Figure 17:
Normalized Responsivity vs. Angular Displacement
Figure 18:
Normalized Responsivity vs. Angular Displacement
θ - Angular Displacement - °
Normalized Responsivity
Normalized Responsivity
θ - Angular Displacement - °
110% 1 03% / 106% / 104% . 102% ./ / 23/ /WC) / 1 00% m. / 96% 96% 94% 927 2.7 2.8 2.9 3 3.1 3.2 3.3 160 140 um mA / 120 1 00 / 80 / so mA 60 .l/ I/ 25 mA 20 / 7 «25 mA 0 0.5 1 1.5 2 2.5 3
ams Datasheet Page 13
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TCS3772 − Typical Operating Characteristics
Figure 19:
Normalized IDD vs. VDD and Temperature
Figure 20:
Typical LDR Current vs. Voltage
IDD Normalized @ 3 V, 25°C
VDD - V
LDR Current - mA
LDR Voltage - V
“mun Icon 100 400 500 600 700 800 900 1000
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TCS3772 − Typical Operating Characteristics
Figure 21:
Responsivity Temperature Coefficient
Temperature Coefficient - ppm/°C
λ - Wavelength - nm
ams Datasheet Page 15
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TCS3772 − Detailed Description
The TCS3772 is a next-generation digital color light sensor
device containing four integrating analog-to-digital converters
(ADCs) that integrate currents from photodiodes. The device
contains a 3 × 4 photodiode array used for color measurements
and a 1 × 4 photodiode array used for proximity measurements.
Integration of all color sensing channels occurs simultaneously.
Upon completion of the conversion cycle, the conversion result
is transferred to the corresponding data registers. The transfers
are double-buffered to ensure that the integrity of the data is
maintained. Communication with the device is accomplished
through a fast (up to 400 kHz), two-wire I2C serial bus for easy
connection to a microcontroller or embedded controller.
The device provides a separate pin for level-style interrupts. The
interrupt feature simplifies and improves system efficiency by
eliminating the need to poll a sensor for a light intensity value.
When interrupts are enabled, an interrupt is generated when
the value of a clear channel or proximity conversion is greater
than an upper threshold or less than a lower threshold. Once
the interrupt is asserted, it remains asserted until cleared by the
controlling firmware. In addition, a programmable interrupt
persistence filter allows the user to set the number of
consecutive clear channel or proximity conversions outside of
the threshold region that are necessary to trigger an interrupt.
Interrupt thresholds and persistence filter settings are
configured independently for both clear and proximity.
Proximity detection requires only a single external IR LED. An
internal LED driver can be configured to provide a constant
current sink of 12.5 mA, 25 mA, 50 mA, or 100 mA of current. No
external current limiting resistor is required. The number
of proximity LED pulses can be programmed from 1 to
255 pulses. Each pulse has a 14-μs period.
Detailed Description
PON= 1 PON: 0 (IOXDD: b0) (rOXOO: b0) /8\ \o/
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TCS3772 − Principles of Operation
System State Machine
The TCS3772 provides control of RGBC, proximity detection,
and power management functionality through an internal state
machine (Figure 22). After a power-on-reset, the device is in the
sleep mode. As soon as the PON bit is set, the device will move
to the start state. It will then continue through the Prox, Wait,
and RGBC states. If these states are enabled, the device will
execute each function. If the PON bit is set to 0, the state
machine will continue until all conversions are completed and
then go into a low power sleep mode.
Figure 22:
Simplified State Diagram
Note(s): In this document, the nomenclature uses the bit field
name in italics followed by the register number and bit number
to allow the user to easily identify the register and bit that
controls the function. For example, the power on (PON) is in
register 0, bit 0. This is represented as PON (r0x00:b0).
Principles of Operation
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ams Datasheet Page 17
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TCS3772 − Principles of Operation
RGBC Operation
The RGBC engine contains RGBC gain control (AGAIN) and four
integrating analog-to-digital converters (ADC) for the RGBC
photodiodes. The RGBC integration time (ATIME) impacts both
the resolution and the sensitivity of the RGBC reading.
Integration of all four channels occurs simultaneously and upon
completion of the conversion cycle, the results are transferred
to the color data registers. This data is also referred to as
channel count. The transfers are double-buffered to ensure that
invalid data is not read during the transfer. After the transfer,
the device automatically moves to the next state in accordance
with the configured state machine.
