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SML-E1 Series Datasheet

Rohm Semiconductor

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Datasheet

SML-E1/ENx Series
    
Data Sheet
Features
Outline
EXCELED
TM
Compact, Thin size (1.6×0.8mm, t=0.36mm)
LED die position is middle of package.
LED die consists of 4 elements
Original device technology enables high brightness and high reliability
Size
Dimensions
Recommended Solder Pattern
Specications
Typ. I
F
Max. V
R
Min.
*3
Typ. Max.
*3
I
F
Min. Typ. I
F
(V) (mA) (μA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
2.2 625 630 635 16 40
2.0 619 624 629 36 85
2.2 615 620 625 25 63
2.0
603.5 606.5 609.5
56 150
602 605 608 40 100
587 590 593 25 63
569 572 575 10 25
557 560 563 2.5 6.3
3.0 520 527 535 56 120
464 470 476 14 40
56 120
*EXCELED
TM
is ROHM's pending tradmark.
*1 : Duty 1/5, 200Hz *2 : Duty 1/10, 1kHz *3 : Measurement tolerance:±1nm*4:Brightness for white color is noted with chromaticity coordinate(x,y).
Reverse Current I
R
Dominant Wavelength λ
D
/Chromaticity coordinate(x,y)
Luminous Intensity I
V
Dissipation
T
opr
(ºC) T
stg
(ºC)
54 20 100
*2
-40 +85
-40 +100
Power
Forward Peak Forward
I
FP
(mA)
V
R
(V)
Current
Current
Voltage
P
D
(mW)
I
F
(mA)
Part No.
Chip Structure
Absolute Maximum Ratings (Ta=25ºC)
AlGaInP
-40 +85
5
54
-40 +100
25 60
*1
Reverse
Operating Temp.
Storage Temp.
62 25 60
*1
-30 +85
Emitting
Color
-40 +85
54
20 100
*2
-40 +100
Yellow
-40 +85
10
5
Electrical and Optical Characteristics (Ta=25ºC)
Forward Voltag V
F
InGaN
68
SMLEN3BC8T
SMLEN3WBC8W
*4
SML-E12V8W
SML-E12UW
SML-E12U8W
SML-E12DW
SML-E12D8W
SML-E12Y8W
SML-E12M8W
SML-E12P8W
SMLE13EC8T
Orange
Yellowish green
Red
5
Blue 66 2.9
White 33 10 50
*2
(x,y)(0.30, 0.30)
Green
20
5
20 20
2.2
-30 +85
20 100
*2
-40 +85
62
5
Tolerance : ±0.1 (unit : mm)
1608 (0603)
1.6×0.8mm (t=0.36mm)
Color
Type V U D Y
M P E B WB
0.8
0.85
0.8
0.8
PCB Bonding Direction
(0.13)
0.8
0.36
Electrode
0.65
+0.04
-0.1
0
.
8
1.6
1.2
Pattern R0.275
TH R0.15
Cathode index
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 1/11 2019.3 - Rev.012
    
[Data Sheet]
Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
     Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
[SML-E1/ENx series]
Reference
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 5 10 15 20
SML-E12V8W
SML-E12U8W
SML-E12D8W
SML-E12P8W
SML-E12Y8W
SML-E12M8W
0.4
0.6
0.8
1
1.2
1.4
1.6
-40 -20 0 20 40 60 80 100
1
10
100
1.4 1.6 1.8 2.0 2.2 2.4
SML-E12V8W
SML-E12U8W
SML-E12D8W
SML-E12Y8W
SML-E12M8W
SML-E12P8W
Ta=25ºC
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
IF=20mA
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Ta=25ºC
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
SML-E12V8W
SML-E12U8W
SML-E12D8W
SML-E12Y8W
SML-E12M8W
SML-E12P8W
0
10
20
30
-40 -20 0 20 40 60 80 100
SML
-E12V8W
SML
-E12U8W
SML
-E12D8W
SML
-E12Y8W
SML
-E12M8W
SML
-E12P8W
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 2/11 2019.3 - Rev.012
    
[Data Sheet]
Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
     Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
Reference
[SML-E1/ENx series]
1
10
100
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 5 10 15 20 25
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
-40 -20 0 20 40 60 80 100
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
IF=20mA
ATMOSPHERE TEMPERATURE : Ta [ºC]
RELATIVE LUMINOUS INTENSITY [a.u.]
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
Ta=25ºC
Ta=25ºC
SML-E12UW
SML-E12DW
SML-E12UW
SML-E12DW
0
10
20
30
-40 -20 0 20 40 60 80 100
SML-E12UW
SML-E12DW
SML
-E12UW
SML
-E12DW
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 3/11 2019.3 - Rev.012
    
