Power Driver Modules

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Configuration	Current	Voltage	Voltage - Isolation	Grade	Qualification	Mounting Type	Package / Case
LMG3522R030RQSR 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	1,639 In Stock	1 : $211.90000 Cut Tape (CT) 2,000 : $106.10330 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount	52-VQFN Exposed Pad
LMG3522R030QRQSTQ1 AUTOMOTIVE 650-V 30-M GAN FET WI Texas Instruments	250 In Stock	1 : $291.14000 Cut Tape (CT) 250 : $200.86492 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	Automotive	AEC-Q100	Surface Mount, Wettable Flank	52-VQFN Exposed Pad
LMG3526R030RQST 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	250 In Stock	1 : $258.88000 Cut Tape (CT) 250 : $194.51468 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount, Wettable Flank	52-VQFN Exposed Pad
LMG3526R030RQSR 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	1,819 In Stock	1 : $226.12000 Cut Tape (CT) 2,000 : $149.82518 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount, Wettable Flank	52-VQFN Exposed Pad
LMG3522R030RQST 650-V 30-M GAN FET WITH INTEGRAT Texas Instruments	523 In Stock	1 : $242.78000 Cut Tape (CT) 250 : $165.64804 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Obsolete	MOSFET	Half Bridge Inverter	55 A	650 V	-	-	-	Surface Mount	52-VQFN Exposed Pad
LMG3522R030QRQSRQ1 AUTOMOTIVE 650-V 30-M GAN FET WI Texas Instruments	0 In Stock Check Lead Time	2,000 : $126.95794 Tape & Reel (TR)	-	Tape & Reel (TR)	Active	MOSFET	Half Bridge Inverter	55 A	650 V	-	Automotive	AEC-Q100	Surface Mount, Wettable Flank	52-VQFN Exposed Pad

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Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.