Figure 23:
RGBC Operation
The registers for programming the integration and wait times
are a 2's compliment values. The actual time can be calculated
as follows:
ATIME = 256 - Integration Time / 2.4 ms
Inversely, the time can be calculated from the register value as
follows:
Integration Time = 2.4 ms × (256 - ATIME)
For example, if a 100-ms integration time is needed, the device
needs to be programmed to:
256 - (100 / 2.4) = 256 - 42 = 214 = 0xD6
Conversely, the programmed value of 0xC0 would correspond
to:
(256 - 0xC0) × 2.4 = 64 × 2.4 = 154 ms
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TCS3772 − Principles of Operation
Proximity Detection
Proximity detection is accomplished by measuring the amount
of light energy, generally from an IR LED, reflected off an object
to determine its distance. The proximity light source, which is
external to the TCS3772 device, is driven by the integrated
proximity LED current driver.
Figure 24:
Proximity Detection
The LED current driver, output on the LDR terminal, provides a
regulated current sink that eliminates the need for an external
current limiting resistor. PDRIVE sets the drive current to
100 mA, 50 mA, 25 mA. To drive an external light source with
more than 100 mA or to minimize on-chip ground bounce, LDR
c a n b e u s e d t o d r iv e a n ex t e rn a l p-type transistor, which, in turn,
drives the light source.
Referring to the Detailed State Machine figure, the LED
current driver pulses the external IR LED as shown in Figure 25
during the Prox Accum state. Figure 25 also illustrates that the
LED On pulse has a fixed width of 6.3 μs and period of 14.0 μs.
So, in addition to setting the proximity drive current, 1 to 255
proximity pulses (PPULSE) can be programmed. When deciding
on the number of proximity pulses, keep in mind that the signal
increases proportionally to PPULSE, while noise increases by
the square root of PPULSE.
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ams Datasheet Page 19
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TCS3772 − Principles of Operation
Figure 25:
Proximity LED Current Driver Waveform
Figure 24 illustrates light rays emitting from an external IR LED,
reflecting off an object, and being absorbed by the proximity
photodiode.
Referring again to Figure 25, the reflected IR LED and the
background energy is integrated during the LED On time, then
during the LED Off time, the integrated background energy is
subtracted from the LED On time energy, leaving the external
IR LED energy to accumulate from pulse to pulse.
After the programmed number of proximity pulses have been
generated, the proximity ADC converts and scales the proximity
measurement to a 16-bit value, then stores the result in two
8-bit proximity data (PDATAx) registers. ADC scaling is
controlled by the proximity ADC conversion time (PTIME) which
is programmable from 1 to 256 2.4-ms time units. However,
depending on the application, scaling the proximity data will
equally scale any accumulated noise. Therefore, in general, it is
recommended to leave PTIME at the default value of one 2.4-ms
ADC conversion time (0xFF).
Once the first proximity cycle has completed, the proximity
valid (PVALID) bit in the Status register will be set and remain
set until the proximity detection function is disabled (PEN).
For additional information on using the proximity detection
function behind glass and for optical system design guidance,
please see available ams application notes.
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Page 20 ams Datasheet
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TCS3772 − Principles of Operation
Interrupts
The interrupt feature simplifies and improves system efficiency
by eliminating the need to poll the sensor for light intensity or
proximity values outside of a user-defined range. While the
interrupt function is always enabled and it's status is available
in the status register (0x13), the output of the interrupt state
can be enabled using the proximity interrupt enable (PIEN) or
Clear interrupt enable (AIEN) fields in the enable register (0x00).
Four 16-bit interrupt threshold registers allow the user to set
limits below and above a desired light level and proximity
range. An interrupt can be generated when the Clear data
(CDATA) is less than the Clear interrupt low threshold registers
(AILTx) or greater than the Clear interrupt high threshold
registers (AIHTx). Likewise, an out-of-range proximity interrupt
can be generated when the proximity data (PDATA) falls below
the proximity interrupt low threshold (PILTx) or exceeds the
proximity interrupt high threshold (PIHTx).
It is important to note that the thresholds are evaluated in
sequence, first the low threshold, then the high threshold. As a
result, if the low threshold is set above the high threshold, the
high threshold is ignored and only the low threshold is evaluated.
To further control when an interrupt occurs, the device
provides a persistence filter. The persistence filter allows the
user to specify the number of consecutive out-of-range Clear
or proximity occurrences before an interrupt is generated. The
persistence register (0x0C) allows the user to set the Clear
persistence (APERS) and the proximity persistence (PPERS)
values. See the persistence register for details on the
persistence filter values. Once the persistence filter generates
an interrupt, it will continue until a special function interrupt
clear command is received (see command register).