[Data Sheet]
Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
     Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
Reference
[SML-E1/ENx series]
0
5
10
15
20
25
30
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
3
0 2 4 6 8 10 12 14 16 18 20
0.4
0.6
0.8
1
1.2
1.4
1.6
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
1
10
100
2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4
Ta=25ºC IF=5mA
Ta=25ºC
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
SMLE13EC8T
SMLEN3BC8T
SMLEN3WBC8W
SMLE13EC8T
SMLEN3BC8T
SMLEN3WBC8W
SMLE13EC8T
SMLEN3BC8T
SMLEN3WBC8W
SMLE13EC8T
SMLEN3BC8T
SMLEN3WBC8W
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 4/11 2019.3 - Rev.012
    
[Data Sheet]
Viewing Angle
Reference
[SML-E1/ENx series]
SCANNING ANGLE (deg) SCANNING ANGLE (deg)
RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)
10°
10° 2
2
40°
50°
70°
80°
40°
50°
70°
80°
0 50 10050100
30°
60°
90°
30°
60°
90°
X - Y
X' - Y' 10°
10° 2
2
40°
50°
70°
80°
40°
50°
70°
80°
0 50 10050100
30°
60°
90°
30°
60°
90°
SML-E12x8 series
SML-E12 series
SCANNING ANGLE (deg) SCANNING ANGLE (deg)
RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)
SMLE13EC8T
SCANNING ANGLE (deg)
RELATIVE INTENSITY (%)
SCANNING ANGLE (deg)
RELATIVE INTENSITY (%)
SMLEN3BC8T
SCANNING ANGLE (deg)
RELATIVE INTENSITY (%)
SCANNING ANGLE (deg)
RELATIVE INTENSITY (%)
SMLEN3WBC8W
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 5/11 2019.3 - Rev.012
    
[Data Sheet]
Rank Reference of Brightness*
Chromaticity Diagram
*Measurement tolerance10%
[SML-E1/ENx series]
0.2
0.3
0.4
0.2 0.3 0.4
CIE x
CIE y
A
F
H
K
25If=5mA)
x
y
x
y
x
y
x
y
0.280 0.248 0.283 0.305 0.287 0.295 0.304 0.330
0.296 0.276 0.304 0.330 0.307 0.315 0.330 0.360
0.283 0.305 0.307 0.315 0.311 0.294 0.330 0.318
0.264 0.267 0.287 0.295 0.296 0.276 0.311 0.294
Measurement tolerance : ±0.02
A F H K
Red(V,U)
(Ta=25ºC, IF=20mA)
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
1.01.6 1.62.5 2.54.0 4.06.3 6.310 1016 16〜25 25〜40 40〜63 63〜100
100160 160250 250400 400630
6301000
1000〜1600
Orange(D)
(Ta=25ºC, IF=20mA)
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
1.01.6 1.62.5 2.54.0 4.06.3 6.310 1016 16〜25 25〜40 40〜63 63〜100
100160 160250 250400 400630
6301000
1000〜1600
Yellow(Y)
(Ta=25ºC, IF=20mA)
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
1.01.6 1.62.5 2.54.0 4.06.3 6.310 1016 16〜25 25〜40 40〜63 63〜100
100160 160250 250400 400630
6301000
1000〜1600
Yellowish Green(M,)
(Ta=25ºC, IF=20mA)
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
0.631.0
1.01.6 1.62.5 2.54.0 4.06.3 6.310 10〜16 16〜25 25〜40 40〜63 63〜100
100160 160250 250400 400630
6301000
1000〜1600
Green(P)
(Ta=25ºC, IF=20mA)
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
0.631.0
1.01.6 1.62.5 2.54.0 4.06.3 6.310 10〜16 16〜25 25〜40 40〜63 63〜100
100160 160250 250400 400630
6301000
1000〜1600
GreenE
(Ta=25ºC, IF=5mA)
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
3.65.6 5.69.0 914 1422 2236 3656 56〜90 90〜140
140220 220360 360560 560900
9001400
1400〜2200 2200〜3600
Blue(B)
(Ta=25ºC, IF=5mA)
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
3.65.6 5.69.0 914 1422 2236 3656 56〜90 90〜140
140220 220360 360560 560900
9001400
1400〜2200 2200〜3600
White(WB)
(Ta=25ºC, IF=5mA)
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
3.65.6 5.69.0 914 1422 2236 3656 56〜90 90〜140
140220 220360 360560 560900
9001400
1400〜2200 2200〜3600
SML-E12DW*
SML-E12Y8W
SML-E12P8W
SML-E12UW*
SML-E12D8W
Rank
Iv (mcd)
SMLEN3BC8T
Rank
Iv (mcd)
SMLEN3WBC8W
SMLE13EC8T
Rank
Iv (mcd)
Rank
Iv (mcd)
Rank
Iv (mcd)
Rank
Iv (mcd)
SML-E12M8W
Rank
Iv (mcd)
Rank
Iv (mcd)
SML-E12V8W
SML-E12U8W
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 6/11 2019.3 - Rev.012
    
