SP3031 Series Datasheet by Littelfuse Inc.

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©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 07/02/19
Low Capacitance ESD Protection - SP3031
Description
Features
Applications
The SP3031 is a single channel low capacitance diode
that provides protection for electronic equipment that
may experience destructive electrostatic discharges
(ESD). This robust diode can safely absorb repetitive ESD
strikes above the maximum level specified in the IEC
61000-4-2 international standard (Level 4, ±8 kV contact
discharge and ±15 kV air discharge) without performance
degradation. The low loading capacitance makes it ideal for
protecting high speed datalines.
• RoHS compliant, lead-free
and halogen-free
• ESD protection of ±10kV
contact discharge,
±15kV air discharge, (IEC
61000-4-2)
• EFT, IEC 61000-4-4, 40A
(5/50ns)
Lightning protection, IEC
61000-4-5, 2nd Edition:
8/20μs Surge, 5A Surge
• Low capacitance of 0.8pF
@ VR=0V
Low leakage current of
1μA at 5V
Moisture Sensitivity
Level(MSL-1)
AEC-Q101 Qaulified
• USB 2.0, Ethernet
• MHL/MIPI/MDDI
• HDMI, Display Port,
eSATA
• Set Top Boxes, Game
Consoles
• Smart Phones
• External Storage
• Ultrabooks, Notebooks
Tablets, eReaders
• Automotive
Pinout
Functional Block Diagram
1
2
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
USB2.0 Application Example
SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS
1
2
Signal GND
USB2.0 Port
SP3031 (x2)
VBUS
D+
D-
IC
USB Controller
*Package is shown as transparent
SP1003
RoHS
Pb
GREEN
Additional Information
Datasheet Samples
Resources
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 07/02/19
Low Capacitance ESD Protection - SP3031
SP3031
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at
these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 5.0 A
TOP Operating Temperature –40 to 125 °C
TSTOR Storage Temperature –55 to 150 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Ty p Max Units
Reverse Standoff Voltage VRWM IR=1μA 5.0 V
Breakdown Voltage VBR IR=1mA 6.0 V
Reverse Leakage Current ILEAK VR=5V 1 µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, I/O to GND 6.9 V
IPP=2A, tp=8/20µs, I/O to GND 7. 5 V
Dynamic Resistance2RDYN TLP, tp=100ns, I/O to GND 0.6 Ω
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact) ±10 kV
IEC 61000-4-2 (Air) ±15 kV
Diode Capacitance1CI/O-I/O Reverse Bias=0V, f= 1 MHz 0.8 pF
Note: 1. Parameter is guaranteed by design and/or component characterization.
2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
Capacitance vs. Reverse Voltage
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.01.0 2.03.0 4.05.0
Capacitance (pF)
DC Bias (V)
Insertion Loss (S21) I/O to GND
8/20µs Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
-5
Frequency (MHz)
-10
-15
-20
-25
0
-30
-35
10 100 1000
Attenuation (dB)
% Littelfuse‘ mm. mm \ Mm; Damn a: It I 7mm”. mu. sousaz fK P cater
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 07/02/19
Low Capacitance ESD Protection - SP3031
Soldering Parameters
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-downRamp-d
o
Critical Zone
TL to TP
ritical Zon
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Ordering Information
Part Number Package Min. Order Qty.
SP3031-01ETG SOD882 10000
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Substitute Material Silicon
Body Material Molded Compound
Flammability UL Recognized compound meeting
flammability rating V-0
Part Numbering System Part Marking System
SP 3031 01 E T G
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA® Diodes)
E: SOD882
f
SOD882
Product ID
Pin 1 Indicator
% Lilleliuse‘ szmseApphed \ Arm-.2 mm TOP VIEW C + + SIDEVIEW W J V m; EOTIOM VIEW r W Va $ w u ssmns n Autumn 7mm 9 $ $ 4 onmwns : R W’ E) ,HJHHI 1r1r1l—Ir1r—I ananmrL “ [JKLLJLJLILJLI LITLllTJLllTlL‘ W *-—“ A. 4‘ _A smmnw 8mmTAPE AND REEL Deviceoriemafion in Tape 0 0 mass HOLE + +Idjmm EI\EI III El El ’ 43m A m." m... Pin 1 Localion 71km“
©2019 Littelfuse, Inc.
Specifications are subject to change without notice.
TVS Diode Array (SPA ® Diodes)
Revision: 07/02/19
Low Capacitance ESD Protection - SP3031
Embossed Carrier Tape & Reel Specification — SOD882
Package Dimensions — SOD882
Recommended Soldering
Pad Layout
Symbol Millimeters
A0 0.70±0.045
B0 1.10±0.045
K0 0.65±0.045
F3.50±0.05
P1 2.00±0.10
W8.00 + 0.30 -0.10
Symbol
Package SOD882
JEDEC MO-236
Millimeters Inches
Min Ty p Max Min Ty p Max
A0.90 1. 0 0 1. 10 0.035 0.039 0.043
B0.50 0.60 0.70 0.020 0.024 0.028
C0.40 0.50 0.60 0.016 0.020 0.024
D0.45 0.018
E0.20 0.25 0.35 0.008 0.010 0.012
F0.45 0.50 0.55 0.018 0.020 0.022
Notes :
1. All dimensions are in millimeters
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
,Ref.
,Ref.
,Ref.

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