Figure 26:
Programmable Interrupt
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TCS3772 − Principles of Operation
System Timing
The system state machine shown in Figure 22 provides an
overview of the states and state transitions that provide system
control of the device. This section highlights the programmable
features, which affect the state machine cycle time, and
provides details to determine system level timing.
When the proximity detection feature is enabled (PEN), the
state machine transitions through the Prox Accum, Prox Wait,
and Prox ADC states. The Prox Wait time is a fixed 2.4ms,
whereas the Prox Accum time is determined by the number of
proximity LED pulses (PPULSE) and the Prox ADC time is
determined by the integration time (PTIME). The formulas to
determine the Prox Accum and Prox ADC times are given in the
associated boxes in Figure 27. If an interrupt is generated as a
result of the proximity cycle, it will be asserted at the end of the
Prox ADC state.
When the power management feature is enabled (WEN), the
state machine will transition in turn to the Wait state. The wait
time is determined by WLONG, which extends normal operation
by 12× when asserted, and WTIME. The formula to determine
the wait time is given in the box associated with the Wait state
in Figure 27.
When the RGBC feature is enabled (AEN), the state machine will
transition through the RGBC Init and RGBC ADC states. The
RGBC Init state takes 2.4 ms, while the RGBC ADC time is
dependent on the integration time (ATIME). The formula to
determine RGBC ADC time is given in the associated box in
Figure 27. If an interrupt is generated as a result of the RGBC
cycle, it will be asserted at the end of the RGBC ADC.
PPULSE n . 2:5 pulm Tim: M a “31.1qu Range 0 ~ 3 s "s PYIME 1 _ 255 stars Time: 2.4 nus/step Range 21ms- SM ms ATIME 1 _ 256 steps Tune 2 4 ms¢slep Range 24m: _ 61» ms WI'IME ‘ . 255 Shays WLONG . a WLONG .1 Time 2 Amsjs‘rep as a mssmp flange 24m37814lm QEBnIsr737s
Page 22 ams Datasheet
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TCS3772 − Principles of Operation
Figure 27:
Detailed State Diagram
Note(s):
1. There is a 2.4 ms warm‐up delay if PON is enabled. If PON is not enabled, the device will return to the Sleep state as shown.
2. PON, PEN, WEN, and AEN are fields in the Enable register (0x00).
ams Datasheet Page 23
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TCS3772 − Principles of Operation
Power Management
Power consumption can be managed with the Wait state,
because the Wait state typically consumes only 65 μA of IDD
current. An example of the power management feature is given
below. With the assumptions provided in the example, average
IDD is estimated to be 186 μA.
Figure 28:
Power Management
Note(s):
1. Prox Accum - LED ON time = 6.3 μs per pulse × 4 pulses = 25.2 μs = 0.025 ms
2. Prox Accum - LED OFF time = 7.7 μs per pulse × 4 pulses = 30.9 μs = 0.031 ms
Average IDD Current = ((0.025 × 109) + (0.031 × 0.235) + (2.40 × 0.235) + (43.1 × 0.065) + (43.1 × 0.263) + (2.40 × 0.235 × 2)) / 93 186 μA
Keeping with the same programmed values as the example,
Figure 29 shows how the average IDD current is affected by the
Wait state time, which is determined by WEN, WTIME, and
WLONG. Note that the worst-case current occurs when the Wait
state is not enabled.
Figure 29:
Average IDD Current
System State
Machine State
Programmable
Parameter
Programmed
Value Duration Typical
Current
Prox Accum PPULSE 0x04 0.056 ms
Prox Accum - LED ON 0.025 ms (1) 109 mA
Prox Accum - LED OFF 0.031 ms (2) 0.235 mA
Prox Wait 2.40 ms 0.235 mA
Prox ADC PTIME 0xFF 2.40 ms 0.235 mA
Wait
WTIME 0xEE
43.1 ms 0.065 mA
WLONG 0
ALS Init 2.40 ms 0.235 mA
ALS ADC ATIME 0xEE 43.1 ms 0.235 mA
WEN WTIME WLONG WAIT State Average IDD Current
0 n/a n/a 0 ms 289 μA
1 0xFF 0 2.40 ms 279 μA
1 0xEE 0 43.1 ms 186 μA
1 0x00 0 613 ms 82 μA
10x00 1 7.36 s 67 μA
1 7 I I B 1 B I ' IsI Slmnaam I w IAI commnflcodo IAI umam IA I IEI IZC Write Protocol 1 7 1 1 a 1 1 1 ISI Sthddn-s I a IAI um IAI Data IA I E IZC Head Fralocol I 7 I V E I I 7 I 1 ISI SlmAddnsl IWIAI Commndcoh IAIer SIIVIMIIH IRIAI———| IZC Read Protocol — Combined Format DUE
Page 24 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − I²C Protocol
Interface and control are accomplished through an I²C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I²C addressing protocol.