[Data Sheet]
Taping(T86)
Unit:mm
Note)Tolerance is within ±0.2mm unless
otherwise specified.
Part No. Construction
Packing Specication
ROHM LED products are being shipped with desiccant (silica gel) included in moisture-proof bags.
or enclosing the humidity indication card inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
[SML-E1/ENx series]
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags
8.0
0.5
1.75
3.5
5.5
0~0.5
0.95
4
2
1.85
φ13
11.4
±0.1
±0.05
φ1.5
+0.1
±0.1
±1
φ60
+1
0
φ180
0
-3
±0.05
0
+0.05
-0.03
±0.05
±0.05
Packing quantity
5,000pcs/reel
Pull
direction
*"-"will be taken out for emitting color Special Code will be applied for Chromaticity rank Rank sign
WB/B/E series. Emitting color WB/B/E series. (for white LED (Brightness Rank)*
Series name Package Type Chip type Emitting Color Resin Color Taping Specification
SML
P1 0 V T
E1/EN
1U W
D1
2U2 B
H1
3D
M1
4Y3
01 5Y2 noticeS1 series81 seires
Z1/ZN
6Y
A1 7W
81/82
8
M2
K1 M
*Concerning the Brightness rank.
S1 F
*Please refer to the rank chart above for
P2 P
luminous intensity classification.
52 E
*Part name is individual for each rank.
P34
B
*When shipped as sample,the part name will
P36
WB
be a representative part name.
VN
T
General products are free of ranks.
RGB
Please contact sales if rank appointment
SCM
01
is needed.
3.5x2.8 t=0.6mm
Phototransistors
Red/Green/Blue
Chip LED
3.0x1.5 t=2.2mm
1.3x1.5 t=0.6mm
Green
1.0x1.0 t=0.2mm
Blue
1.5x1.0 t=0.2mm
White
4.5x2.0 t=0.6mm
Yellowish green
3.2x1.6 t=1.85mm
Green
1.0x1.0 t=0.2mm
Green
Black
2.0x1.25 t=0.8mm
Ultra High Brightness type
3.0x2.0 t=1.3mm
3.5x2.8 t=1.9mm
High Brightness type
T86
1.6x1.15 t=0.55mm
T68
3.4x1.25 t=1.1mm
Yellowish green
Yellow
Chip LED
1.0x0.6 t=0.2mm
1.6x0.8 t=0.36mm
1.6x0.8 t=0.55mm
Cathode at sprocket hole side(the top)
Low Current Type
Red
Milkey White
T87
Anode at sprocket hole side(the top)
Red 1 For white LED,
Orange 3
csthode at sprocket hole side
Yellow
Yellow
Yellow
Cathode at sprocket hole side(the back)
6 P
Standard Type
Red
Transparent Colorless
T86
Cathode at sprocket hole side(the top)
2 M 8 W T 81S M L E
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 7/11 2019.3 - Rev.012
    
[Data Sheet]
Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:
Using Conditions
Baking
Bake the product in case of below:
The expiration date is passed.
The color of indicator (silica gel) turned from blue to colorless or from green to pink.
Baking Conditions
Application Methods
Precaution for Drive System and O Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that
please do not apply voltage neither forward nor reverse. Especially, for the products with the
Ag-paste used in the die bonding, theres high possibility to cause electro migration and result
About Derating
 It is considered that derating characteristics will not result in LED chip's electrical destruction.
Even within the derating, the reliability and luminous life can be affected depending on operating
conditions and ambient environment. So we would be appreciate it if you can confirm with your
application again.
About product life
Depending on operating conditions and environment(applied current, ambient temperature and
humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even
within the specification conditions.
Please contact our sales office if you use it for the following applications.
It requires long luminosity life
It is always lit
Applied Stress on Product
No resin hardening agent such as filler is used in the sealing resin of the product.
Therefore, please pay attention to the overstress on it which may influence its reliability.
Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.
Bake products in reel.
Reel and embossed tape are easy to be deformed when baking,
Please storing in the airtight container
[SML-E1/ENx series]
Precaution (Surface Mount Device)
②After opening
package
5〜30℃ Below 70%RH Within 168h
with our desiccant (silica gel)
(Even if the product is within the expiration date.)
60±3℃
12〜24h
Below 20%RH
Remark
so please try not to apply stress on it.
Recommend bake once.
①Before using 5〜30℃ 30〜70%RH
Within 1 year
from Receiving Storage with waterproof package
Expiration Date
Remark
applies on the products. If drive by constant voltage, it may cause current deviation of the LED and
result in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
in function failure.
Temperature
Time
Classification
Temperature
Humidity
Humidity
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©2019 ROHM Co., Ltd. All rights reserved 8/11 2019.3 - Rev.012
    
