Adhesives, Epoxies, Greases, Pastes

Results: 6
Size / Dimension
3 lb Container5 gal Container18 lb Container1.36 kg Container8.16 kg Container
Color
BlackBlue
Shelf Life
6 Months12 Months18 Months
Storage/Refrigeration Temperature
64.4°F ~ 77°F (18°C ~ 25°C)77°F (25°C)-
Stocking Options
Environmental Options
Media
Marketplace Product
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Price
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Size / Dimension
Usable Temperature Range
Color
Thermal Conductivity
Features
Shelf Life
Storage/Refrigeration Temperature
1188124
1188124
STYCAST 2850FT BLU 3# INDIVIDUAL
LOCTITE
12
In Stock
1 : $1,158.57000
Bulk
Bulk
Active
Epoxy, 2 Part (Order Catalyst Separately)
3 lb Container
-85°F ~ 221°F (-65°C ~ 105°C)
Blue
-
-
12 Months
64.4°F ~ 77°F (18°C ~ 25°C)
1188119
1188119
STYCAST 2850FT BLK18# 8.16KG
LOCTITE
4
In Stock
1 : $2,038.48000
Bulk
Bulk
Active
Epoxy, 2 Part (Order Catalyst Separately)
8.16 kg Container
-85°F ~ 221°F (-65°C ~ 105°C)
Black
-
-
18 Months
64.4°F ~ 77°F (18°C ~ 25°C)
1188118
1188118
STYCAST 2850FT BLK 3# 1.36KG
LOCTITE
1
In Stock
1 : $1,097.47000
Bulk
Bulk
Active
Epoxy, 2 Part (Order Catalyst Separately)
1.36 kg Container
-85°F ~ 221°F (-65°C ~ 105°C)
Black
-
-
12 Months
64.4°F ~ 77°F (18°C ~ 25°C)
1188125
1188125
STYCAST 2850FT BLU18#
LOCTITE
0
In Stock
Check Lead Time
4 : $2,152.36500
Bulk
Bulk
Active
Epoxy, 2 Part (Order Catalyst Separately)
18 lb Container
-85°F ~ 221°F (-65°C ~ 105°C)
Blue
-
-
18 Months
64.4°F ~ 77°F (18°C ~ 25°C)
2055134
2055134
STYCAST 2850FT BK, 5 GAL PA
LOCTITE
0
In Stock
Check Lead Time
10 : $3,398.81200
Bulk
Bulk
Active
Epoxy, 2 Part (Order Catalyst Separately)
5 gal Container
-85°F ~ 221°F (-65°C ~ 105°C)
Black
-
-
12 Months
-
2056963
2056963
STYCAST 2850FT BK 5GAL, 5 GAL PA
LOCTITE
0
In Stock
Check Lead Time
1 : $5,380.10000
Bulk
Bulk
Active
Epoxy, 2 Part (Order Catalyst Separately)
5 gal Container
-85°F ~ 221°F (-65°C ~ 105°C)
Black
-
-
6 Months
77°F (25°C)
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Adhesives, Epoxies, Greases, Pastes


Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.