The I²C standard provides for three types of bus transaction:
read, write, and a combined protocol (Figure 30). During a write
operation, the first byte written is a command byte followed by
data. In a combined protocol, the first byte written is the
command byte followed by reading a series of bytes. If a read
command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control
information or a 5-bit register address. The control commands
can also be used to clear interrupts.
The I²C bus protocol was developed by Philips (now NXP).
For a complete description of the I²C protocol, please review
the NXP I²C design specification at:
http://www.i2c-bus.org/references/.
Figure 30:
I²C Protocols
I²C Protocol
Repeated Start Condition
Write (0)
Continuation of Protocol
Master - to - Slave
Slave - to - Master
Sr
W
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
A
N
P
R
S
ams Datasheet Page 25
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Register Description
The TCS3772 is controlled and monitored by data registers and
a command register accessed through the serial interface.
These registers provide for a variety of control functions and
can be read to determine results of the ADC conversions. The
register set is summarized in Figure 31.
Figure 31:
Register Set
Address Register Name R/W Register Function Reset Value
-- COMMAND W Specifies register address 0x00
0x00 ENABLE R/W Enables states and interrupts 0x00
0x01 ATIME R/W RGBC time 0xFF
0x02 PTIME R/W Proximity time 0xFF
0x03 WTIME R/W Wait time 0xFF
0x04 AILTL R/W Clear interrupt low threshold low byte 0x00
0x05 AILTH R/W Clear interrupt low threshold high byte 0x00
0x06 AIHTL R/W Clear interrupt high threshold low byte 0x00
0x07 AIHTH R/W Clear interrupt high threshold high byte 0x00
0x08 PILTL R/W Proximity interrupt low threshold low byte 0x00
0x09 PILTH R/W Proximity interrupt low threshold high byte 0x00
0x0A PIHTL R/W Proximity interrupt high threshold low byte 0x00
0x0B PIHTH R/W Proximity interrupt high threshold high byte 0x00
0x0C PERS R/W Interrupt persistence filters 0x00
0x0D CONFIG R/W Configuration 0x00
0x0E PPULSE R/W Proximity pulse count 0x00
0x0F CONTROL R/W Gain control register 0x00
0x12 ID R Device ID ID
0x13 STATUS R Device status 0x00
0x14 CDATA R Clear ADC data low byte 0x00
0x15 CDATAH R Clear ADC data high byte 0x00
0x16 RDATA R Red ADC data low byte 0x00
0x17 RDATAH R Red ADC data high byte 0x00
0x18 GDATA R Green ADC data low byte 0x00
0x19 GDATAH R Green ADC data high byte 0x00
Register Description
Page 26 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Register Description
The mechanics of accessing a specific register depends on the
specific protocol used. See the section on I²C protocols on the
previous pages. In general, the COMMAND register is written
first to specify the specific control/status register for following
read/write operations.
0x1A BDATA R Blue ADC data low byte 0x00
0x1B BDATAH R Blue ADC data high byte 0x00
0x1C PDATA R Proximity ADC data low byte 0x00
0x1D PDATAH R Proximity ADC data high byte 0x00
Address Register Name R/W Register Function Reset Value
ams Datasheet Page 27
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Register Description
Command Register
The COMMAND registers specifies the address of the target
register for future write and read operations.
Figure 32:
Command Register
76543210
CMD TYPE ADDR/SF
Field Bits Description
CMD 7 Select Command Register. Must write as 1 when addressing COMMAND register.
TYPE 6:5
Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE INTEGRATION TIME
00 Repeated byte protocol transaction
01 Auto-increment protocol transaction
10 Reserved – Do not use
11 Special function – See description below
Byte protocol will repeatedly read the same register with each data access. Block
protocol will provide auto-increment function to read successive bytes.
ADDR/SF 4:0
Address field/special function field. Depending on the transaction type, see
above, this field either specifies a special function command or selects the
specific control-status-register for following write and read transactions. The field
values listed below apply only to special function commands:
FIELD VALUE READ VALUE
00101 Proximity interrupt clear
00110 Clear channel interrupt clear
00111 Proximity and Clear interrupt clear
Other Reserved – Do not write
The ALS and Proximity interrupt clear special functions clear any pending
interrupt(s) and are self clearing.
Page 28 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Register Description
Enable Register (0x00)
The ENABLE register is used primarily to power the TCS3772
device on and off, and enable functions and interrupts as shown
below.