[Data Sheet]
Others
Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or
alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of
the plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
Therefore, please pay attention to the storage environment for mounted product (concern the
Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged
by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from
human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance
value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.
[SML-E1/ENx series]
the products.
generated gas of the surrounding parts of the products and the atmospheric environment).
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 9/11 2019.3 - Rev.012
    
[Data Sheet]
Stress strength according to
he mounting position:
ABCD
so please pay attention to the touch on product.
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
 and rear electrodes but not for formation of solder llet.
Soldering Pattern for Recommendation
The mechanical stress may damage the LED after Circuit Mounting,
Compare with N2 reow, during air reow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
For our product that has no solder resist, because of its solder amount and soldering conditions,
Do not expose the product in the environment of high temperature (over 100) or rapid temperature
shift (within 3/sec. of temperature gradient) during the flow soldering of surrounding parts.
Please set appropriate reow temperature based on our product usage conditions and specication.
The max for reowing is 2 times, please nish the second reow soldering and ow soldering
with other parts within the usage limitation after open the moistureproof package.
Vibration may result in low mounting rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
to prevent electrostatic charge.
. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.
In case of carrying out flow soldering of surrounding parts without recommended conditions, please
contact us for inquiries.
--. Silicon Resin Sealing Product
The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress
directly on the sealing section.
--. Mini Package (Smaller than 1608 size)
. Mechanical Stress after Mounting
[SML-E1/ENx series]
Mounting
finally has bad influence on the products reliability.
The product is not guaranteed for ow soldering.
. Soldering
No resin hardening agent such as ller is used in the sealing resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress during soldering process and
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
 one of its specic characteristics is that solder will penetrate into LED. Thus, there's high possibility
that will influence its reliability.Therefore, please be informed, concerning it before using it.
. Automatic Mounting
0.8mm
0.85mm
0.8mm
0.8mm
PCB Bonding Direction
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 10/11 2019.3 - Rev.012
    
[Data Sheet]
Ultrasonic Cleaning
15WBelow 1 liter (capacity of tank)
Drying
Under 100 within 3 minutes
furnaces vary by customers own conditions.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
a) Heating method
b)
Handling after
soldering
Please handle after the part temp.
goes down to room temp.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature
Under 30 within 3 minutes
Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
RECOMMENDED CONDITION
400 within 3 sec.
Heating on PCB pattern, not direct to the
LED. (Fig-1)
Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
SOLDER USED
Sn-CuSn-Ag-CuSn-Ag-Bi-Cu
HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
Condition ) Temp. of iron top less than
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
t
L
Retention time for TL
Within 40sec.
T
P
Peak temperature
260(Max)
t
P
Time for peak temperature
Within 10sec.
ΔT
R
/Δt
Temperature rising rate
Under 3/sec.
ΔT
D
/Δt
Temperature decreasing rate
Over -3/sec.
Above conditions are for reference. Therefore, evaluate by customers own circuit boards and
Ts
min
Minimum of pre-heating temperature
140℃
t
s
Time from Tsmin to Tsmax
Over 60sec.
T
L
Reference temperature
230260
[SML-E1/ENx series]
Reow Prole
For reow prole, please refer to the conditions below:()
Meaning of marks, Conditions
Mark
Meanings
Conditions
Ts
max
Maximum of pre-heating temperature
180℃
Fig-1
SOLDERING
LAND
SOLDERING IRON
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Examples of application circuits, circuit constants and any other information contained herein are
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Datasheet
Part Number SMLE13EC8T
Package SML-E1
Unit Quantity 5000
Minimum Package Quantity 5000
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
SMLE13EC8T - Web Page
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