Quick Dive Information on the Latest Product Additions and New Components.
Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.
3M™ series 8926 thermally conductive interface tapes are filled with conductive ceramic particles for good converting availability, handling, and reworkability.
Parker Chomerics' THERM-A-GAP™ 974 is supplied with pressure sensitive adhesive for ease of use.
Parker Chomerics' THERM-A-GAP™ 976 features fiberglass reinforced for improved tear strength and improved rework capabilities.
Parker Chomerics' T670 thermal grease with 3.0 W/m-K thermal conductivity is ideal for applications requiring thin bond lines.
Parker Chomerics' THERM-A-FORM is a dispensable form-in-place compound designed for heat transfer without compressive force in electronics cooling applications.
Parker Chomerics' THERMATTACH® T411 provides bonding between electronic components and heat sinks, notably on plastic packages and low surface energy materials.
Parker Chomerics' THERMATTACH® T412 provides superior thermal conductivity and exceptional bonding properties between electronic components and heatsinks.
Parker Chomerics' THERMATTACH T418 offers excellent reliability when exposed to thermal, mechanical, and environmental conditioning.
Parker Chomerics' THERMFLOW T558 is designed to completely fill interfacial air gaps and voids within electronics assemblies.
Parker Chomerics' THERMFLOW T725 is designed to completely fill interfacial air gaps and voids within electronics assemblies.
Laird's SuperCool TEAs offer precise temperature control of small chambers and are available in air-to-air, direct-to-air, and liquid-to-air versions.
Delta Superflo bearing fans are the culmination of innumerable hours of research and development that result in newly augmented mechanical structures.
Sanyo Denki's San Ace C270 9B1TP and San Ace C270 9B1TS bracket-mounted centrifugal fans are available in two sizes with an air inlet integrated into the unit.
Parker Chomerics' THERM-A-GAP™ Gel 30 high performance fully cured dispensable gel requires no mixing or curing, providing superior design flexibility.
Parker Chomerics' T-Wing® thin heat spreaders permit nearly 100% adhesive contact with non-flat package surfaces, optimizing thermal and mechanical performance.
Parker Chomerics' THERM-A-GAP™ 579 thermally conductive gap filler pads features a high tack surface reducing contact resistance.
Parker Chomerics' THERM-A-GAP™ HCS10 gap-filler sheets and pads offer excellent thermal properties and the highest conformability at low clamping forces.
Parker Chomerics' THERM-A-GAP™ GEL T630 unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets.
Parker Chomerics' THERM-A-GAP™ T50 dispensable thermal compound was developed to conduct heat between a hot component and a heat sink or enclosure.