Figure 33:
Enable Register
765 4 321 0
Reserved PIEN AIEN WEN PEN AEN PON
Fields Bits Description
Reserved 7:6 Reserved. Write as 0.
PIEN 5 Proximity interrupt enable. When asserted, permits proximity interrupts to
be generated.
AIEN 4 Clear channel interrupt enable. When asserted, permits Clear interrupts to
be generated.
WEN 3 Wait enable. This bit activates the wait feature. Writing a 1 activates the wait
timer. Writing a 0 disables the wait timer.
PEN 2 Proximity enable. This bit activates the proximity function. Writing a 1
enables proximity. Writing a 0 disables proximity.
AEN 1 RGBC enable. This bit actives the two-channel ADC. Writing a 1 activates
RGBC. Writing a 0 disables RGBC.
PON 0
Power ON. This bit activates the internal oscillator to permit the timers and
ADC channels to operate. Writing a 1 activates the oscillator. Writing a 0
disables the oscillator. During reads and writes over the I²C interface, this bit
is temporarily overridden and the oscillator is enabled, independent of the
state of PON.
ams Datasheet Page 29
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Register Description
RGBC Time Register (0x01)
The RGBC timing register controls the internal integration time
of the RGBC clear and IR channel ADCs in 2.4-ms increments.
Upon power up, the RGBC time register is set to 0xFF.
Figure 34:
RGBC Time Register
Proximity Time Register (0x02)
The proximity timing register controls the integration time of
the proximity ADC in 2.4 ms increments. Upon power up, the
proximity time register is set to 0xFF. It is recommended that
this register be programmed to a value of 0xFF (1 integration
cycle).
Max Prox Count = ((256 - PTIME) × 1024)) - 1 up to a maximum
of 65535.
Figure 35:
Proximity Time Register
Fields Bits Description
ATIME 7:0
VALUE INTEG_CYCLES TIME MAX COUNT
0xFF 1 2.4 ms 1024
0xF6 10 24 ms 10240
0xD6 42 101 ms 43008
0xAD 64 154 ms 65535
0x00 256 614 ms 65535
Fields Bits Description
PTIME 7:0
VALUE INTEG_CYCLES TIME MAX COUNT
0xFF 1 2.4 ms 1023
Page 30 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Register Description
Wait Time Register (0x03)
Wait time is set 2.4 ms increments unless the WLONG bit is
asserted, in which case the wait times are 12× longer. WTIME is
programmed as a 2’s complement number.
Figure 36:
Wait Time Register
Note(s):
1. The Proximity Wait Time Register should be configured before PEN and/or AEN is/are asserted.
Fields Bits Description
WTIME 7:0
REGISTER VALUE WAIT TIME TIME (WLONG = 0) TIME (WLONG = 1)
0xFF 1 2.4 ms 0.029 s
0xAB 85 204 ms 2.45 s
0x00 256 614 ms 7.4 s
ams Datasheet Page 31
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Register Description
Clear Interrupt Threshold Registers
(0x04 - 0x07)
The CLEAR INTERRUPT THRESHOLD registers provides the
values to be used as the high and low trigger points for the
comparison function for interrupt generation. If the value
generated by the clear channel crosses below the lower
threshold specified, or above the higher threshold, an interrupt
is asserted on the interrupt pin.
Figure 37:
Clear Interrupt Threshold Registers
Proximity Interrupt Threshold Registers
(0x08 - 0x0B)
The PROXIMITY INTERRUPT THRESHOLD registers provide the
values to be used as the high and low trigger points for the
comparison function for interrupt generation. If the value
generated by proximity channel crosses below the lower
threshold specified, or above the higher threshold, an interrupt
is signalled to the host processor.
Figure 38:
Proximity Interrupt Threshold Registers
Register Address Bits Description
AILTL 0x04 7:0 Clear channel low threshold lower byte
AILTH 0x05 7:0 Clear channel low threshold upper byte
AIHTL 0x06 7:0 Clear channel high threshold lower byte
AIHTH 0x07 7:0 Clear channel high threshold upper byte
Register Address Bits Description
PILTL 0x08 7:0 Proximity ADC channel low threshold lower byte
PILTH 0x09 7:0 Proximity ADC channel low threshold upper byte
PIHTL 0x0A 7:0 Proximity ADC channel high threshold lower byte
PIHTH 0x0B 7:0 Proximity ADC channel high threshold upper byte
2:! ya
Page 32 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Register Description
Persistence Filter Register (0x0C)
The PERSISTENCE FILTER register controls the filtering interrupt
capabilities of the device. Configurable filtering is provided to
allow interrupts to be generated after each integration cycle or
if the integration has produced a result that is outside of the
values specified by the threshold register for some specified
amount of time. Separate filtering is provided for proximity and
the clear channel.
Figure 39:
Persistence Filter Register
76543210
PPERS APERS
Field Bits Description
PPERS 7:4
Proximity interrupt persistence. Controls rate of proximity interrupt to the host
processor.
FIELD VALUE INTERRUPT PERSISTENCE FUNCTION
0000 Every proximity cycle generates an interrupt
0001 1 proximity value out of range
0010 2 consecutive proximity values out of range
... ...
1111 15 consecutive proximity values out of range
ams Datasheet Page 33
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Register Description
Configuration Register (0x0D)
The CONFIGURATION register sets the wait long time
Figure 40:
Configuration Register
APERS 3:0
Clear Interrupt persistence. Controls rate of Clear channel interrupt to the host
processor.
FIELD VALUE INTERRUPT PERSISTENCE FUNCTION
0000 Every RGBC cycle generates an interrupt
0001 1 clear channel value outside of threshold range
0010 2 clear channel consecutive values out of range
0011 3 clear channel consecutive values out of range
0100 5 clear channel consecutive values out of range
0101 10 clear channel consecutive values out of range
0110 15 clear channel consecutive values out of range
0111 20 clear channel consecutive values out of range
1000 25 clear channel consecutive values out of range
1001 30 clear channel consecutive values out of range
1010 35 clear channel consecutive values out of range
1011 40 clear channel consecutive values out of range
1100 45 clear channel consecutive values out of range
1101 50 clear channel consecutive values out of range
1110 55 clear channel consecutive values out of range
1111 60 clear channel consecutive values out of range
765 4 321 0
Reserved WLONG Reserved
Fields Bits Description
Reserved 7:2 Reserved. Write as 0.
WLONG 1Wait Long. When asserted, the wait cycles are increased by a factor 12× from
that programmed in the WTIME register.
Reserved 0 Reserved. Write as 0.
Field Bits Description
Page 34 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Register Description
Proximity Pulse Count Register (0x0E)
The PROXIMITY pulse count register sets the number of
proximity pulses that will be transmitted
Figure 41:
Proximity Pulse Count Register
Control Register (0x0F)
The CONTROL register provides eight bits of miscellaneous
control to the analog block.
Figure 42:
Control Register
765 4 321 0
PPULSE
Fields Bits Description
PPULSE 7:0 Proximity Pulse Count. Specifies the number of proximity pulses to be
generated.
765 4 321 0
PDRIVE Reserved AGAIN
Fields Bits Description
PDRIVE 7:6
Reserved. Write as 0.
FIELD VALUE LED STRENGTH
00 100 mA
01 50 mA
10 25 mA
11 12.5 mA
Reserved 5:2 Reserved. Write bits as 0
AGAIN 1:0
RGBC Gain Control.
FIELD VALUE RGBC GAIN VALUE
00 1× gain
01 4× gain
10 16× gain
11 60× gain
ams Datasheet Page 35
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Register Description
ID Register (0x12)
The ID Register provides the value for the part number. The ID
register is a read-only register.
Figure 43:
ID Register
Status Register (0x13)
The STATUS Register provides the internal status of the device.
This register is read only.
Figure 44:
Status Register
76543210
ID
Field Bits Description
ID 7:0 Part number identification
0x40 = TCS37725
0x49 = TCS37727
7654321 0
Reserved PINT AINT Reserved PVALID AVALID
Field Bits Description
Reserved 7:6 Reserved.
PINT 5 Proximity Interrupt.
AINT 4 Clear channel Interrupt.
Reserved 3:2 Reserved.
PVALID 1 Proximity Valid. Indicates that a proximity cycle has completed since PEN was
asserted.
AVALID 0 RGBC Valid. Indicates that the RGBC cycle has completed since AEN was asserted.
Page 36 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Register Description
RGBC Channel Data Registers (0x14 - 0x1B)
Clear, red, green, and blue data is stored as 16-bit values. To
ensure the data is read correctly, a two-byte read I²C transaction
should be used with a read word protocol bit set in the
command register. With this operation, when the lower byte
register is read, the upper eight bits are stored into a shadow
register, which is read by a subsequent read to the upper byte.
The upper register will read the correct value even if additional
ADC integration cycles end between the reading of the lower
and upper registers.
Figure 45:
RGBC Channel Data Registers
Proximity Data Registers (0x1C - 0x1D)
Proximity data is stored as a 16-bit value. To ensure the data is
read correctly, a two-byte read I²C transaction should be used
with a read word protocol bit set in the command register. With
this operation, when the lower byte register is read, the upper
eight bits are stored into a shadow register, which is read by a
subsequent read to the upper byte. The upper register will read
the correct value even if additional ADC integration cycles end
between the reading of the lower and upper registers.
Figure 46:
Proximity Data Registers
Register Address Bits Description
CDATA 0x14 7:0 Clear data low byte
CDATAH 0x15 7:0 Clear data high byte
RDATA 0x16 7:0 Red data low byte
RDATAH 0x17 7:0 Red data high byte
GDATA 0x18 7:0 Green data low byte
GDATAH 0x19 7:0 Green data high byte
BDATA 0x1A 7:0 Blue data low byte
BDATAH 0x1B 7:0 Blue data high byte
Register Address Bits Description
PDATA 0x1C 7:0 Proximity data low byte
PDATAH 0x1D 7:0 Proximity data high byte
Vollage Regulalov voltage flegulalov Vnu INT .. L .1 , Hp ; Hp \- HM y—L GND T053712 i 1 SCL LDR SDA * Cap Value Pal negumur Manufacturer Recummandannn
ams Datasheet Page 37
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Application Information: Hardware
LED Driver Pin with Proximity Detection
In a proximity sensing system, the IR LED can be pulsed by the
TCS3772 with more than 100 mA of rapidly switching current,
therefore, a few design considerations must be kept in mind to
get the best performance. The key goal is to reduce the power
supply noise coupled back into the device during the LED
pulses.
The first recommendation is to use two power supplies; one for
the device VDD and the other for the IR LED. In many systems,
there is a quiet analog supply and a noisy digital supply. By
connecting the quiet supply to the VDD pin and the noisy supply
to the LED, the key goal can be meet. Place a 1-μF low-ESR
decoupling capacitor as close as possible to the VDD pin and
another at the LED anode, and a 22-μF capacitor at the output
of the LED voltage regulator to supply the 100-mA current
surge.
Figure 47:
Proximity Sensing Using Separate Power Supplies
If it is not possible to provide two separate power supplies, the
device can be operated from a single supply. A 22-Ω resistor in
series with the VDD supply line and a 1-μF low ESR capacitor
effectively filter any power supply noise. The previous capacitor
placement considerations apply.
Application Information:
Hardware
Voltag: Regulamr Von GND TCS3712 mr SCL SDA Vsus
Page 38 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Application I nformation: Hardware
Figure 48:
Proximity Sensing Using Single Power Supply
VBUS in the above figures refers to the I²C bus voltage which is
either VDD or 1.8 V. Be sure to apply the specified I²C bus voltage
shown in the Available Options table for the specific device
being used.
The I²C signals and the Interrupt are open-drain outputs and
require pull-up resistors. The pull-up resistor (RP) value is a
function of the I²C bus speed, the I²C bus voltage, and the
capacitive load. The ams EVM running at 400 kbit/s, uses 1.5-kΩ
resistors. A 10-kΩ pull-up resistor (RPI) can be used for the
interrupt line.
4— 2.70 —> Limo 4% hing)!» T 7 ‘ 0.35 x s T i 0.65 0.65 L- -
ams Datasheet Page 39
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Application Information: Hardware
PCB Pad Layout
Suggested land pattern based on the IPC-7351B Generic
Requirements for Surface Mount Design and Land Pattern
Standard (2010) for the small outline no-lead (SON) package is
shown in Figure 49.
Figure 49:
Suggested FN Package PCB Layout (Top View)
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
PACKAGE FN Dual Fla! Na-Lead TOP VIEW 1—H 49mm pm our i 7 TOP VIEW pm I # \ k ’ F Van I 6 SDA one I x w 2400 1 75 47 E fl k SOL 2 5 INT -\ L 4" GND 3 4 LDR \_l 4 \» thodmde Naive Area END VIEW SIDE VIEW T _7i Nominal 550 t 50 ¢ \* 650% \H‘ f asc zoo ‘ so (Nola a) EOTIOM VIEW (E at Solder Contact: and Pnomasoae Amy Area (Mole 2) ) / Lima: 15 Numlnal i Q or Solder Contact: f QM Phomdiad- Anay Am {Mon 2) PIN I 4—».7 75a: ma
Page 40 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Package Drawings & Markings
Figure 50:
Package FN – Dual Flat No-Lead Packaging Configuration
Note(s):
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerance of ± 75 μm.
3. Double-Half Etch (DHE) is 97 ± 20 μm. Non-DHE is 203 ± 8 μm.
4. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
5. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
6. This package contains no lead (Pb).
7. This drawing is subject to change without notice.
Package Drawings & Markings
Green
RoHS
TOP VIEW H7 2.00 t (ms 1.75 4.00 ~4—9 “—>7 4.00 ,, mso i c 0.30 am - 0.1 u 3.50 x 0.05 DETAIL A DETAIL B .1. jL 2.21 g 0.05 4.4—4 t 0.02 0.53 $0.05 ‘4—47 2.61 t 0.05 A0 Kg Ea
ams Datasheet Page 41
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Carrier Tape & Reel Information
Figure 51:
Package FN Carrier Tape
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing A0, B0, and K0 are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to sprocket holes in the tape.
7. This drawing is subject to change without notice.
Carrier Tape & Reel Information
Page 42 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Soldering and Storage Information
Soldering Information
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 52:
Solder Reflow Profile
Figure 53:
Solder Reflow Profile Graph
Note(s):
1. Not to scale – for reference only.
Parameter Reference Device
Average temperature gradient in preheating 2.5°C/s
Soak time tsoak 2 to 3 minutes
Time above 217°C (T1)t
1Max 60 s
Time above 230°C (T2)t
2Max 50 s
Time above Tpeak -10°C (T3)t
3Max 10 s
Peak temperature in reflow Tpeak 260°C
Temperature gradient in cooling Max -5°C/s
Soldering and Storage
Information
t3
t2
t1
tsoak
T3
T2
T1
Tpeak
Not to scale — for reference o
Time (s)
Temperature (5C)
ams Datasheet Page 43
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Soldering and Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping. Devices are dry packed in a sealed
aluminized envelope called a moisture-barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
Shelf Life: 12 months
Ambient Temperature: < 40°C
Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The FN package has been assigned a moisture sensitivity level
of MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
Floor Life: 168 hours
Ambient Temperature: < 30°C
Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
Page 44 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Ordering & Contact Information
Figure 54:
Ordering Information
Note(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Ordering Code Device Address Package-Leads Interface Description
TCS37725FN TCS37725(1) 0x29 FN−6 I²C VBUS = VDD Interface
TCS37727FN TCS37727 0x29 FN−6 I²C VBUS = 1.8 V Interface
Ordering & Contact Information
ams Datasheet Page 45
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
RoHS Compliant & ams Green
Statement
Page 46 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Copyrights & Disclaimer
ams Datasheet Page 47
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Document Status
Document Status Product Status Definition
Product Preview Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Preliminary Datasheet Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Datasheet Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Datasheet (discontinued) Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Document Status
Page 48 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Revision Information
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Changes from 1-00 (2016-Aug-22) to current revision 1-01 (2018-Mar-14) Page
Updated Figure 6 and 7 6
Updated Figure 43 35
Updated Figure 54 44
Revision Information
ams Datasheet Page 49
[v1-01] 2018-Mar-14 Document Feedback
TCS3772 − Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 End Products and Market Segments
3 Block Diagram
4 Pin Assignment
5Absolute Maximum Ratings
6 Electrical Characteristics
10 Timing Characteristics
10 Timing Diagrams
11 Typical Operating Characteristics
15 Detailed Description
16 Principles of Operation
16 System State Machine
17 RGBC Operation
18 Proximity Detection
20 Interrupts
21 System Timing
23 Power Management
24 I²C Protocol
25 Register Description
27 Command Register
28 Enable Register (0x00)
29 RGBC Time Register (0x01)
29 Proximity Time Register (0x02)
30 Wait Time Register (0x03)
31 Clear Interrupt Threshold Registers
(0x04 - 0x07)
31 Proximity Interrupt Threshold Registers
(0x08 - 0x0B)
32 Persistence Filter Register (0x0C)
33 Configuration Register (0x0D)
34 Proximity Pulse Count Register (0x0E)
34 Control Register (0x0F)
35 ID Register (0x12)
35 Status Register (0x13)
36 RGBC Channel Data Registers (0x14 - 0x1B)
36 Proximity Data Registers (0x1C - 0x1D)
37 Application Information: Hardware
37 LED Driver Pin with Proximity Detection
39 PCB Pad Layout
40 Package Drawings & Markings
41 Carrier Tape & Reel Information
42 Soldering and Storage Information
42 Soldering Information
43 Storage Information
43 Moisture Sensitivity
Content Guide
Page 50 ams Datasheet
Document Feedback [v1-01] 2018-Mar-14
TCS3772 − Content Guide
43 Shelf Life
43 Floor Life
43 Rebaking Instructions
44 Ordering & Contact Information
45 RoHS Compliant & ams Green Statement
46 Copyrights & Disclaimer
47 Document Status
48 Revision Information

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